Semiconductor thin film and method of manufacturing the same and semiconductor device and method of manufacturing the same
View Patent ↗A thin film semiconductor transistor structure has a substrate with a dielectric surface, and an active layer made of a semiconductor thin film exhibiting a crystallinity as equivalent to the single-crystalline. To fabricate the transistor, the semiconductor thin film is formed on the substrate, which film includes a mixture of a plurality of crystals which may be columnar crystals and/or capillary crystal substantially parallel to the substrate. The resultant structure is then subject to thermal oxidation in a chosen atmosphere containing halogen, thereby removing away any metallic element as contained in the film. This may enable formation of a mono-domain region in which the individual columnar or capillary crystal is in contact with any adjacent crystals and which is capable of being substantially deemed to be a single-crystalline region without presence or inclusion of any crystal grain boundaries therein. This region is for use in forming the active layer of the transistor.
1. A semiconductor device comprising:
a substrate;
a semiconductor film formed on and in contact with an insulating layer over the substrate;
a first insulating film on the semiconductor film;
a gate electrode over the first insulating film;
a metal-silicide film on the gate electrode;
a side wall insulator on a side surface of the gate electrode; and
a second insulating film in contact with the side wall insulator and an upper surface of the metal-silicide film,
wherein a thickness of the first insulating film is 2 to 6 nm, and
wherein a bottom surface of the side wall insulator is in contact with an upper surface of the first insulating film.
2. The semiconductor device according to claim 1 , further comprising an LDD region in the semiconductor film, the LDD region being overlapped with the side wall insulator.
3. The semiconductor device according to claim 1 , wherein the semiconductor film is a mono-domain crystalline semiconductor film.
4. The semiconductor device according to claim 1 , wherein the first insulating film is a thermal oxide film.
5. The semiconductor device according to claim 1 , wherein a the gate electrode comprises polycrystalline silicon.
6. The semiconductor device according to claim 1 , wherein the side wall insulator is made of silicon oxide or silicon nitride.
7. A semiconductor device comprising:
a substrate;
a semiconductor film formed on and in contact with an insulating layer over the substrate;
a first insulating film on the semiconductor film;
a gate electrode over the first insulating film;
a side wall insulator on a side surface of the gate electrode;
a source region and a drain region in the semiconductor film;
a first metal-silicide film on the source region, a second metal-silicide film on the drain region and a third metal-silicide film on the gate electrode; and
a second insulating film in contact with the side wall insulator and an upper surface of the third metal-silicide film,
wherein a thickness of the first insulating film is 2 to 6 nm, and
wherein a bottom surface of the side wall insulator is in contact with an upper surface of the first insulating film.
8. The semiconductor device according to claim 7 , further comprising an LDD region in the semiconductor film, the LDD region being overlapped with the side wall insulator.
9. The semiconductor device according to claim 7 , wherein the semiconductor film is a mono-domain crystalline semiconductor film.
10. The semiconductor device according to claim 7 , wherein the first insulating film is a thermal oxide film.
11. The semiconductor device according to claim 7 , wherein the gate electrode comprises polycrystalline silicon.
12. The semiconductor device according to claim 7 , wherein the side wall insulator is made of silicon oxide or silicon nitride.
13. The semiconductor device according to claim 7 , wherein the first metal-silicide film, the second metal-silicide film and the third metal-silicide film are selected from the group consisting of a titanium-silicide film, a tantalum-silicide film, a tungsten-silicide film and a molybdenum-silicide film.
14. A semiconductor device comprising:
a substrate;
a semiconductor film formed on and in contact with an insulating layer over the substrate;
a first insulating film on the semiconductor film;
a gate electrode over the first insulating film;
a side wall insulator on a side surface of the gate electrode;
a source region and a drain region in the semiconductor film;
a first metal-silicide film on the source region, a second metal-silicide film on the drain region and a third metal-silicide film on the gate electrode;
a second insulating film in contact with the side wall insulator and an upper surface of the third metal-silicide film; and
a first wiring electrically connected with the source region through the first metal-silicide film, a second wiring electrically connected with the drain region through the second metal-silicide film and a third wiring electrically connected with the gate electrode through the third metal-silicide film,
wherein a thickness of the first insulating film is 2 to 6 nm.
15. The semiconductor device according to claim 14 , further comprising an LDD region in the semiconductor film, the LDD region being overlapped with the side wall insulator.
16. The semiconductor device according to claim 14 , wherein the semiconductor film is a mono-domain crystalline semiconductor film.
17. The semiconductor device according to claim 14 , wherein the first insulating film is a thermal oxide film.
18. The semiconductor device according to claim 14 , wherein the gate electrode comprises polycrystalline silicon.
19. The semiconductor device according to claim 14 , wherein the side wall insulator is made of silicon oxide or silicon nitride.
20. The semiconductor device according to claim 14 , wherein the first metal-silicide film, the second metal-silicide film and the third metal-silicide film are selected from the group consisting of a titanium-silicide film, a tantalum-silicide film, a tungsten-silicide film and a molybdenum-silicide film.
