IP Library › Granted Patent US 8,008,648
Granted Patent B2
US 8,008,648 · App. 12/509,299 · Granted Aug 30, 2011

Memristors with insulation elements and methods for fabricating the same

Assignee: Hewlett-Packard Development Company, L.P.
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Quick Facts
Patent No.
US 8,008,648
App. No.
12/509,299
Filed
Jul 24, 2009
Granted
Aug 30, 2011
Kind
B2
Art Unit
2894
USPC
257/14
Abstract

Embodiments of the present invention are directed to nanoscale memristor devices that provide nonvolatile memristive switching. In one embodiment, a memristor device comprises an active region disposed between a first electrode and a second electrode. The device includes a first insulation element disposed between the first electrode and an outer portion of a first surface of the active region. The first insulation element is configured with one or more opening through which the first electrode makes physical contact with the active region. The device also includes a second insulation element disposed between the second electrode and an outer portion of a second surface of the active region. The second insulation element is configured with one or more opening through which the second electrode makes physical contact with the second surface.

Claims (11)

1. A memristor device comprising:

an active region disposed between a first electrode and a second electrode;

a first insulation element disposed between the first electrode and an outer portion of a first surface of the active region, the first insulation element configured with one or more openings through which the first electrode makes physical contact with the active region; and

a second insulation element disposed between the second electrode and an outer portion of a second surface of the active region, the second insulation element configured with one or more openings through which the second electrode makes physical contact with the second surface.

2. The memristor of claim 1 wherein the first surface of the active region further comprises one or more protrusions that fit within the one or more openings of the first insulation element and establishes physical contact between the active region and the first electrode.

3. The memristor of claim 1 wherein the second surface of the active region further comprises one or more protrusions that fit within the one or more openings of the second insulation element and establishes physical contact between the active region and the second electrode.

4. The memristor of claim 1 wherein the first electrode further comprises one or more protrusions that fit within the one or more openings of the first insulation element and establishes physical contact between the active region and the first electrode.

5. The memristor of claim 1 wherein the second electrode further comprises one or more protrusions that fit within the one or more openings of the second insulation element and establishes physical contact between the active region and the second electrode.

6. The memristor of claim 1 wherein the one or more opening further comprises at least of one of: a square, a rectangle, a circle, an ellipse, an irregular shape, or any other suitable shape.

7. The memristor of claim 1 wherein the active region further comprise a primary active region and a secondary active region, wherein the secondary active region is a source of dopants for the primary active region.

8. The memristor of claim 1 wherein the first electrode and the second electrode are selected from a group consisting of platinum, gold, copper, tungsten, or any other suitable metal, metallic compound or semiconductor materials.

Assignments (2)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Nov 9, 2015
From: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
To: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP
Reel/Frame 037079/0001 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 25, 2009
From: BRATKOVSKI, ALEXANDRE M.; XIA, QIANGFEI
To: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
Reel/Frame 023009/0008 →
Continuity (1)
Related Publication 20110017977A1 · Jan 27, 2011