Light emitting diode
The invention provides a light emitting diode. The light emitting diode includes a ceramic substrate having a first surface and an opposite second surface. A first conductive trace metal layer and a second conductive trace metal layer are disposed on the first surface of the ceramic substrate. At least one light emitting diode chip is disposed on the first surface of the ceramic substrate, respectively and electrically connected to the first and second conductive trace metal layers. A plurality of thermal metal pads is disposed on the second surface of the ceramic substrate, wherein the thermal metal pads are electrically isolated from the light emitting diode chip.
1. A light emitting diode, comprising:
a ceramic substrate having a first surface and an opposite second surface;
a first conductive trace metal layer and a second conductive trace metal layer disposed on the first surface of the ceramic substrate, respectively;
at least one light emitting diode chip disposed on the first surface of the ceramic substrate, respectively and electrically connected to the first and second conductive trace metal layers; and
a plurality of thermal metal pads disposed on the second surface of the ceramic substrate, wherein the thermal metal pads are electrically isolated from the light emitting diode chip.
2. The light emitting diode as claimed in claim 1 , further comprising a third conductive trace metal layer disposed on the first surface of the ceramic substrate, the light emitting diode chip disposed on the third conductive trace metal layer, electrically connected to the first conductive trace metal layer through the third conductive trace metal layer, and the light emitting diode chip, electrically connected to the second conductive trace metal layer.
3. The light emitting diode as claimed in claim 1 , further comprising a conductive trace electrically connected to the light emitting diode chip and the second conductive trace metal layer.
4. The light emitting diode as claimed in claim 2 , further comprising a conductive trace electrically connected to the light emitting diode chip and the second conductive trace metal layer.
5. The light emitting diode as claimed in claim 2 , further comprising a conductive trace electrically connected to the third conductive trace metal layer and the first conductive trace metal layer.
6. The light emitting diode as claimed in claim 1 , wherein surfaces of the thermal metal pads away from the ceramic substrate are coplanar.
7. The light emitting diode as claimed in claim 1 , wherein the thermal metal pads are electrically isolated from each other.
8. The light emitting diode as claimed in claim 1 , further comprising a fourth conductive trace metal layer and a fifth conductive trace metal layer disposed on the second surface of the ceramic substrate, wherein the first and second conductive trace metal layers are respectively and electrically connected to the fourth and fifth conductive trace metal layers through vias in the ceramic substrate.
9. The light emitting diode as claimed in claim 1 , further comprising a packaging adhesive encapsulating the first surface of the ceramic substrate and the light emitting diode chip.
10. The light emitting diode as claimed in claim 1 , wherein the ceramic substrate comprises aluminum nitride (AlN) or aluminum oxide (Al 2 O 3 ).
11. The light emitting diode as claimed in claim 1 , wherein the thermal metal pads comprises Ag, Cu, Ni, Al or combinations thereof.
12. The light emitting diode as claimed in claim 1 , wherein the conductive trace metal layer comprises Ag, Cu, Ni, Al or combinations thereof.
13. The light emitting diode as claimed in claim 1 , wherein the packaging adhesive comprises silicon, epoxy, fluorescent glue or combinations thereof.
14. The light emitting diode as claimed in claim 1 , wherein the thermal metal pads are respectively and electrically connected to a plurality of bonding pads disposed on a circuit substrate.
15. The light emitting diode as claimed in claim 1 , wherein the thermal metal pads are respectively and electrically connected to a single bonding pad disposed on a circuit substrate.