IP Library Granted Patent US 8,019,109
Granted Patent B2
US 8,019,109 · App. 12/116,921 · Granted Sep 13, 2011

Microphone boom with adjustable wind noise suppression

Assignee: Plantronics, Inc.
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Quick Facts
Patent No.
US 8,019,109
App. No.
12/116,921
Granted
Sep 13, 2011
Kind
B2
Abstract

A microphone boom cap includes a porous plastic portion adapted to cover a microphone boom first aperture. The microphone boom cap includes a non-porous plastic portion affixed to the porous plastic portion. The non-porous plastic portion is adapted to cover a microphone boom second aperture in a second use position, where the porous plastic portion covers the second aperture in a first use position.

Claims (27)

1. A headset microphone boom assembly comprising:

a boom housing enclosing a noise canceling microphone, the boom housing comprising a first aperture leading to a noise canceling microphone first port and a second aperture leading to a noise canceling microphone second port; and

a boom cap disposed over the boom housing movable relative to the boom housing to either a first use position or a second use position, the boom cap comprising:

a porous plastic portion disposed over the first aperture in both the first use position and the second use position; and

a non-porous plastic portion disposed over the second aperture in the second use position, wherein the porous plastic portion covers the second aperture in the first use position.

2. The headset microphone boom assembly of claim 1 , wherein the boom cap is rotatable about the boom housing between the first use position and the second use position.

3. The headset microphone boom assembly of claim 1 , wherein the boom cap is slideable along a length of the boom housing between the first use position and the second use position.

4. The headset microphone boom assembly of claim 1 , wherein the porous plastic portion comprises one selected from the following group: high-density polyethylene (HDPE), polytetrafluoroethylene (PTFE), ultra-high molecular weight polyethelene (UHMW), nylon 6 (N6), polypropylene (PP), polyvinylidine fluoride (PVDF), polyethylene (PE), and polyethersulfone (PES).

5. The headset microphone boom assembly of claim 1 , wherein the non-porous plastic portion comprises polycarbonate or acrylonitrile butadiene styrene.

6. The headset microphone boom assembly of claim 1 , wherein the non-porous plastic portion comprises a cylindrical ring affixed to the porous plastic portion.

7. The headset microphone boom assembly of claim 1 , wherein the non-porous plastic portion comprises a first half cylindrical ring affixed to a porous plastic second half cylindrical ring.

8. The headset microphone boom assembly of claim 1 , further comprising a friction element disposed between the boom housing and the boom cap.

9. The headset microphone boom assembly of claim 8 , wherein the friction element comprises a rubber o-ring.

10. A microphone housing assembly comprising:

a housing enclosing a noise canceling microphone, the housing comprising:

a first aperture leading to a noise canceling microphone first port; and

a second aperture leading to a noise canceling microphone second port;

a tip portion;

a wind noise suppression cap enclosing the tip portion operable to slide along a length of the housing between a first use position and a second use position, the wind noise suppression cap comprising:

a porous plastic portion disposed over the first aperture in both the first use position and the second use position; and

a non-porous plastic portion disposed over the second aperture in the second use position, wherein the porous plastic portion covers the second aperture in the first use position.

11. The microphone housing assembly of claim 10 , wherein the porous plastic portion comprises one selected from the following group: high-density polyethylene (HDPE), polytetrafluoroethylene (PTFE), ultra-high molecular weight polyethelene (UHMW), nylon 6 (N6), polypropylene (PP), polyvinylidine fluoride (PVDF), polyethylene (PE), and polyethersulfone (PES).

12. The microphone housing assembly of claim 10 , wherein the non-porous plastic portion comprises polycarbonate or acrylonitrile butadiene styrene.

13. The microphone housing assembly of claim 10 , wherein the non-porous plastic portion comprises a cylindrical ring affixed to the porous plastic portion.

14. The microphone housing assembly of claim 10 , wherein the non-porous plastic portion comprises a first half cylindrical ring affixed to a porous plastic second half cylindrical ring.

15. The microphone housing assembly of claim 10 , further comprising a friction element disposed between the housing and the wind noise suppression cap.

16. The microphone housing assembly of claim 15 , wherein the friction element comprises a rubber o-ring.

Assignments (4)
NUNC PRO TUNC ASSIGNMENT Recorded Nov 13, 2023
From: PLANTRONICS, INC.
To: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
Reel/Frame 065549/0065 →
RELEASE OF PATENT SECURITY INTERESTS Recorded Aug 30, 2022
From: WELLS FARGO BANK, NATIONAL ASSOCIATION
To: PLANTRONICS, INC.; POLYCOM, INC.
Reel/Frame 061356/0366 →
SECURITY AGREEMENT Recorded Jul 5, 2018
From: PLANTRONICS, INC.; POLYCOM, INC.
To: WELLS FARGO BANK, NATIONAL ASSOCIATION
Reel/Frame 046491/0915 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 7, 2008
From: GOLLBACH, LAWRENCE W; JOHNSTON, TIMOTHY P
To: PLANTRONICS, INC.
Reel/Frame 020916/0335 →
Continuity (1)
Related Publication 20090279712A1 · Nov 12, 2009