Dimensional control in electroforms

1. A method comprising:

placing a conductive mold in a first bath of electroforming solution, the solution comprising metal and having a selected temperature;

providing a current to the electroforming solution so that metal deposits onto the mold, thereby forming an electroformed element on the mold, the electroformed element and the mold being a composite assembly;

removing the composite assembly from the electroforming solution;

transferring the composite assembly to a second bath having the same selected temperature; and

separating the electroformed element from the mold while the composite assembly is in the second bath.

2. The method of claim 1 wherein the second bath comprises deionized water.

3. The method of claim 1 further comprising rinsing the composite assembly with a fluid having the same selected temperature prior to the transfer step.

4. The method of claim 3 wherein the fluid comprises deionized water.

5. The method of claim 3 wherein the rinsing comprises spraying.

6. The method of claim 1 wherein the step of forming an electroformed element on the mold comprises forming the electroformed element on top of the mold.

7. The method of claim 6 wherein the transfer step further comprises flipping the composite assembly so that the electroformed element is under the mold in the second bath of water.

8. The method of claim 1 wherein the mold comprises a plurality of bores, the method further comprising masking off each of the plurality of bores to prevent metal deposition therein.

9. The method of claim 8 wherein a plurality of bores are provided on a border disposed about a perimeter of the mold.

10. The method of claim 9 wherein a plurality of bores are further provided between arrays of structured elements on the mold.

11. The method of claim 1 wherein the separating step comprises gradually advancing a plurality of separation mechanisms to push the electroformed element away from the mold.

12. The method of claim 11 wherein the plurality of separation mechanisms are advanced simultaneously.

13. The method of claim 11 wherein the plurality of separation mechanisms are advanced serially.

14. The method of claim 11 wherein a separation mechanism comprises a screw.

15. The method of claim 1 wherein the selected temperature is between 46° C. and 60° C.

16. The method of claim 1 wherein the selected temperature is about 55° C.

17. The method of claim 1 wherein the metal is nickel.

18. A method comprising:

providing a conductive mold comprising a plurality of bores and masking off each of the plurality of bores;

placing the mold in a first bath of electroforming solution, the solution comprising metal and having a selected temperature;

providing a current to the electroforming solution so that metal deposits onto the mold, thereby forming an electroformed element on the mold, the electroformed element and the mold being a composite assembly;

removing the composite assembly from the electroforming solution;

spraying the composite assembly with a fluid having the same selected temperature;

transferring the composite assembly to a second bath of fluid having the same selected temperature; and

separating the electroformed element from the mold while the composite assembly is in the second bath, wherein the separating step comprises gradually advancing a plurality of separation mechanisms through at least some of the plurality of bores in the mold to push the electroformed element away from the mold.

19. The method of claim 18 wherein the separating step further comprises advancing one of the separation mechanisms through each one of the bores in the mold.

20. The method of claim 18 wherein the step of forming the electroformed element on the mold comprises forming the electroformed element on top of the mold, and wherein the transfer step further comprises flipping the composite assembly so that the electroformed element is under the mold the second bath of fluid.