Cooling system for electronic structural units
Cooling systems ( 1 ) suitable for cooling an electronic unit ( 2 ) or assembly. The cooling system is provided with a cooling channel ( 6 ). An electronic unit ( 2 ) rests over a heat-conducting cooler wall ( 7 ). A coolant guide apparatus ( 11 ) is provided in the cooling channel ( 6 ) and has insert conduit elements ( 13 ) for guiding the coolant onto the cooler wall indentations ( 12 ). The end of each insert conduit ( 13 ) opening to the cooling channel ( 6 ) may be provided with an inclined entry surface ( 19 ) and an inlet opening ( 20 ) towards the inner longitudinal channel ( 14 ). A plurality of such coolant guides ( 11 ) may be arranged in series so that, for example, the same cooling medium flows through a plurality of semiconductor modules in succession.
1. A cooling system for an electronic structural unit, comprising:
a housing;
a cooling channel in said housing, said cooling channel having an inlet, said cooling channel having an outlet;
a heat-conducting cooler wall located on a first side of said channel;
a plurality of indentations in said cooler wall, said indentations open from said channel;
a first coolant guide spanning said cooling channel, said coolant guide having an inclined entry surface member;
said inclined entry surface member having a leading edge upstream towards said channel inlet, said leading edge contacting said first side of said channel on which said heat-conducting wall is located;
said inclined entry surface member having a trailing edge downstream towards said channel outlet, said trailing edge contacting another side of said channel opposite to said first side;
said inclined entry surface member spanning said cooling channel transversely and having a plurality of inclined inlet openings, said inlet openings having respective insert conduits associated therewith; and,
said insert conduits depending from said inclined inlet openings at an angle bringing them into alignment with said plurality of indentations in said cooler wall, said insert conduits respectively being inserted into respective indentations so that respective insert conduits pass coolant flow from said cooling channel into respective indentations.
2. A cooling system for an electronic structural unit as claimed in claim 1 , further comprising;
said insert conduits having respective inner longitudinal channels;
respective outer longitudinal channels formed between said insert conduits and the respective indentations into which said insert conduits are inserted; and,
said inner longitudinal channels and said insert conduits being configured to pass coolant flow from said cooling channel inlet to said cooling channel outlet via said indentations in said cooler wall.
3. The cooling system for an electronic structural unit as claimed in claim 2 , wherein:
said outer longitudinal channels each have the form of a respective annular gap.
4. The cooling system for an electronic structural unit as claimed in claim 2 , wherein:
said outer longitudinal channels have smaller cross-sectional areas than said inner longitudinal channels.
5. The cooling system for an electronic structural unit as claimed in claim 2 , wherein:
said insert conduits have a polygonal circumferential profile.
6. The cooling system for an electronic structural unit as claimed in claim 1 , wherein:
said plurality of inclined openings are arranged in offset relative to one another.
7. The cooling system for an electronic structural unit as claimed in claim 1 , wherein:
said plurality of indentations in said cooler wall each have the form of a respective perpendicular blind bore.
8. A cooling system for an electronic structural unit as claimed in claim 1 , further comprising:
a bevel portion at said leading edge of said inclined entry surface member.
9. A cooling system for an electronic structural unit as claimed in claim 1 , further comprising:
stiffening ribs on a bottom side of said inclined entry surface member.
10. A cooling system for an electronic structural unit as claimed in claim 1 , further comprising:
a second coolant guide situated in series with said first coolant guide to receive coolant exhausted from said indentations.
11. A cooling system for an electronic structural unit, comprising:
a housing;
a cooling channel in said housing, said cooling channel having an inlet, said cooling channel having an outlet;
a heat-conducting cooler wall located on a first side of said channel;
a plurality of indentations in said cooler wall, said indentations open from said channel;
a first coolant guide spanning said cooling channel, said coolant guide having an inclined entry surface member;
said inclined entry surface member having a leading edge upstream towards said channel inlet, said leading edge contacting said first side of said channel on which said heat-conducting wall is located;
said inclined entry surface member having a trailing edge downstream towards said channel outlet, said trailing edge contacting another side of said channel opposite to said first side;
said inclined entry surface member spanning said cooling channel transversely and having a plurality of inflow channels, said inflow channels having a varying wall height increasing in the direction from said leading edge to said trailing edge;
a plurality of inlet openings, said inlet openings located at bottoms of said inflow channels; and,
respective insert conduits associated with said inlet openings, said insert conduits disposed at an angle relative to said inclined entry surface member that brings the insert conduits into alignment with said plurality of indentations in said cooler wall, said insert conduits respectively being inserted into respective indentations so that respective insert conduits pass coolant flow from said cooling channel into respective indentations.
12. The cooling system for an electronic structural unit as claimed in claim 11 , wherein:
said inflow channels are arranged in parallel.
13. The cooling system for an electronic structural unit as claimed in claim 12 , wherein:
said inlet openings are arranged in offset relative to one another, in adjacent ones of said parallel inflow channels.
14. A cooling system for an electronic structural unit as claimed in claim 11 , further comprising:
a bevel portion at said leading edge of said inclined entry surface member.
15. The cooling system for an electronic structural unit as claimed in claim 14 , wherein:
said coolant guide is a unitary plastic piece that includes said entry surface member, said inflow channels, said openings, said insert conduits, and said bevel portion.
16. A cooling system for an electronic structural unit as claimed in claim 11 , further comprising:
a second coolant guide situated in series with said first coolant guide to receive coolant exhausted from said indentations.
17. A coolant guide for an electronic structural unit cooling system, comprising:
an inclined entry surface member;
said inclined entry surface member having a leading edge, and said inclined entry surface having a trailing edge;
said inclined entry surface member having a plurality of inflow channels, said inflow channels having a varying wall height increasing in the direction from said leading edge to said trailing edge;
a plurality of inlet openings, said inlet openings located at bottoms of said inflow channels; and,
respective insert conduits associated with said inlet openings, said insert conduits disposed at an angle relative to said inclined entry surface member.
18. The coolant guide for an electronic structural unit cooling system as claimed in claim 17 , wherein:
said inflow channels are arranged in parallel; and,
said inlet openings are arranged in offset relative to one another, in adjacent ones of said parallel inflow channels.
19. A coolant guide for an electronic structural unit cooling system as claimed in claim 17 , further comprising:
a bevel portion at said leading edge of said inclined entry surface member.
20. A coolant guide for an electronic structural unit cooling system, comprising:
an entry surface plate member;
said entry surface plate member having a leading edge, and said entry surface plate member having a trailing edge;
said entry surface plate member having a plurality of inclined inlet openings extending therethrough, said inclined inlet openings having respective insert conduits associated therewith;
said insert conduits depending from a bottom side of said entry surface plate, at an angle relative to said entry surface plate member;
said insert conduits are arranged in respective parallel rows;
respective stiffening ribs run between the insert conduits of a respective parallel row.
21. The coolant guide for an electronic structural unit cooling system as claimed in claim 20 , wherein:
said inlet openings and said insert conduits are arranged in offset relative to one another, in adjacent ones of said respective parallel rows.
22. The coolant guide for an electronic structural unit cooling system as claimed in claim 20 , wherein:
said stiffening ribs have a varying height increasing in the direction from said leading edge to said trailing edge.