Silicon carbide semiconductor device, and method of manufacturing the same
The silicon carbide semiconductor device includes a trench formed from a surface of a drift layer of a first conductivity type formed on a substrate of the first conductivity type, and a deep layer of a second conductivity type located at a position in the drift layer beneath the bottom portion of the trench. The deep layer is formed at a certain distance from base regions of the second conductivity type formed on the drift layer so as to have a width wider than the width of the bottom portion of the trench, and surround both the corner portions of the bottom portion of the trench.
1. A silicon carbide semiconductor device including an inverted MOSFET comprising:
a substrate of a first conductivity type, said substrate being made of silicon carbide;
a drift layer of said first conductivity type formed on said substrate, said drift layer being made of silicon carbide, and less doped than said substrate;
a trench formed from a surface of said drift layer;
a pair of base regions of a second conductivity type formed so as to face across from said trench in said drift layer and be in contact with a sidewall of said trench, said base regions being made of silicon carbide;
a pair of source regions of said first conductivity type formed so as to face across from said trench and be in contact with said sidewall of said trench in said drift layer, said source regions being made of silicon carbide, and more highly doped than said drift layer;
a gate insulation film formed on a surface of said trench;
a gate electrode formed on said gate insulation film within said trench;
a first electrode electrically connected to said source regions;
a second electrode formed on a back surface of said substrate;
said inverted MOSFET operating such that a channel region is formed in a surface portion of each said base region located at said sidewall of said trench depending on a voltage applied to said gate electrode to allow a current to pass between said first and second electrodes through said source regions and said drift layer,
wherein
said trench is so shaped that said sidewall thereof is perpendicular to said surface of said drift layer, said base regions are made deeper than said trench, and bottom corners of said trench are surrounded by said base regions.
2. The silicon carbide semiconductor device according to claim 1 , further comprising
a high concentration layer of said second conductivity type formed beneath each said base region, said high concentration layer being more highly doped than said base regions.