IP Library › Granted Patent US 7,935,964
Granted Patent B2
US 7,935,964 · App. 12/213,327 · Granted May 3, 2011

Oxide semiconductors and thin film transistors comprising the same

Assignee: Samsung Electronics Co., Ltd.
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Quick Facts
Patent No.
US 7,935,964
App. No.
12/213,327
Granted
May 3, 2011
Kind
B2
Abstract

Oxide semiconductors and thin film transistors (TFTs) including the same are provided. An oxide semiconductor includes Zn atoms and at least one of Hf and Cr atoms added thereto. A thin film transistor (TFT) includes a channel including an oxide semiconductor including Zn atoms and at least one of Hf and Cr atoms added thereto.

Claims (26)

1. An oxide semiconductor layer comprising Zn and Hf, wherein the oxide semiconductor layer is an amorphous oxide semiconductor channel region.

2. The oxide semiconductor layer of claim 1 , wherein the Zn is a Zn oxide to which Hf is added.

3. The oxide semiconductor layer of claim 1 , wherein the Zn is a Zn—In composite oxide to which Hf is added.

4. The oxide semiconductor layer of claim 3 , wherein an at % ratio of Hf:In:Zn is in the range of about 0.5 to 10:1 to 20:0.5 to 40, inclusive.

5. The oxide semiconductor layer of claim 3 , wherein an at % ratio of Hf:In:Zn is in the range of about 1:9 to 19:4.8 to 14, inclusive.

6. The oxide semiconductor layer of claim 1 , wherein a structure of the oxide semiconductor layer includes an amorphous phase region and crystalline phase region.

7. The oxide semiconductor layer of claim 6 , wherein a structure of the oxide semiconductor layer includes an amorphous phase region, a mixed region of amorphous and crystalline phases and a crystalline phase region.

8. The oxide semiconductor layer of claim 7 , wherein a thickness of the amorphous phase region is in the range of about 10 nm to about 50 nm, inclusive.

9. The oxide semiconductor layer of claim 7 , wherein a thickness of the amorphous phase region is in the range of about 20 nm to about 30 nm, inclusive.

10. The oxide semiconductor layer of claim 1 , further comprising: at least one selected from the group consisting of elements of Groups I, II, III and IV and elements belonging to the lanthanide series.

11. The semiconductor oxide of claim 1 , wherein the Zn is one of a Zn oxide and an InZn composite oxide, and the Hf is ionically bonded to oxygen of the Zn oxide or InZn composite oxide.

12. An oxide thin film transistor comprising:

a gate; a channel formed to correspond to the gate, the channel comprising an oxide semiconductor comprising Zn and Hf, wherein the oxide semiconductor is an amorphous oxide semiconductor; a gate insulating layer formed between the gate and the channel; and a source and drain contacting respective sides of the channel.

13. The oxide thin film transistor of claim 12 , wherein the oxide semiconductor includes a Zn oxide to which Hf is added.

14. The oxide thin film transistor of claim 12 , wherein the oxide semiconductor includes a Zn—In composite oxide to which Hf is added.

15. The oxide thin film transistor of claim 14 , wherein the channel has an at % ratio of Hf:In:Zn in the range of about 0.5 to 10:1 to 20:0.5 to 40, inclusive.

16. The oxide thin film transistor of claim 14 , wherein the oxide semiconductor has an at % ratio of Hf:In:Zn in the range of about 1:7 to 19:4.8 to 14, inclusive.

17. The oxide thin film transistor of claim 12 , wherein the channel has a structure including an amorphous phase region and crystalline phase region.

18. The oxide thin film transistor of claim 17 , wherein a thickness of the amorphous phase region is in the range of about 10 to about 50 nm, inclusive.

19. The oxide thin film transistor of claim 17 , wherein a thickness of the amorphous phase region is in the range of about 20 to about 30 nm, inclusive.

20. The oxide thin film transistor of claim 12 , wherein the channel includes an amorphous phase region, a mixed region of amorphous and crystalline phases and a crystalline phase region.

21. The oxide thin film transistor of claim 12 , wherein the channel further includes,

at least one selected from the group consisting of elements of Groups I, II, III and IV and elements belonging to the lanthanide series.

22. The oxide thin film transistor of claim 12 , wherein the Zn is one of a Zn oxide and an InZn composite oxide, and the Hf is ionically bonded to oxygen of the Zn oxide or InZn composite oxide.

23. A display comprising:

the oxide thin film transistor according claim 12 as at least one of a driving and switching transistor.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jun 18, 2008
From: KIM, CHANG-JUNG; LEE, EUN-HA; PARK, YOUNG-SOO; PARK, JAE-CHUL
To: SAMSUNG ELECTRONICS CO., LTD.
Reel/Frame 021180/0395 →
Priority Claims (2)
KR 10-2007-0060053 · Jun 19, 2007 · national
KR 10-2007-0126376 · Dec 6, 2007 · national
Continuity (1)
Related Publication 20080315200A1 · Dec 25, 2008