Method and apparatus for mask pellicle adhesive residue cleaning
Aspects of the invention generally provide methods and apparatus for cleaning adhesive residual on a photomask substrate. In one embodiment, the apparatus includes a processing cell, a support assembly configured to receive a photomask substrate disposed thereon disposed in the processing cell, a protection head assembly disposed above and facing the support assembly, and a head actuator configured to control the elevation of the protection head assembly relative to an upper surface of the support assembly. A cleaning device is provided and positioned to interact with the photomask substrate disposed on the support assembly. In another embodiment, a method of cleaning a periphery region of a photomask substrate includes providing a photomask substrate having a periphery portion and a center portion disposed on a support assembly in a processing cell, lowering a protection cover disposed in the processing cell to cover the center portion of the photomask substrate, providing a brush in the processing cell to clean the periphery portion of the photomask substrate.
1. An apparatus for cleaning a photomask substrate, comprising:
a processing cell;
a support assembly configured to receive a photomask substrate disposed thereon disposed in the processing cell;
a protection head assembly disposed above and facing the support assembly, wherein the protection head assembly includes a protection head coupled to a gas source, wherein the protection head is configured to cover a center region of the photomask substrate disposed on the support assembly configured to receive a gas supplied from the gas source;
a head actuator configured to control the elevation of the protection head assembly relative to an upper surface of the support assembly; and
a cleaning device positioned to interact with the photomask substrate disposed on the support assembly.
2. The apparatus of claim 1 , wherein the cleaning device comprises:
a process fluid delivery system configured to direct fluid to the upper surface of the support assembly.
3. The apparatus of claim 1 , wherein the cleaning device comprises:
a brush positioned at an edge of the support assembly.
4. The apparatus of claim 3 further comprising:
an actuator coupled to the brush.
5. The apparatus of claim 2 further comprising:
a nozzle coupled to the process fluid delivery system.
6. The apparatus of claim 1 , wherein the cleaning device comprises:
a light source disposed in the processing cell adjacent to the support assembly.
7. The apparatus of claim 6 , wherein the light source positioned to direct radiation to an edge of the support assembly.
8. The apparatus of claim 6 , wherein the light sources generates UV light or laser to the photomask substrate.
9. The apparatus of claim 2 , wherein the process fluid delivery system provides process fluid to the processing cell, wherein the process fluid is selected from a group consisting of ozonized DI water, solvent, isopropyl alcohol (IPA) and methanol.
10. The apparatus of claim 1 , further comprising:
a sealing ring coupled to an edge of the protection head.
11. An apparatus of cleaning a periphery region of a photomask substrate, comprising:
a processing cell;
a support assembly configured to receive a photomask substrate disposed thereon disposed in the processing cell, wherein the support assembly has a periphery region and a center region to receive a periphery region and a center region of the photomask substrate respectively;
a protection head assembly disposed above and facing the support assembly, wherein the protection head assembly includes a protection head coupled to a gas source, wherein the protection head is configured to cover the center region of the photomask substrate configured to receive a gas supplied from the gas source;
a head actuator configured to control the elevation of the protection head assembly relative to an upper surface of the support assembly; and
a cleaning device positioned to interact with the photomask substrate disposed on the support assembly.
12. The apparatus of claim 11 , wherein the cleaning device comprises:
a process fluid delivery system configured to direct fluid to the upper surface of the support assembly.
13. The apparatus of claim 1 , wherein the cleaning device further comprises:
a brush positioned at an edge of the support assembly configured to brush the periphery region of the photomask substrate during processing.
14. The apparatus of claim 11 , wherein the cleaning device comprises:
a light source disposed in the processing cell adjacent to the support assembly.
15. The apparatus of claim 11 , wherein the cleaning device comprises:
a megasonic energy source coupled to the support assembly.
16. The apparatus of claim 11 , wherein the protection head has a width that substantially covers the center portion of the photomask substrate.
17. The apparatus of claim 11 , wherein the periphery portion of the photomask substrate has a width of between about 5 percent and about 16 percent of the length of the photomask substrate.
18. A method of cleaning a periphery region of a photomask substrate, comprising:
providing a photomask substrate having a periphery portion and a center portion disposed on a support assembly in a processing cell;
lowering a protection cover coupled to a gas source disposed in the processing cell to cover the center portion of the photomask substrate;
supplying a gas mixture from the gas source to the center portion of the photomask substrate; and
providing a brush in the processing cell to clean the periphery portion of the photomask substrate.
19. The method of claim 18 further comprising:
supplying a cleaning fluid from the brush to the periphery portion of the photomask substrate.
20. The method of claim 18 further comprising:
providing a radiation to the photomask substrate while cleaning the photomask substrate.
21. The method of claim 18 further comprising:
rotating the brush.
22. The method of claim 18 further comprising:
moving the brush along the periphery portion of the photomask substrate.
23. The method of claim 18 further comprising:
providing a megasonic energy to the photomask substrate.
24. The method of claim 18 further comprising:
rotating the support assembly while cleaning.