Circuit board structure and fabrication method thereof
A circuit board structure and fabrication method thereof are disclosed, including: a circuit board with a circuit layer thereon; a reactant formed on the surface of the circuit layer, wherein the reactant is an organic metallic polymer having a polymer end and a metal ion end; and a dielectric layer formed above the reactant and the circuit board, thus forming a metallic bond between the metal ion end of the reactant and the circuit layer and forming a chemical bond between the polymer end of the reactant and the dielectric layer. Owing to enhanced bonding between the dielectric layer and the circuit board, electrical performance of the circuit board structure is improved, and the demand for fine circuits is met.
1. A circuit board structure, comprising:
a circuit board with a circuit layer thereon;
a reactant layer formed on the circuit layer so as to cover top and side surfaces of the circuit layer, wherein the reactant layer comprises an organic metallic polymer having a polymer end and a metal ion end; and
a dielectric layer formed on the reactant layer and the circuit board so as to form a metallic bond between the metal ion end of the reactant layer and the circuit layer and form a chemical bond between the polymer end of the reactant layer and the dielectric layer, thereby strengthening the bonding force between the dielectric layer and the circuit board; said circuit layer has a plurality of electrically connecting pads, and at least an opening is formed in the dielectric layer to expose the reactant layer on surfaces of the electrically connecting pads.
2. The circuit board structure of claim 1 , wherein the circuit layer is made of one selected from the group consisting of Au, Ag, Cu, Fe, Pd, Pb, Sn, Bi, Sb, Zn, Ni, Zr, Mg, In, Te, and Ga.
3. The circuit board structure of claim 1 , wherein the circuit layer has a micro-rough surface.
4. The circuit board structure of claim 1 , wherein the metal ion end comprises one selected from the group consisting of Au, Ag, Cu, Fe, Pd, Pb, Sn, Zn, and Ni.
5. The circuit board structure of claim 1 , wherein the polymer end is one selected from the group consisting of long carbon chain, benzene ring, and carbocyclic ring.
6. The circuit board structure of claim 1 , wherein the dielectric layer is a solder mask layer.
7. A fabrication method of a circuit board structure, comprising:
providing a circuit board with a circuit layer thereon;
forming a reactant layer formed on the circuit layer so as to cover top and side surfaces of the circuit layer, wherein the reactant layer comprises an organic metallic polymer having a polymer end and a metal ion end; and
forming a dielectric layer on the reactant layer and the circuit board, forming a metallic bond between the metal ion end of the reactant layer and the circuit layer, forming a chemical bond between the polymer end of the reactant layer and the dielectric layer, so as to strengthen the bonding force between the dielectric layer and the circuit board; said circuit layer has a plurality of electrically connecting pads, and at least an opening is formed in the dielectric layer to expose the reactant layer on surfaces of the electrically connecting pads.
8. The method of claim 7 , wherein the circuit layer is made of one selected from the group consisting of Au, Ag, Cu, Fe, Pd, Pb, Sn, Bi, Sb, Zn, Ni, Zr, Mg, In, Te, and Ga.
9. The method of claim 7 further comprising performing micro-etch pretreatment on the circuit layer so as to form a micro-rough surface on the circuit layer, and then forming the reactant on the micro-rough surface of the circuit layer.
10. The method of claim 7 , wherein the metal ion end comprises one selected from the group consisting of Au, Ag, Cu, Fe, Pd, Pb, Sn, Zn, and Ni.
11. The method of claim 7 , wherein the polymer end is one selected from the group consisting of long carbon chain, benzene ring, and carbocyclic ring.
12. The method of claim 7 , wherein the dielectric layer is a solder mask layer.