21. The semiconductor device according to claim 14 , wherein the second insulating film is a silicon oxide film.
22. A method of manufacturing a semiconductor device comprising:
forming a semiconductor film on and in contact with an insulating layer over a substrate;
forming a first insulating film of 2 to 6 nm thick on the semiconductor film;
forming a gate electrode over the first insulating film;
forming a side wall insulator on a side surface of the gate electrode;
forming a metal-silicide film on the gate electrode;
forming a second insulating film over the gate electrode and the side wall insulator wherein the second insulating film is in contact with an upper surface of the metal-silicide film; and
forming a source region and a drain region in the semiconductor film by doping an impurity to the semiconductor film with the use of the gate electrode and the side wall insulator as a mask,
wherein a bottom surface of the side wall insulator is in contact with an upper surface of the first insulating film.
23. The method of manufacturing the semiconductor device according to claim 22 , further comprising forming an LDD region in the semiconductor film, the LDD region being overlapped with the side wall insulator.
24. The method of manufacturing the semiconductor device according to claim 22 , wherein the semiconductor film is a mono-domain crystalline semiconductor film.
25. The method of manufacturing the semiconductor device according to claim 22 , wherein the first insulating film is a thermal oxide film.
26. The method of manufacturing the semiconductor device according to claim 22 , wherein the gate electrode comprises polycrystalline silicon.
27. The method of manufacturing the semiconductor device according to claim 22 , wherein the side wall insulator is made of silicon oxide or silicon nitride.
28. A method of manufacturing a semiconductor device comprising:
forming a semiconductor film on and in contact with an insulating layer over a substrate;
forming a first insulating film of 2 to 6 nm thick on the semiconductor film;
forming a gate electrode over the first insulating film;
forming a metal-silicide film on the gate electrode;
forming a side wall insulator on a side surface of the gate electrode;
forming a second insulating film over the gate electrode and the side wall insulator wherein the second insulating film is in contact with an upper surface of the metal-silicide film;
forming a source region and a drain region in the semiconductor film by doping an impurity to the semiconductor film with the use of the gate electrode and the side wall insulator as a mask; and
forming metal-silicide films on the source region, the drain region and the gate electrode by heating,
wherein a bottom surface of the side wall insulator is in contact with an upper surface of the first insulating film.
29. The method of manufacturing the semiconductor device according to claim 28 , further comprising forming an LDD region in the semiconductor film, the LDD region being overlapped with the side wall insulator.
30. The method of manufacturing the semiconductor device according to claim 28 , wherein the semiconductor film is a mono-domain crystalline semiconductor film.
31. The method of manufacturing the semiconductor device according to claim 28 , wherein the first insulating film is a thermal oxide film.
32. The method of manufacturing the semiconductor device according to claim 28 , wherein the gate electrode comprises polycrystalline silicon.
33. The method of manufacturing the semiconductor device according to claim 28 , wherein the side wall insulator is made of silicon oxide or silicon nitride.
34. The method of manufacturing the semiconductor device according to claim 28 , wherein the metal-silicide films are selected from the group consisting of a titanium-silicide film, a tantalum-silicide film, a tungsten-silicide film and a molybdenum-silicide film.
35. A method of manufacturing a semiconductor device comprising:
forming a semiconductor film on and in contact with an insulating layer over a substrate;
forming a first insulating film of 2 to 6 nm thick on the semiconductor film;
forming a gate electrode over the first insulating film;
forming a side wall insulator on a side surface of the gate electrode;
forming a source region and a drain region in the semiconductor film by doping an impurity to the semiconductor film with the use of the gate electrode and the side wall insulator as a mask;
forming a first metal-silicide film on the source region, a second metal-silicide film on the drain region and a third metal-silicide film on the gate electrode;
forming a second insulating film over the semiconductor film, the gate electrode and the side wall insulator wherein the second insulating film is in contact with an upper surface of the third metal-silicide film; and
forming a first wiring electrically connected with the source region through the first metal-silicide film, a second wiring electrically connected with the drain region through the second metal-silicide film and a third wiring electrically connected with the gate electrode through the third metal-silicide film.
36. The method of manufacturing the semiconductor device according to claim 35 , further comprising forming an LDD region in the semiconductor film, the LDD region being overlapped with the side wall insulator.
37. The method of manufacturing the semiconductor device according to claim 35 , wherein the semiconductor film is a mono-domain crystalline semiconductor film.
38. The method of manufacturing the semiconductor device according to claim 35 , wherein the first insulating film is a thermal oxide film.
39. The method of manufacturing the semiconductor device according to claim 35 , wherein the gate electrode comprises polycrystalline silicon.
40. The method of manufacturing the semiconductor device according to claim 35 , wherein the side wall insulator is made of silicon oxide or silicon nitride.
41. The method of manufacturing the semiconductor device according to claim 35 , wherein the first metal-silicide film, the second metal-silicide film and the third metal-silicide film are selected from the group consisting of a titanium-silicide film, a tantalum-silicide film, a tungsten-silicide film and a molybdenum-silicide film.
42. The method of manufacturing the semiconductor device according to claim 35 , wherein the second insulating film is a silicon oxide film.