Silicone resin composition for die bonding

1. A silicone resin composition for die bonding, comprising:

(A) a straight-chain dimethylpolysiloxane with both terminals blocked with dimethylvinylsiloxy groups, and having formula (4):

Vi(R 6 ) 2 SiO[Si(R 6 ) 2 O] e Si(R 6 ) 2 Vi

wherein each R 6 represents, independently, a methyl group, Vi represents a vinyl group, and e is an integer which provides the straight-chain dimethylpolysiloxane of formula (4) with a viscosity at 25° C. of 5 to 700 mPa·s

(B) a three dimensional network organopolysiloxane resin that is in the form of a gum with a viscosity at 23° C. of at least 10,000,000 mPa·s or solid at 23° C., and is at least one selected from the group consisting of:

(Me 3 SiO 1/2 ) l (ViMe 2 SiO 1/2 ) m (SiO 4/2 ) s ,

wherein Me represents a methyl group, Vi represents a vinyl group, and l, m and s are numbers that satisfy 0.65≧1≧0.392, 0.65≧m≧0.052, 0.6≧s≧0.2, and l+m+s=1;

(ViMeSiO) n (Me 2 SiO) p (MeSiO 3/2 ) r ,

wherein Me represents a methyl group, Vi represents a vinyl group, and n, p and r are numbers that satisfy 0.5≧n≧0.2, 0.5≧p≧0.15, 0.6≧r≧0.2, and n+p+r=1;

and

(ViMe 2 SiO 1/2 ) m (Me 2 SiO) p (MeSiO 3/2 ) r ,

wherein Me represents a methyl group, Vi represents a vinyl group, and m, p and r are numbers that satisfy 0.65≧m≧0.2, 0.5≧p≧0.2, 0.6≧r≧0.2, and m+p+r=1;

in sufficient quantity to provide from 60 to 90 parts by mass of component (B) per 100 parts by mass of a combination of said component (A) and said component (B),

(C) an organohydrogenpolysiloxane having at least 2 hydrogen atoms bonded to silicon atoms within each molecule, represented by the general formula (8) shown below:

Me 3 SiO[SiMe(H)O] t SiMe 3   (8)

wherein Me represents a methyl group, t represents an integer from 2 to 30, in sufficient quantity to provide from 0.5 to 5.0 mols of hydrogen atoms bonded to silicon atoms within component (C) for every 1 mol of silicon atom-bonded alkenyl groups within a combination of said component (A) and said component (B), and

(D) an effective quantity of a platinum-group metal-based catalyst.

2. The composition according to claim 1 , wherein a Shore D hardness value of a cured product produced by curing said composition is at least 30.

3. A die bonding method comprising the steps of:

applying a composition according to claim 1 on a substrate to form a layer of the composition on the substrate,

providing a light-emitting element on the composition layer, and

curing the composition layer, whereby the light-emitting element is bonded to the substrate.

4. A cured die bonding material formed by curing a composition according to claim 1 between a light-emitting element and a substrate.

5. The composition according to claim 1 , wherein the organohydrogenpolysiloxane (C) is present in an amount to provide from 1.12 to 5.0 mols of hydrogen atoms bonded to silicon atoms for every one mol of silicon atom-bonded alkenyl group.

6. The composition according to claim 1 , wherein the organohydrogenpolysiloxane (C) is present in an amount to provide from 1.38 to 5.0 mols of hydrogen atoms bonded to silicon atoms for every one mol of silicon atom-bonded alkenyl groups.

7. A cured composition obtained by curing the composition of claim 1 .

8. The cured composition of claim 7 , having a Shore D hardness of 50 or higher.

9. The cured composition of claim 7 , having a Shore D hardness of 54 or higher.

10. The composition according to claim 1 , wherein the three dimensional network-type organopolysiloxane resin (B) is present in an amount of from 65 to 75 parts by mass per 100 parts by mass of the combination of the straight-chain organopolysiloxane (A) and the three dimensional network-type organopolysiloxane resin (B).

11. The composition according to claim 1 , wherein the three dimensional network-type organopolysiloxane resin is at least one selected from the group consisting of (Me 3 SiO 1/2 ) 0.4 (ViMe 2 SiO 1/2 ) 0.1 (SiO 4/2 ) 0.5 , (ViMeSiO) 0.4 (Me 2 SiO) 0.15 (MeSiO 3/2 ) 0.45 , and (ViMe 2 SiO 1/2 ) 0.2 (Me 2 SiO) 0.25 (MeSiO 3/2 ) 0.55 ;

wherein Me is a methyl group and Vi is a vinyl group.

12. The composition according to claim 1 , wherein the organohydrogenpolysiloxane has at least three hydrogen atoms bonded to silicon atoms.

13. The composition according to claim 1 , wherein the platinum-group metal-based catalyst is a silicone-modified chloroplatinic acid.

14. The composition according to claim 1 , wherein the component (B) contains (SiO 4/2 ) units as an essential unit.

15. The composition according to claim 1 , wherein the blend quantity of the component (B) is within a range from 65 to 90 parts by mass per 100 parts by mass of the combination of the component (A) and the component (B).

16. The composition according to claim 1 , wherein the three dimensional network-type organopolysiloxane resin of the component (B) is at least one selected from the group consisting of:

(Me 3 SiO 1/2 ) l (ViMe 2 SiO 1/2 ) m (SiO 4/2 ) s ,

wherein Me represents a methyl group, Vi represents a vinyl group, and l, m and s are numbers that satisfy 0.4≧1≧0.392, 0.1≧m≧0.052, 0.6≧s≧0.5, and 1+m+s=1,

(ViMeSiO) n (Me 2 SiO) p (MeSiO 3/2 ) r ,

wherein Me represents a methyl group, Vi represents a vinyl group, and n, p and r are numbers that satisfy 0.4≧n≧0.2, 0.5≧p≧0.2, 0.6≧r≧0.45, and n+p+r=1,

and

(ViMe 2 SiO 1/2 ) m (Me 2 SiO) p (MeSiO 3/2 ) r ,

wherein Me represents a methyl group, Vi represents a vinyl group, and m, p and r are numbers that satisfy 0.25≧m≧0.2, 0.25≧p≧0.2, 0.6≧r≧0.55, and m+p+r=1.

17. The composition according to claim 1 , wherein the three dimensional network-type organopolysiloxane resin of the component (B) is at least one selected from the group consisting of:

(Me 3 SiO 1/2 ) l (ViMe 2 SiO 1/2 ) m (SiO 4/2 ) s ,

wherein Me represents a methyl group, Vi represents a vinyl group, and l, m and s are numbers that satisfy 0.4≧l≧0.392, 0.1≧m≧0.052, 0.6≧s≧0.5, and l+m+s=1.