IP Library Granted Patent US 7,985,482
Granted Patent B2
US 7,985,482 · App. 12/144,260 · Granted Jul 26, 2011

Stiffener sheet and flexible printed circuit board using the same

Assignee: Foxconn Advanced Technology Inc.
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Quick Facts
Patent No.
US 7,985,482
App. No.
12/144,260
Granted
Jul 26, 2011
Kind
B2
Abstract

A stiffener sheet for flexible printed flexible printed circuit boards, includes alternately laminated polyimide layers and polyamideimide layers, wherein a molecular structure of the polyamideimide is represented by the following formula: wherein Ar and Ar′ represents different substituted aromatic groups.

Claims (14)

1. A stiffener sheet for a flexible printed circuit board, comprising: a plurality of polyimide layers and a plurality of polyamideimide layers, the polyimide layers and the polyamideimide layers alternately stacked one on another, wherein a molecular structure of the polyamideimide is represented by the following formula:

wherein Ar and Ar′ represent different substituted aromatic groups.

2. The stiffener sheet as claimed in claim 1 , wherein the number of the polyimide layers is equal to the number of the polyamideimide layers.

3. A stiffened flexible printed circuit board, comprising:

a flexible printed circuit board comprising a contact surface; and

a stiffener sheet attached on the contact surface, wherein the stiffener sheet comprising a plurality of polyimide layers and a plurality of polyamideimide layers, the polyimide layers and the polyamideimide layers alternately stacked one on another, wherein a molecular structure of the polyamideimide being represented by the following formula:

wherein Ar and Ar′ represent different substituted aromatic groups.

4. The stiffened flexible printed circuit board as claimed in claim 3 , wherein the number of the polyimide layers is equal to the number of the polyamideimide layers.

5. The stiffened flexible printed circuit board as claimed in claim 3 , further comprising an adhesive layer sandwiched between the stiffener sheet and the flexible printed circuit board.

6. The stiffened flexible printed circuit board as claimed in claim 5 , wherein the adhesive layer is comprised of polyamideimide.

7. A stiffened flexible printed circuit board, comprising:

a flexible printed circuit board; and

a stiffener sheet attached to the flexible printed circuit board, wherein the stiffener sheet comprising a plurality of polyimide layers and a plurality of polyamideimide layers, wherein a molecular structure of the polyamideimide being represented by the following formula:

wherein Ar and Ar′ represent different substituted aromatic groups.

Assignments (3)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 17, 2017
From: ZHEN DING TECHNOLOGY CO., LTD.
To: GARUDA TECHNOLOGY CO., LTD
Reel/Frame 040978/0704 →
CHANGE OF NAME Recorded Sep 13, 2011
From: FOXCONN ADVANCED TECHNOLOGY INC.
To: ZHEN DING TECHNOLOGY CO., LTD.
Reel/Frame 026891/0100 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jun 23, 2008
From: LAI, YUNG-WEI; KUO, CHENG-WEI; LIOU, SHING-TZA
To: FOXCONN ADVANCED TECHNOLOGY INC.
Reel/Frame 021136/0347 →
Priority Claims (1)
TW 97105339 A · Feb 15, 2008 · national
Continuity (1)
Related Publication 20090205855A1 · Aug 20, 2009