IP Library Granted Patent US 7,994,599
Granted Patent B2
US 7,994,599 · App. 11/993,888 · Granted Aug 9, 2011

Device for the detection of electromagnetic waves and method for producing such a device

Assignee: MEAS Deutschland GmbH
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Quick Facts
Patent No.
US 7,994,599
App. No.
11/993,888
Granted
Aug 9, 2011
Kind
B2
Abstract

Device for the detection of electromagnetic waves with a first plate that contains a membrane and a detector structure fixed at least partially to the membrane, a second plate attached to the first plate, at least one contact point for surface mount technology on the first and/or second plate, whereby in a connection line between the detector structure and the contact point is at least partially led through the first and/or the second plate and that this connection line is at least partially prepared by film deposition and/or plating.

Claims (52)

1. A device for the detection of electromagnetic waves, said device comprising:

a first plate having a membrane and a detector structure fixed at least partially to the membrane;

a second plate attached to the first plate;

at least one contact point for surface mount technology on the first and/or second plate; and

a connection line arranged between the detector structure and the contact point and at least partially led through the first and/or the second plate, wherein the connection line is at least partially prepared by film deposition and/or plating;

wherein the second plate is penetrable by electromagnetic waves to be measured.

2. The device of claim 1 , wherein the first and second plates are attached to each other at their facing surfaces.

3. The device of claim 1 , wherein the detector structure includes at least one thermocouple.

4. The device of claim 1 , wherein the detector structure includes an array of at least two detectors, with each of the detectors including at least one thermocouple.

5. The device of claim 1 , wherein the detection structure is configured as a surface mount device (SMD)-structure.

6. The device of claim 1 , wherein at least one of the first and second plates contains a semi-conductor substrate.

7. The device of claim 1 , wherein the second plate contains means for influencing a wave-path of the electromagnetic waves.

8. The device of claim 1 , wherein an outward facing side of the device is at least partially coated with a material reflective for electromagnetic waves.

9. The device of claim 1 , wherein an outward facing side of the device is at least partially coated with a material absorptive for electromagnetic waves.

10. The device of claim 1 , constructed to shield the detector structure from electric and/or magnetic fields.

11. The device of claim 1 , further comprising an ASIC (Application-Specific Integrated Circuit) connected to at least one of the first and second plates.

12. The device of claim 1 , wherein the first plate includes a temperature sensor arranged separately from the detector structure.

13. A device for the detection of electromagnetic waves, said device comprising:

a first plate having a membrane and a detector structure fixed at least partially to the membrane, wherein the membrane at least partially borders a first closed cavity in the first plate; and

a second plate attached to the first plate, said second plate having a second closed cavity, with the membrane at least partially bordering the second cavity;

wherein the second plate is penetrable by electromagnetic waves to be measured.

14. The device of claim 13 , further comprising a connection line arranged between the detector structure and a contact point for surface mount technology on the first and/or second plate, said connection line being at least partially led through the first and/or the second plate, said connection line being at least partially prepared by film deposition and/or plating.

15. The device of claim 13 , wherein the membrane is at least partially arranged at a backside of the first plate, and the detector structure is at least partially fixed to the membrane on the backside of the first plate.

16. The device of claim 13 , wherein the first and second plates are attached to each other at their facing surfaces.

17. The device of claim 13 , wherein the detector structure includes at least one thermocouple.

18. The device of claim 13 , wherein the detector structure includes an array of at least two detectors, with each of the detectors including at least one thermocouple.

19. The device of claim 13 , wherein the detection structure is configured as a surface mount device (SMD)-structure.

20. The device of claim 13 , further comprising a third plate closing one of the first and second cavities.

21. The device of claim 13 , wherein at least one of the first and second plates contains a semi-conductor substrate.

22. The device of claim 20 , wherein the third plate contains a semi-conductor substrate.

23. The device of claim 20 , wherein at least one of the first, second and third plates contains a semi-conductor layer.

24. The device of claim 20 , wherein the first, second and third plates contain a same semi-conductor substrate.

25. The device of claim 24 , wherein at least one of the first, second and third plates contains silicon.

26. The device of claim 20 , wherein at least one of the first and third plates is penetrable by electromagnetic waves to be measured.

27. The device of claim 13 , wherein the second plate contains means for influencing a wave-path of the electromagnetic waves.

28. The device of claim 13 , wherein an outward facing side of the device is at least partially coated with a material reflective for electromagnetic waves.

29. The device of claim 13 , wherein an outward facing side of the device is at least partially coated with a material absorptive for electromagnetic waves.

30. The device of claim 13 , constructed to shield the detector structure from electric and/or magnetic fields.

31. The device of claim 13 further comprising a fluid connection between the first cavity and the second cavity.

32. The device of claim 20 , further comprising an ASIC (Application-Specific Integrated Circuit) connected to at least one of the first, second and third plates.

33. The device of claim 13 , wherein the first plate includes a temperature sensor arranged separately from the detector structure.

34. A method for producing a device for the detection of electromagnetic waves, with the device including a first plate having a membrane and a detector structure fixed at least partially to the membrane, and a second plate attached to the first plate, said method comprising the steps of:

producing at least one of the first and second plates as part of a first and a second wafer;

attaching the first and second wafers to each other to form a wafer-sandwich; and

singulating the device out of the wafer-sandwich;

wherein the second plate is penetrable by electromagnetic waves to be measured.

35. The method of claim 34 , further comprising the step of bonding two wafers to each other by a process selected from the group consisting of silicon-bonding, anodic bonding, eutectic bonding, and bonding with polymers.

36. A method for producing a device for the detection of electromagnetic waves, with the device including a first plate having a membrane and a detector structure fixed at least partially to the membrane, a second plate attached to the first plate, and a third plate closing a cavity of one of the first and second plates, said method comprising the steps of:

producing at least one of the first, second and third plates as part of a wafer;

attaching the first, second and third plates to each other; and singulating the device out of the wafer;

wherein the second plate is penetrable by electromagnetic waves to be measured.

37. The method of claim 36 , further comprising the step of bonding two wafers to each other by a process selected from the group consisting of silicon-bonding, anodic bonding, eutectic bonding, and bonding with polymers.

Assignments (2)
CHANGE OF NAME Recorded Sep 10, 2010
From: HL PLANARTECHNIK GMBH
To: MEAS DEUTSCHLAND GMBH
Reel/Frame 024970/0884 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 10, 2008
From: HERRNSDORF, JOHANNES; STUTE, GEORG; ROESSINGER, STEFAN ANDREAS; WINTERFELDT, JOACHIM; ENDERLEIN, DIRK
To: HL-PLANAR TECHNIK GMBH
Reel/Frame 021222/0037 →
Continuity (1)
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