Method for the permanent connection of two components by means of glass or metal solder
View Patent ↗The invention is a method for permanent connection of two components by soldering employing a glass or metal solder as the solder material. A layer system providing adhesion is applied to both components, between which the solder material is introduced. the layer system is heated to a soldering temperature characteristic for the solder material and results in a permanent solder connection between both components after cooling. The layer system providing adhesion has an adhesive layer applicable directly to the component and a solderable layer. The adhesive layer, if a glass solder is used, contains oxidic, carbidic, or nitridic components or mixed compounds thereof and, if a metal solder is used, the adhesive layer contains carbidic or nitridic components or mixed compounds thereof.
1. A method for permanent connection of two components, with at least one of the components comprising an electrically nonconductive material, comprising:
soldering the components with a metal solder by applying a layer system to at least one of the components to provide adhesion to one of the two components, the solder material is applied, indirectly or directly to contact the one component with another component, heating the components to a soldering temperature characteristic for the solder material to provide a permanent soldered connection between the components after cooling, and wherein the layer system providing adhesion comprises an adhesive layer applied directly to the one component and a solderable layer, in which the adhesive layer includes carbidic or nitridic components or mixed compounds thereof and at least one of the components comprises a glass material to which another component comprising stainless steel or glass material is connected.
2. The method according to claim 1 , wherein:
the layer system providing adhesion includes a layer applied to the solderable layer including at least one noble metal, chosen from the group consisting of: Re, Ru, Os, Rh, Ir, Pd, Pt, Ag, Au.
3. The method according to claim 1 , wherein:
the solderable layer of the layer system is applied directly to the adhesive layer.
4. The method according claim 1 , wherein:
the layer system comprises the adhesive layer and the solderable layer, and has a thickness of at least 20 nm.
5. The method according to claim 1 , wherein:
the layer system is produced by CVD, PVD, sputtering, a metal epitaxy method, a wet chemical method, or a galvanic deposition method.
6. The method according to claim 1 , wherein:
the heating of the solder material is performed by local heating of the solder material or by heating of the layer system in its entirety including the components to be connected to one another.
7. The method according to claim 1 , wherein:
the layer material is a solderable material comprising at least one of the following metals: Ni, Cu, Ti, Zr, Fe, Pd, Ni, Cr, Au, Sn, Pb.