IP Library Granted Patent US 7,999,350
Granted Patent B2
US 7,999,350 · App. 12/205,935 · Granted Aug 16, 2011

Electrode structure of memory capacitor

Assignee: Industrial Technology Research Institute
View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 7,999,350
App. No.
12/205,935
Granted
Aug 16, 2011
Kind
B2
Abstract

After a fabrication process intended to miniaturize semiconductor devices, a surface area of a stack capacitor in a random access memory (RAM) is significantly reduced and capacity thereof is thus decreased, which in turn causes the capacitor not able to function properly. The present invention provides a composite lower electrode structure consisting of an exterior annular pipe and a central pillar having concave-convex surfaces to increase a surface area of the capacitor within a limited memory cell so as to enhance the capacity. To reinforce intensity of a structure of the capacitor, the exterior annular pipe has an elliptic radial cross section and a thicker thickness along a short axis direction.

Claims (16)

1. An electrode structure of a memory capacitor, comprising:

a lower electrode, consisting of an exterior annular pipe and a central pillar, the exterior annular pipe having an elliptic radial cross section, wherein a thickness along a short axis direction of the exterior annular pipe is larger than a thickness along a long axis direction perpendicular to the short axis direction of the exterior annular pipe;

a dielectric layer, covering the lower electrode; and

an upper electrode, covering the dielectric layer.

2. The electrode structure of the memory capacitor as claimed in claim 1 , wherein an internal surface and an external surface of the exterior annular pipe is concave-convex.

3. The electrode structure of the memory capacitor as claimed in claim 2 , wherein the internal surface and the external surface of the exterior annular pipe are undulated or square-wavy.

4. The electrode structure of the memory capacitor as claimed in claim 1 , wherein an external surface of the central pillar is concave-convex.

5. The electrode structure of the memory capacitor as claimed in claim 4 , wherein an external surface of the central pillar is undulated or square-waved.

6. The electrode structure of the memory capacitor as claimed in claim 1 , wherein the lower electrode has a base electrode electrically connecting the exterior annular pipe and the central pillar.

7. The electrode structure of the memory capacitor as claimed in claim 1 , adapted to a random access memory (RAM).

8. An electrode structure of a memory capacitor, comprising:

a lower electrode, having a plurality of first electrode materials and second electrode materials alternately stacked on top of each other, an internal surface and an external surface of the lower electrode being concave-convex, wherein the lower electrode consists of an exterior annular pipe and a central pillar formed by the first electrode materials and the second electrode materials, a radial cross section of the exterior annular pipe is elliptic, and a thickness along a short axis direction of the exterior annular pipe is larger than a thickness along a long axis direction perpendicular to the short axis direction of the exterior annular pipe;

a dielectric layer, covering the lower electrode; and

an upper electrode, covering the dielectric layer.

9. The electrode structure of the memory capacitor as claimed in claim 8 , wherein the central pillar is a column or an elliptic pillar.

10. The electrode structure of the memory capacitor as claimed in claim 8 , wherein the first electrode materials and the second electrode materials are electrode materials having different etching rates.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 19, 2008
From: LU, SU-TSAI; CHEN, WEN-HWA; CHENG, HSIEN-CHIE; CHEN, YUN-CHIAO
To: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
Reel/Frame 021553/0139 →
Priority Claims (1)
TW 97107733 A · Mar 5, 2008 · national
Continuity (1)
Related Publication 20090224362A1 · Sep 10, 2009