IP Library Granted Patent US 8,031,344
Granted Patent B2
US 8,031,344 · App. 12/609,262 · Granted Oct 4, 2011

Z-stage configuration and application thereof

Assignee: Hermes Microvision, Inc.
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Quick Facts
Patent No.
US 8,031,344
App. No.
12/609,262
Granted
Oct 4, 2011
Kind
B2
Abstract

A stage configuration is provided, wherein a ceramic plate is used as the z-stage body to decrease the use of the metal plates in the conventional configuration, so that the compact structure of the z-stage may decrease the vibrational movements of the z-stage. Further, two Laser interferometer are used to detect a movement of different points along a vertical line of the z-stage sidewall to calculate a movement of the specimen surface, so that a horizontal movement of the specimen surface can be detected more accurately.

Claims (46)

1. A z-stage configuration, comprising:

a metal plate;

a ceramic plate over said metal plate;

at least three C-shape flex clamps on a peripheral region of said metal plate for supporting said ceramic plate, wherein each clamp has a piezo actuator; and

two mirrors fastened to two sides of said ceramic plate, wherein said two sides are perpendicular.

2. The z-stage configuration according to claim 1 , wherein said ceramic plate has two step structures adjacent to one corner of said ceramic plate, and said two mirrors are fastened to said two step structures.

3. A stage configuration for adjusting specimen height in a SEM machine, comprising:

a metal plate;

a ceramic plate over said metal plate;

four C-shape flex clamps on corners of said metal plate for supporting said ceramic plate, wherein each clamp has a peizo actuator;

an E-chuck configuration on a surface of said ceramic plate for fastening a specimen;

an EM shielding plate with an opening to expose said E-chuck configuration;

a plurality of stands around said ceramic plate for supporting said EM shielding plate; and

two reflective materials on sidewalls of said ceramic plate.

4. The stage configuration according to claim 3 , wherein said metal plate is a Al metal plate.

5. The stage configuration according to claim 3 , wherein said metal plate is square or polygon.

6. The stage configuration according to claim 3 , said specimen is a wafer or a mask.

7. The stage configuration according to claim 3 , wherein said E-chuck configuration is electric circuits embedded on a surface of said ceramic plate.

8. The stage configuration according to claim 3 , wherein said E-chuck configuration is an E-chuck plate.

9. The stage configuration according to claim 3 , wherein said two reflective materials are formed by polishing said ceramic plate and coating a reflective material thereon.

10. The stage configuration according to claim 3 , wherein said ceramic plate has two step structures adjacent to one corner of said ceramic plate.

11. The stage configuration according to claim 10 , wherein said two reflective materials are two mirrors fastened to said two step structures.

12. The stage configuration according to claim 11 , wherein said E-chuck configuration is electric circuits embedded on a surface of said ceramic plate.

13. The stage configuration according to claim 11 , wherein said E-chuck configuration is an E-chuck plate.

14. The stage configuration according claim 3 , further including multiple Laser interferometers for detecting vibration movement of said z-stage.

15. A system for detecting surface movement of a specimen on a z-stage, comprising:

a first Laser interferometer for detecting a first point on a sidewall of said z-stage;

a second Laser interferometer for detecting a second point on said sidewall of said z-stage, wherein said second point and said first point are along a vertical line of said sidewall of said z-stage; and

means for calculating a surface movement of said specimen according to detected movements of said first and second points, and locations of said first and second points as well as said specimen.

16. A system for offsetting SEM vibration, comprising:

a first Laser interferometer for detecting a first point on a sidewall of a z-stage;

a second Laser interferometer for detecting a second point on said sidewall of said z-stage, wherein said second point and said first point are along a vertical line of said sidewall of said z-stage;

first means for calculating a surface movement of a specimen according to detected movements of said first and second points, and locations of said first and second points as well as said specimen;

a third Laser interferometer for detecting a third point on a sidewall of an E-beam column; and

second means for calculating a movement of said E-beam column to offset said surface movement of said specimen.

17. The system according to claim 16 , further comprising a reflective mirror fastened to said E-beam column for said third Laser interferometer detection.

18. The system according to claim 16 , further comprising a reflective mirror fastened to a top cover of a chamber for said third Laser interferometer detection, wherein said E-beam column is mounted to said top cover.

19. A method for offsetting SEM vibration, comprising:

detecting a first point on a sidewall of a z-stage by a first Laser interferometer;

detecting a second point on said sidewall of said z-stage by a second Laser interferometer, wherein said second point and said first point are along a vertical line of said sidewall of said z-stage;

calculating a surface movement of a specimen according to detected movements of said first and second points, and locations of said first and second points as well as said specimen;

detecting a third point on a sidewall of an E-beam column by a third Laser interferometer; and

calculating a movement of said E-beam column to offset said surface movement of said specimen.

20. A system for offsetting an E-beam column movement, comprising:

a Laser interferometer for detecting a point on a sidewall of said E-beam column; and

means for calculating a movement of said E-beam column to offset a surface movement of a specimen to be inspected by said E-beam column.

Assignments (3)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 29, 2020
From: HERMES MICROVISION, INC.
To: HERMES MICROVISION INCORPORATED B.V.
Reel/Frame 054866/0742 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 29, 2020
From: HERMES MICROVISION INCORPORATED B.V.
To: ASML NETHERLANDS B.V.
Reel/Frame 054870/0156 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Oct 30, 2009
From: WANG, YOU-JIN; PAN, CHUNG-SHIH
To: HERMES MICROVISION, INC.
Reel/Frame 023453/0447 →
Continuity (1)
Related Publication 20110101222A1 · May 5, 2011