Leak-proof LED base structure
A leak-proof LED (Light Emitting Diode) base structure includes a ceramic substrate and a ceramic reflection ring. The ceramic reflection ring is coupled to the ceramic substrate by a heat-resistant epoxy resin to prevent encapsulant filled in an LED base from flowing out through a junction between the ceramic reflection ring and the ceramic substrate. A groove for receiving an overflow of the heat-resistant epoxy resin is formed on a coupling surface of the ceramic reflection ring. The ceramic reflection ring has a polished reflecting surface for reflecting light emitted by an LED die so as to increase luminosity of the light emitted by the LED. A lens positioning portion is formed on the top of the polished reflecting surface for allowing a lens to be precisely aligned with the ceramic reflection ring, enhancing preciseness of lens assembly, and improving resultant optical configuration of the light emitted by the LED.
1. A leak-proof LED base structure, comprising:
a ceramic substrate having a first surface and a second surface, the first surface being provided with at least a pair of first electrodes thereon, formed with a die-mounting metal layer thereon, and defined with a coupling area, and the second surface being provided with a pair of second electrodes electrically connected to the first electrodes, respectively; and
a ceramic reflection ring having a coupling surface, a polished reflecting surface, and a lens positioning portion formed at a top of the polished reflecting surface, wherein the coupling surface is adjacent to the polished reflecting surface, coupled to the coupling area by a heat-resistant epoxy resin, and formed with a groove configured corresponding in position to the coupling area to receive an overflow of the heat-resistant epoxy resin.
2. The LED base structure of claim 1 , wherein the ceramic substrate is an aluminum oxide substrate, an aluminum nitride substrate, or a low-temperature co-sintered ceramic (LTCC) substrate.
3. The LED base structure of claim 1 , wherein the ceramic substrate has at least a thermally conductive post provided therein, the thermally conductive post having a first end portion coupled to the die-mounting metal layer in a thermally conductive manner to enhance heat transfer.
4. The LED base structure of claim 3 , wherein the second surface is further formed with a thermally conductive metal layer coupled to a second end portion of the thermally conductive post in a thermally conductive manner to enhance heat transfer.
5. The LED base structure of claim 1 , wherein the heat-resistant epoxy resin is resistant to temperature of 270° C. or higher, temperature of 300° C. or higher, or temperature of 400° C. or higher.
6. The LED base structure of claim 1 , wherein the lens positioning portion is a positioning flange.
7. A leak-proof LED base structure, comprising:
a ceramic substrate having a first surface and a second surface, the first surface being provided with at least a pair of first electrodes thereon, formed with a die-mounting metal layer thereon, and defined with a coupling area, and the second surface being provided with a pair of second electrodes electrically connected to the first electrodes, respectively; and
a ceramic reflection ring having a coupling surface and a polished reflecting surface, wherein the coupling surface is adjacent to the polished reflecting surface, coupled to the coupling area by a heat-resistant epoxy resin, and formed with a groove configured corresponding in position to the coupling area to receive an overflow of the heat-resistant epoxy resin.
8. The LED base structure of claim 7 , wherein the ceramic substrate is an aluminum oxide substrate, an aluminum nitride substrate, or a low-temperature co-sintered ceramic (LTCC) substrate.
9. The LED base structure of claim 7 , wherein the ceramic substrate has at least a thermally conductive post provided therein, the thermally conductive post having a first end portion coupled to the die-mounting metal layer in a thermally conductive manner to enhance heat transfer.
10. The LED base structure of claim 9 , wherein the second surface is further formed with a thermally conductive metal layer coupled to a second end portion of the thermally conductive post in a thermally conductive manner to enhance heat transfer.
11. The LED base structure of claim 7 , wherein the heat-resistant epoxy resin is resistant to temperature of 270° C. or higher, temperature of 300° C. or higher, or temperature of 400° C. or higher.
12. The LED base structure of claim 7 , wherein a lens positioning portion is formed at a top of the polished reflecting surface.
13. The LED base structure of claim 12 , wherein the lens positioning portion is a positioning flange.
14. A leak-proof LED base structure, comprising:
a ceramic substrate having a first surface and a second surface, the first surface being provided with at least a pair of first electrodes thereon, formed with a die-mounting metal layer thereon, and defined with a coupling area, and the second surface being provided with a pair of second electrodes electrically connected to the first electrodes, respectively; and
a ceramic reflection ring having a coupling surface, a reflecting surface, and a lens positioning portion formed at a top of the reflecting surface, wherein the coupling surface is adjacent to the reflecting surface, coupled to the coupling area by a heat-resistant epoxy resin, and formed with a groove configured corresponding in position to the coupling area to receive an overflow of the heat-resistant epoxy resin.
15. The LED base structure of claim 14 , wherein the ceramic substrate is an aluminum oxide substrate, an aluminum nitride substrate, or a low-temperature co-sintered ceramic (LTCC) substrate.
16. The LED base structure of claim 14 , wherein the ceramic substrate has at least a thermally conductive post provided therein, the thermally conductive post having a first end portion coupled to the die-mounting metal layer in a thermally conductive manner to enhance heat transfer.
17. The LED base structure of claim 16 , wherein the second surface is further formed with a thermally conductive metal layer coupled to a second end portion of the thermally conductive post in a thermally conductive manner to enhance heat transfer.
18. The LED base structure of claim 14 , wherein the heat-resistant epoxy resin is resistant to temperature of 270° C. or higher, temperature of 300° C. or higher, or temperature of 400° C. or higher.
19. The LED base structure of claim 14 , wherein the reflecting surface is a polished reflecting surface.
20. The LED base structure of claim 14 , wherein the lens positioning portion is a positioning flange.