IP Library Granted Patent US 8,027,145
Granted Patent B2
US 8,027,145 · App. 12/182,110 · Granted Sep 27, 2011

Capacitor element and method of manufacturing capacitor element

Assignee: Taiyo Yuden Co., Ltd
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Quick Facts
Patent No.
US 8,027,145
App. No.
12/182,110
Granted
Sep 27, 2011
Kind
B2
Abstract

There are provided a porous plate dielectric substance, pillar-shaped electrodes respectively formed in pores belonging to a first group and pores belonging to a second group alternately arranged on the dielectric substance, insulator layers made of an organic insulator formed on tips of pillar-shaped electrodes in the pores of the first and second groups so as to fill the pores and hide electrodes respectively provided on one principal surface and another principal surface of the dielectric substance and connected to base ends of the pillar-shaped electrodes.

Claims (28)

1. A capacitor element comprising:

a porous plate dielectric substance made of an anodic oxide of a first valve metal, in which plural pores belonging to a first group and plural pores belonging to a second group, which pierce through in the thickness direction, are formed, wherein single pores belonging to the first group and single pores belonging to the second group are arranged alternately in a direction perpendicular to the thickness direction, each pore being a nano-sized pore having a diameter of several nm to several hundred nm;

first pillar-shaped electrodes formed in the plural pores belonging to the first group respectively wherein base ends thereof are exposed at one principal surface of the dielectric substance;

second pillar-shaped electrodes formed in the plural pores belonging to the second group respectively wherein base ends thereof are exposed at another principal surface of the dielectric substance;

insulator layers provided respectively on tips of the first pillar-shaped electrodes in the pores belonging to the first group so as to fill the pores as well as on tips of the second pillar-shaped electrodes in the pores belonging to the second group so as to fill the pores;

a first hide electrode provided on the one principal surface of the dielectric substance so as to connect to the base ends of the first pillar-shaped electrodes; and

a second hide electrode provided on the another principal surface of the dielectric substance so as to connect to the base ends of the second pillar-shaped electrodes.

2. The capacitor element according to claim 1 ,

wherein the insulator layer is formed by pyrolyzing an electroconductive polymer.

3. The capacitor element according to claim 2 ,

wherein voltage is applied between the first hide electrode and the second hide electrode.

4. The capacitor element according to claim 2 , wherein the insulator layer is formed by pyrolzying pyrrole, polyaniline, polyethylene dioxythiophene, triazinethiol, or poly(thienyl pyrrole).

5. The capacitor element according to claim 1 ,

wherein the insulator layer is made of a TiO2 film.

6. The capacitor element according to claim 1 ,

wherein the insulator layer is made of an SiO2 film.

7. The capacitor element according to claim 1 ,

wherein the insulator layer is made of an insulating resin layer.

8. The capacitor element according to claim 1 ,

wherein the insulator layer is made of an anodic oxide of a second valve metal.

9. The capacitor element according to claim 8 , wherein the second valve metal is selected from the group consisting of Al, Ta, Nb, Ti, Zr, Hf, Zn, W, and Sb.

10. The capacitor element according to claim 8 , wherein the second valve metal is the same as the first valve metal.

11. The capacitor element according to claim 1 ,

wherein the insulator layer is made of air space.

12. The capacitor element according to claim 1 ,

wherein the insulator layer is formed by pyrolyzing an electrodeposited polyimide resin.

13. The capacitor element according to claim 1 , wherein the insulator layer has a thickness of 100 nm to 10 μm.

14. The capacitor element according to claim 1 , wherein the first valve metal is selected from the group consisting of Al, Ta, Nb, Ti, Hf, W, V, and alloys of the foregoing.

Assignments (2)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 23, 2025
From: TAIYO YUDEN CO., LTD.
To: AIST SOLUTIONS CO.
Reel/Frame 073304/0220 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 27, 2008
From: YAWATA, KAZUSHI, MR; MASUDA, HIDETOSHI, MR; KUROSAWA, MASARU, MR; MIZUNO, KOTARO, MR
To: TAIYO YUDEN CO., LTD.
Reel/Frame 021596/0866 →
Priority Claims (2)
JP 2007-197039 · Jul 30, 2007 · national
JP 2007-329326 · Dec 20, 2007 · national
Continuity (1)
Related Publication 20090034162A1 · Feb 5, 2009