IP Library › Granted Patent US 8,017,684
Granted Patent B2
US 8,017,684 · App. 11/616,185 · Granted Sep 13, 2011

Heat conductive silicone grease compositions

Assignee: Shin-Etsu Chemical Co., Ltd.
View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 8,017,684
App. No.
11/616,185
Granted
Sep 13, 2011
Kind
B2
Abstract

Provided is a heat conductive silicone grease composition, including: (A) 100 parts by volume of an organopolysiloxane with a specific structure and with a kinematic viscosity at 25° C. of 10 to 10,000 mm 2 /s, (B) 0.1 to 50 parts by volume of an alkoxysilane with a specific structure, and (C) 100 to 2,500 parts by volume of a heat conductive filler. The composition exhibits high thermal conductivity, retains excellent fluidity meaning the composition exhibits favorable workability, and is capable of filling fine indentations, thereby reducing contact resistance and providing excellent heat radiation performance. Also, the durability, under conditions of high temperature and high humidity, of the composition is improved, thereby improving the reliability of the composition during actual use. Heat generated by a heat-generating body can be dissipated into a heat-radiating body by sandwiching the composition between the heat-generating body and the heat-radiating body.

Claims (58)

1. A heat conductive silicone grease composition, consisting essentially of:

(A) 100 parts by volume of an organopolysiloxane represented by formula (1):

wherein,

each R 1 represents, independently, an unsubstituted or substituted monovalent hydrocarbon group,

each R 2 represents, independently, an alkyl group, alkoxyalkyl group, alkenyl group or acyl group,

a represents an integer from 4 to 99, and

b represents an integer from 1 to 3,

with a kinematic viscosity at 25° C. of 10 to 10,000 mm 2 /s,

(B) 0.1 to 50 parts by volume of an alkoxysilane represented by formula (2):

R 3 c R 4 d Si(OR 5 ) 4-c-d   (2)

wherein,

each R 3 represents, independently, an alkyl group of 9 to 15 carbon atoms,

each R 4 represents, independently, an unsubstituted or substituted monovalent hydrocarbon group of 1 to 8 carbon atoms,

each R 5 represents, independently, an alkyl group of 1 to 6 carbon atoms,

c represents an integer from 1 to 3, and

d represents an integer from 0 to 2,

provided that c+d represents an integer from 1 to 3,

(C) 100 to 2,500 parts by volume of a heat conductive filler, and

(D) an organopolysiloxane represented by an average composition formula (3):

R 6 e SiO (4-e)/2   (3)

wherein,

each R 6 represents, independently, an unsubstituted or substituted monovalent hydrocarbon group of 1 to 18 carbon atoms, and

e represents a number from 1.8 to 2.2,

with a kinematic viscosity at 25° C. of 10 to 100,000 mm 2 /s,

wherein said component (D) is present in an amount of not more than 500 parts by volume per one hundred parts by volume of component (A).

2. The composition according to claim 1 , wherein said component (D) is present in an amount of from 24.8 to 500 parts by volume per one hundred parts by volume of component (A).

3. The composition according to claim 1 , wherein said component (D) is present in an amount of from 200 to 500 parts by volume per one hundred parts by volume of component (A).

4. The composition according to claim 1 , wherein said component (C) consists of alumina powder having an average particle size of from 10.0 to 50 μm.

5. The composition according to claim 1 , wherein said component (C) consists of zinc oxide powder having an average particle size of from 1.0 to 50 μm.

6. A heat conductive silicone grease composition, consisting essentially of:

(A) 100 parts by volume of an organopolysiloxane represented by formula (1):

wherein,

each R 1 represents, independently, an unsubstituted or substituted monovalent hydrocarbon group,

each R 2 represents, independently, an alkyl group, alkoxyalkyl group, alkenyl group or acyl group,

a represents an integer from 4 to 99, and

b represents an integer from 1 to 3,

with a kinematic viscosity at 25° C. of 10 to 10,000 mm 2 /s,

(B) 0.1 to 50 parts by volume of an alkoxysilane represented by formula (2):

R 3 c R 4 d Si(OR 5 ) 4-c-d   (2)

wherein,

each R 3 represents, independently, an alkyl group of 9 to 15 carbon atoms,

each R 4 represents, independently, an unsubstituted or substituted monovalent hydrocarbon group of 1 to 8 carbon atoms,

each R 5 represents, independently, an alkyl group of 1 to 6 carbon atoms,

c represents an integer from 1 to 3, and

d represents an integer from 0 to 2,

provided that c+d represents an integer from 1 to 3,

(C) 100 to 2,500 parts by volume of a heat conductive filler,

(D) an organopolysiloxane represented by an average composition formula (3):

R 6 e SiO (4-e)/2   (3)

wherein,

each R 6 represents, independently, an unsubstituted or substituted monovalent hydrocarbon group of 1 to 18 carbon atoms, and

e represents a number from 1.8 to 2.2,

with a kinematic viscosity at 25° C. of 10 to 100,000 mm 2 /s, and

(E) a volatile solvent capable of dissolving or dispersing said components (A) and (B), in a quantity not greater than 100 parts by volume per 100 parts by volume of said component (A),

wherein said component (E) is capable of dissolving or dispersing said components (A), (B), and (D),

wherein said component (D) is present in an amount of not more than 500 parts by volume per one hundred parts by volume of component (A).

7. The composition according to claim 6 , wherein said component (D) is present in an amount of from 24.8 to 500 parts by volume per one hundred parts by volume of component (A).

8. The composition according to claim 6 , wherein said component (D) is present in an amount of from 200 to 500 parts by volume per one hundred parts by volume of component (A).

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 26, 2006
From: ENDO, AKIHIRO; MIYOSHI, KEI; YAMADA, KUNIHIRO; KIZAKI, HIROAKI
To: SHIN-ETSU CHEMICAL CO., LTD.
Reel/Frame 018676/0505 →
Priority Claims (1)
JP 2005-374486 · Dec 27, 2005 · national
Continuity (1)
Related Publication 20070149834A1 · Jun 28, 2007