IP Library Granted Patent US 7,988,908
Granted Patent B2
US 7,988,908 · App. 12/709,548 · Granted Aug 2, 2011

Filler metal alloy compositions

Assignee: Korea Bundy Co., Ltd.
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Quick Facts
Patent No.
US 7,988,908
App. No.
12/709,548
Granted
Aug 2, 2011
Kind
B2
Abstract

Provided is a filler metal alloy composition capable of improving appearance of a welded zone and fluidity, penetration, etc., of an inexpensive filler metal by minimizing a content of silver (Ag) and adding tin (Sn) and silicon (Si) components. The filler metal alloy composition, brazed to a joint between parent metals to stably join the parent metals formed of the same material or different materials, is characterized in that the composition comprises silver (Ag), copper (Cu), zinc (Zn), tin (Sn), silicon (Si), and other unavoidable impurities.

Claims (2)

1. A filler metal alloy composition brazed to a joint between parent metals to stably join the parent metals formed of the same material or different materials, characterized in that the composition comprises silver (Ag), copper (Cu), zinc (Zn), tin (Sn), silicon (Si), and other unavoidable impurities, wherein the filler metal alloy composition comprises 20 to 24 wt % Ag, 36 to 45 wt % Cu, 29 to 37 wt % Zn, 1 to 3 wt % Sn, 0.1 to 0.4 wt % Si, and other unavoidable impurities.

2. The filler metal alloy composition according to claim 1 , wherein the filler metal alloy composition comprises 22 wt % Ag, 41 to 45 wt % Cu, 30 to 32 wt % Zn, 2 wt % Sn, 0.2 wt % Si, and other unavoidable impurities.

Assignments (3)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 31, 2025
From: SEAH FS CO, LTD.
To: SEAH FSI CO.LTD.
Reel/Frame 070675/0142 →
CHANGE OF NAME Recorded Feb 13, 2025
From: KOREA BUNDY CO., LTD
To: SEAH FS CO, LTD.
Reel/Frame 070631/0516 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 22, 2010
From: LEE, DONG HA; PARK, JAE JUNG; KANG, CHUNG YUN; KIM, MYUNG BOK
To: KOREA BUNDY CO., LTD
Reel/Frame 023967/0258 →
Priority Claims (1)
KR 10-2009-0084665 · Sep 8, 2009 · national
Continuity (1)
Related Publication 20110058980A1 · Mar 10, 2011