IP Library Granted Patent US 7,997,812
Granted Patent B2
US 7,997,812 · App. 11/997,551 · Granted Aug 16, 2011

Camera module

Assignee: LG Innotek Co., Ltd.
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Quick Facts
Patent No.
US 7,997,812
App. No.
11/997,551
Granted
Aug 16, 2011
Kind
B2
Abstract

A camera module is provided with a lens part including a lens and a lens barrel, a holder coupled with the lens part and formed with a first conductive layer, and a printed circuit board electrically connected to the first conductive layer while supporting the holder.

Claims (33)

1. A camera module comprising:

a sensor part comprising a lens part comprising a lens and a lens barrel, a holder coupled with the lens part, a first printed circuit board disposed with an image sensor while supporting the holder, and a first conductive layer formed on the first printed circuit board;

a second printed circuit board connected to the sensor part; and

a connector connected to the second printed circuit board,

wherein the second printed circuit board is a flexible printed circuit board and comprises a second conductive layer, and the connector comprises a third conductive layer,

wherein the first printed circuit board extends under the holder.

2. The camera module according to claim 1 , wherein a grounding area is formed at least one of the first printed circuit board, the second printed circuit board and the connector.

3. The camera module according to claim 1 , wherein at least one of the conductive layers is electrically grounded.

4. A camera module comprising:

a lens part comprising a lens, a lens barrel, and an actuator;

a holder coupled with the lens part, in which a first conductive layer is formed on a surface of the holder;

a printed circuit board electrically connected to the first conductive layer while supporting the holder;

a boss pin integrally formed with the holder at a lower portion of the holder, wherein the boss pin is coupled with the printed circuit board to fix the holder to the printed circuit board; and

a second conductive layer formed on a surface of the boss pin.

5. The camera module according to claim 4 , comprising a third conductive layer formed on the lens part.

6. The camera module according to claim 4 , comprising a grounding area electrically connected to the first conductive layer, and formed on the printed circuit board.

7. The camera module according to claim 6 , wherein the grounding area is not formed with solder resist.

8. The camera module according to claim 4 , comprising a cap formed at an outer portion of both the lens part and the holder.

9. The camera module according to claim 8 , comprising a socket disposed at a lower portion of the printed circuit board, and coupled with the cap to support the cap.

10. The camera module according to claim 8 , wherein a groove is formed in at least a portion of the holder, and a protrusion is formed in at least a portion of the cap corresponding to the groove.

11. The camera module according to claim 4 , comprising a fourth conductive layer formed at a lower portion of the printed circuit board.

12. A camera module comprising:

a lens part comprising a lens and a lens barrel;

a holder coupled with the lens part and provided with an IR blocking filter;

a printed circuit board supporting the holder; and

a cap including a conductive material and configured to surround outer surfaces of the lens part and the holder,

wherein a first side surface of the holder faces a second side surface of the cap, wherein one of the first side surface and the second side surface includes a protrusion and the other of the first side surface and the second side surface includes a groove, and

wherein the cap is coupled to the outer surface of the holder by the protrusion inserted into the groove.

13. The camera module according to claim 12 , wherein the protrusion is formed on the cap.

14. The camera module according to claim 12 , wherein the protrusion is provided in plural.

15. The camera module according to claim 12 , wherein one of the lens part and the holder includes a conductive material on outer peripheral surface.

16. The camera module according to claim 15 , wherein the printed circuit board includes a grounding hole and the holder includes a boss pin, wherein the boss pin is inserted into the grounding hole and the conductive material is grounded.

17. The camera module according to claim 12 , wherein the holder is coupled to the printed circuit board through a conductive epoxy.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 12, 2008
From: KIM, MIN SOO
To: LG INNOTEK CO., LTD.
Reel/Frame 020493/0424 →
Priority Claims (5)
KR 10-2006-0079490 · Aug 22, 2006 · national
KR 10-2006-0123737 · Dec 7, 2006 · national
KR 10-2007-0031304 · Mar 30, 2007 · national
KR 10-2007-0032166 · Apr 2, 2007 · national
KR 10-2007-0035811 · Apr 12, 2007 · national
Continuity (1)
Related Publication 20100158508A1 · Jun 24, 2010