IP Library › Granted Patent US 7,978,522
Granted Patent B2
US 7,978,522 · App. 12/416,477 · Granted Jul 12, 2011

Flash memory device including a dummy cell

Assignee: Samsung Electronics Co., Ltd.
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Quick Facts
Patent No.
US 7,978,522
App. No.
12/416,477
Granted
Jul 12, 2011
Kind
B2
Abstract

A non-volatile memory device includes a selection transistor coupled to a bit line. The device also includes a plurality of memory cells serially coupled to the selection transistor and at least one dummy cell located between the plurality of memory cells. The dummy cell is turned off during a programming operation of a memory cell located between the dummy cell and the selection transistor.

Claims (28)

1. A non-volatile memory device, comprising:

a selection transistor coupled to a bit line;

a plurality of memory cells serially coupled to the selection transistor; and

at least one dummy cell disposed between the plurality of memory cells, the at least one dummy cell being turned off during a programming operation of a memory cell located between the dummy cell and the selection transistor.

2. The non-volatile memory device as set forth in claim 1 , wherein the dummy cell is programmed to a highest threshold voltage state among a plurality of programmable threshold voltage states of the plurality of memory cells.

3. The non-volatile memory device as set forth in claim 1 , wherein the bit line is supplied with a source voltage during the programming operation.

4. The non-volatile memory device as set forth in claim 3 , wherein a gate of the dummy cell is supplied with a blocking voltage during the programming operation, the blocking voltage being lower than a pass voltage.

5. The non-volatile memory device as set forth in claim 1 , wherein a gate of the dummy cell is configured to be in a voltage float state during an erase operation.

6. The non-volatile memory device as set forth in claim 1 , wherein, after an erase operation, the dummy cell is programmed to a highest threshold voltage state among a plurality of programmable threshold voltage states of the plurality of memory cells.

7. The non-volatile memory device as set forth in claim 1 , wherein the dummy cell is configured to be turned-on during a programming operation of a memory cell which is not located between the dummy cell and the selection transistor.

8. A non-volatile memory device, comprising:

a selection transistor coupled to a bit line;

a plurality of memory cells serially coupled to the selection transistor; and

at least one dummy cell disposed between the plurality of memory cells, the at least one dummy cell being selectively turned-off according to a location of a programmed one of the plurality of memory cells during a programming operation.

9. The non-volatile memory device as set forth in claim 8 , wherein the dummy cell is turned off when the programmed memory cell is located between the dummy cell and the selection transistor.

10. The non-volatile memory device as set forth in claim 8 , wherein the dummy cell is turned on when the programmed memory cell is located between the dummy cell and the selection transistor and adjacent to the dummy cell.

11. The non-volatile memory device as set forth in claim 8 , wherein the dummy cell is turned on when the programmed memory cell is not located between the dummy cell and the selection transistor.

12. The non-volatile memory device as set forth in claim 8 , wherein the dummy cell is programmed to a highest threshold voltage state among a plurality of programmable threshold voltage states of the plurality of memory cells.

13. The non-volatile memory device as set forth in claim 12 , wherein the dummy cell is turned on by application of a pass voltage.

14. The non-volatile memory device as set forth in claim 13 , wherein the dummy cell is turned off by application of a blocking voltage, the blocking voltage being lower than a pass voltage.

15. The non-volatile memory device as set forth in claim 8 , wherein the dummy cell includes at least two cell transistors.

16. The non-volatile memory device as set forth in claim 8 , wherein a gate of the dummy cell is configured to be in a voltage float state during an erase operation.

17. The non-volatile memory device as set forth in claim 8 , wherein, after an erase operation, the dummy cell is programmed to a highest threshold voltage state among a plurality of programmable threshold voltage states of the plurality of memory cells.

18. A method for programming a non-volatile memory device, comprising:

floating the channel of a program inhibited cell string; and

boosting the floated channel into a plurality of channel areas, the plurality of channel areas being separated from the floated channel by turning off a dummy cell located between a plurality of memory cells of the cell string.

19. The method of claim 18 , wherein the dummy cell is programmed to a highest threshold voltage state among a plurality of programmable threshold voltage states of the plurality of memory cells.

20. The method of claim 18 , wherein the dummy cell is supplied with a blocking voltage when boosting the floated channel into a plurality of channel areas, the blocking voltage being lower than a pass voltage.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 1, 2009
From: KANG, HEE-SOO; CHOI, DONG-UK; LEE, CHOONG-HO; KANG, SANG-GU
To: SAMSUNG ELECTRONICS CO., LTD.
Reel/Frame 022485/0438 →
Priority Claims (2)
KR 2006-0002310 · Jan 9, 2006 · national
KR 2008-0036195 · Apr 18, 2008 · national
Continuity (2)
Continuation In Part 11523571 · Sep 20, 2006
Related Publication 20090180317A1 · Jul 16, 2009