Array molded package-on-package having redistribution lines
A semiconductor device with a sheet-like insulating substrate ( 101 ) integral with two or more patterned layers of conductive lines and vias, a chip attached to an assembly site, and contact pads ( 103 ) in pad locations has an encapsulated region on the top surface of the substrate, extending to the edge of the substrate, enclosing the chip, and having contact apertures ( 703 ) at the pad locations for external communication with the pad metal surfaces. The apertures may have not-smooth sidewall surfaces and may be filled with solder material ( 704 ) to contact the pads. Metal-filled surface grooves ( 710 ) in the encapsulated region, with smooth groove bottom and sidewalls, are selected to serve as customized routing interconnections, or redistribution lines, between selected apertures and thus to facilitate the coupling with another semiconductor device to form a package-on-package assembly.
1. An apparatus comprising:
a sheet-like insulating substrate integral with two or more patterned layers of conductive lines and vias, the substrate having a first surface with a chip assembly site and contact pads in pad locations and a second surface;
a semiconductor chip attached to the assembly site;
an encapsulated region on the first surface, extending to the edge of the substrate, enclosing the chip and having contact apertures at the pad locations, the apertures having not-smooth sidewall surfaces; and
metal-filled surface grooves in the encapsulated region as routing interconnections between selected apertures, the grooves having smooth sidewall and bottom surfaces.
2. The apparatus according to claim 1 further having elongated gas release channels.
3. The apparatus according to claim 1 further having solder material in the contact apertures to the pads, contacting the pad metal surfaces.
4. The apparatus according to claim 1 further including another semiconductor device with solder balls attached to the first substrate surface so that the pad surfaces are contacted by the solder balls, creating a package-on-package semiconductor assembly.
5. The apparatus according to claim 1 wherein the not-smooth aperture sidewall surfaces include compound particles from a laser process.
6. The apparatus according to claim 1 wherein the not-smooth aperture sidewalls have a plasma-roughened surface.
7. The apparatus according to claim 1 wherein the not-smooth aperture sidewall surfaces have etch structures from a chemical etch process.
8. The apparatus according to claim 1 further including solder balls attached to the second substrate surface.
9. The apparatus according to claim 1 wherein the semiconductor chip is a stack of two or more semiconductor chips.
10. The apparatus according to claim 1 wherein the semiconductor chip is attached to the substrate by wire bonding.
11. The apparatus according to claim 1 wherein the semiconductor chip is attached to the substrate by a flip-chip process.
12. The apparatus according to claim 1 further including additional electrical components attached to adjacent metal-filled surface grooves.
13. The apparatus according to claim 12 wherein the electrical components are passive components.
14. The apparatus according to claim 1 further including a plastic surface film made of heat-tolerant material.