Apparatus and methods for constructing semiconductor chip packages with silicon space transformer carriers

1. A method for fabricating a semiconductor package structure, comprising:

providing a silicon substrate having a thickness t 1 between first and second opposing planar surfaces;

forming a pattern of conductive vias to a depth d below the first surface of silicon substrate, which is less than the thickness t 1 of the silicon substrate;

forming a wiring layer on the first surface of the silicon substrate, wherein the wiring layer comprises a first pattern of electrical contacts and redistribution wiring that provides electrical connections between the first pattern of electrical contacts and the conductive vias;

bonding a glass handler substrate to the wiring layer on the first surface of the silicon substrate;

recessing the second surface of the silicon substrate to expose bottom portions of the blind conductive vias and reduce the thickness t 1 of the silicon substrate to a thickness t 1 ′, where t 1 ′ is less than about 150 microns to about 1-10 um;

forming an insulating layer on the recessed second surface of the silicon substrate with the bottom portions of the conductive vias exposed;

forming electrical contacts on the exposed bottom portions of the conductive vias to provide a second pattern of electrical contacts;

bonding the second pattern of electrical contacts to a third pattern of electrical contacts on a second package substrate layer; and

removing the mechanical glass handler substrate,

wherein forming a pattern of conductive vias in the first surface of the first silicon substrate comprises:

etching a pattern of annular trenches in the first surface of the first silicon substrate to the depth dl below the first surface of the substrate, each annular trench surrounding an inner core of silicon substrate material;

forming a liner layer on the exposed sidewall surfaces of the annular trenches; and

filling the annular trenches with a metallic material.

2. The method of claim 1 , wherein the second package substrate layer comprises an organic laminate substrate.

3. A method for fabricating a semiconductor package structure, comprising:

providing a silicon substrate having a thickness t 1 between first and second opposing planar surfaces;

forming a pattern of conductive vias to a depth d below the first surface of silicon substrate, which is less than the thickness t 1 of the silicon substrate;

forming a wiring layer on the first surface of the silicon substrate, wherein the wiring layer comprises a first pattern of electrical contacts and redistribution wiring that provides electrical connections between the first pattern of electrical contacts and the conductive vias;

bonding a glass handler substrate to the wiring layer on the first surface of the silicon substrate;

recessing the second surface of the silicon substrate to expose bottom portions of the blind conductive vias and reduce the thickness t 1 of the silicon substrate to a thickness t 1 ′, where t 1 ′ is less than about 150 microns to about 1-10 um;

forming an insulating layer on the recessed second surface of the silicon substrate with the bottom portions of the conductive vias exposed;

forming electrical contacts on the exposed bottom portions of the conductive vias to provide a second pattern of electrical contacts;

bonding the second pattern of electrical contacts to a third pattern of electrical contacts on a second package substrate layer;

removing the mechanical glass handler substrate; and

etching an open cavity through the silicon substrate from the recessed second surface to the first surface thereof prior to bonding the second pattern of electrical contacts to the third pattern of electrical contacts on the second package substrate layer,

wherein the second package substrate layer comprises an organic laminate substrate.

4. The method of claim 1 ,

wherein the second package substrate layer comprises a second silicon substrate having a thickness t 2 between first and second opposing planar surfaces and a second pattern of conductive vias formed to a depth d 2 below the first surface of second silicon substrate, which is less than the thickness t 2 of the second silicon substrate,

wherein the third pattern of electrical contacts are electrically connected to exposed end portions of respective conductive vias in the second pattern of conductive vias,

the method further comprising, prior to removing the glass handler substrate;

recessing the second surface of the second silicon substrate to expose bottom portions of the second pattern of conductive vias and reduce the thickness t 2 of the second silicon substrate to a thickness t 2 ′, where t 2 ′ is less than about 150 microns to about 1-10 um;

forming an insulating layer on the recessed second surface of the second silicon substrate with the bottom portions of the second pattern of conductive vias exposed; and

forming electrical contacts on the exposed bottom portions of the conductive vias to provide a further pattern of electrical contacts.

5. A method for fabricating a semiconductor package structure, comprising:

providing a silicon substrate having a thickness t 1 between first and second opposing planar surfaces;

forming a pattern of conductive vias to a depth d below the first surface of silicon substrate, which is less than the thickness t 1 of the silicon substrate;

forming a wiring layer on the first surface of the silicon substrate, wherein the wiring layer comprises a first pattern of electrical contacts and redistribution wiring that provides electrical connections between the first pattern of electrical contacts and the conductive vias;

bonding a glass handler substrate to the wiring layer on the first surface of the silicon substrate;

recessing the second surface of the silicon substrate to expose bottom portions of the blind conductive vias and reduce the thickness t 1 of the silicon substrate to a thickness t 1 ′, where t 1 ′ is less than about 150 microns to about 1-10 um;

forming an insulating layer on the recessed second surface of the silicon substrate with the bottom portions of the conductive vias exposed;

forming electrical contacts on the exposed bottom portions of the conductive vias to provide a second pattern of electrical contacts;

bonding the second pattern of electrical contacts to a third pattern of electrical contacts on a second package substrate layer;

recessing the second surface of the second silicon substrate to expose bottom portions of the second pattern of conductive vias and reduce the thickness t 2 of the second silicon substrate to a thickness t 2 ′, where t 2 ′ is less than about 150 microns to about 1-10 um;

forming an insulating layer on the recessed second surface of the second silicon substrate with the bottom portions of the second pattern of conductive vias exposed;

forming electrical contacts on the exposed bottom portions of the conductive vias to provide a further pattern of electrical contacts; and

removing the mechanical glass handler substrate;

wherein the second package substrate layer comprises a second silicon substrate having a thickness t 2 between first and second opposing planar surfaces and a second pattern of conductive vias formed to a depth d 2 below the first surface of second silicon substrate, which is less than the thickness t 2 of the second silicon substrate,

wherein the third pattern of electrical contacts are electrically connected to exposed end portions of respective conductive vias in the second pattern of conductive vias, and

wherein prior to bonding the second pattern of electrical contacts to the third pattern of electrical contacts on the second package substrate layer, the method further comprising:

etching an open cavity through the silicon substrate from the recessed second surface to the first surface thereof;

etching a closed end cavity in the first surface of the second silicon substrate down to a depth below the depth d 2 of the second pattern of conductive vias;

aligning the open cavity and closed end cavity when bonding the first and second silicon substrates; and

opening the closed end cavity during recessing the second surface of the second silicon substrate.