IP Library › Granted Patent US 7,989,030
Granted Patent B2
US 7,989,030 · App. 12/375,436 · Granted Aug 2, 2011

Silicone resin and silicone composition

Assignee: Dow Corning Corporation
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Quick Facts
Patent No.
US 7,989,030
App. No.
12/375,436
Granted
Aug 2, 2011
Kind
B2
Abstract

A silicone resin containing boron, aluminum, and/or titanium, and having silicon-bonded branched alkoxy groups; a silicone composition containing a silicone resin; and a method of preparing a coated substrate comprising applying a silicone composition on a substrate to form a film and pyrolyzing the silicone resin of the film.

Claims (16)

1. A silicone resin having the formula:

(EO s/2 ) t (HSiO 3/2 ) v ((R 1 O) 3 SiO 1/2 )) w ((R 1 O) 2 SiO 2/2 )) x (R 1 OSiO 3/2 ) y (SiO 4/2 ) z   (I),

wherein each E is independently an atom selected from B, Al, and Ti; R 1 is C 1 to C 10 branched alkyl; s=3 when E is B or Al, or s=4 when E is Ti; t is from 0.01 to 0.8; v is from 0 to 0.99; w is from 0 to 0.99; x is from 0 to 0.99; y is from 0 to 0.99; z is from 0 to 0.8; w+x+y=0.01 to 0.99; and t+v+w+x+y+z=1.

2. The silicone resin according to claim 1 , wherein E is boron.

3. The silicone resin according to claim 1 , wherein the silicone resin contains from 20 to 105 mol % of silicon-bonded hydroxy groups.

4. A silicone composition comprising:

(A) a silicone resin having the formula (EO s/2 ) t (HSiO 3/2 ) v ((R 1 O) 3 SiO 1/2 )) w ((R 1 O) 2 SiO 2/2 )) x (R 1 OSiO 3/2 ) y (SiO 4/2 ) z (I), wherein each E is independently an atom selected from B, Al, and Ti; R 1 is C 1 to C 10 branched alkyl; s=3 when E is B or Al, or s=4 when E is Ti; t is from 0.01 to 0.8; v is from 0 to 0.99; w is from 0 to 0.99; x is from 0 to 0.99; y is from 0 to 0.99; z is from 0 to 0.8; w+x+y=0.01 to 0.99; and t+v+w+x+y+z=1; and

(B) an organic solvent.

5. The silicone composition according to claim 4 , wherein E is boron.

6. The silicone composition according to claim 4 , further comprising a hydrogen silsesquioxane resin.

7. A method of preparing a coated substrate, the method comprising:

applying a silicone composition on a substrate to form a film, wherein the silicone composition comprises (A) a silicone resin having the formula (EO s/2 ) t (HSiO 3/2 ) v ((R 1 O) 3 SiO 1/2 )) w ((R 1 O) 2 SiO 2/2 )) x (R 1 OSiO 3/2 ) y (SiO 4/2 ) z (I), wherein each E is independently an atom selected from B, Al, and Ti; R 1 is C 1 to C 10 branched alkyl; s=3 when E is B or Al, or s=4 when E is Ti; t is from 0.01 to 0.8; v is from 0 to 0.99; w is from 0 to 0.99; x is from 0 to 0.99; y is from 0 to 0.99; z is from 0 to 0.8; w+x+y=0.01 to 0.99; and t+v+w+x+y+z=1, and (B) an organic solvent; and

pyrolyzing the silicone resin of the film.

8. The method according to claim 7 , wherein E is boron.

9. The method according to claim 7 , wherein the step of pyrolyzing is carried out in an atmosphere of an inert gas.

10. The method according to claim 7 , wherein the step of pyrolyzing is carried out at a temperature of from 350 to 800° C.

Continuity (2)
Provisional Application 60835656 · Aug 4, 2006
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