Substrate structures and methods for electronic circuits
View Patent ↗Substrate structure embodiments generally have first and second sides and are configured to form at least one opening that communicates between the first and second sides. A circuit path is carried on the first side and extended over the opening wherein the circuit path has a near side facing the substrate and has a far side facing away from the substrate. A circuit element has at least one bonding pad and is inserted into the opening after which the conductive bump is arranged to join the pad to the path. In another embodiment, the bump joins the pad to the near side of the path. In another embodiment, the path defines a hole and the bump fills the hole. In yet another system embodiment, the opening comprises a recess and associated vias. These embodiments may also have a second conductive circuit path carried on the first side and having a near side facing the substrate and a far side facing away from the substrate. The systems may then include a second circuit element and at least one second conductive bump.
1. A substrate system to carry at least one circuit element that has at least one bonding pad, the system comprising:
a substrate having first and second sides and configured to form at least one opening that communicates between said first and second sides;
at least one conductive circuit path carried on said first side and extended over said opening wherein said circuit path has a near side facing said substrate and has a far side facing away from said substrate; and
a conductive bump arranged to join said pad to said path.
2. The system of claim 1 , wherein said substrate is a dielectric substrate.
3. The system of claim 1 , wherein said conductive bump joins said pad to said near side.
4. The system of claim 3 , wherein said bump comprises solder so that the application of heat joins said bonding pad to said near side.
5. The system of claim 3 , wherein said bump comprises conductive epoxy so that the application of at least one of heat and radiated energy joins said pad to said near side.
6. The system of claim 3 , wherein a second circuit element has at least one second bonding pad and further including:
a second conductive circuit path carried on said first side and having a near side facing said substrate and a far side facing away from said substrate; and
a conductive bump positioned to join said second bonding pad to the far side of said second path.
7. The system of claim 3 , further including a lens positioned over a light-emitting diode of said circuit element.
8. The system of claim 7 , wherein said opening is one of a plurality of openings arranged to form a character.
9. The system of claim 3 , further including a non-conductive polymer arranged to secure said circuit element in said opening.
10. The system of claim 3 , further including an insulating layer inserted between said substrate and at least a portion of said circuit path.
11. The system of claim 1 , wherein:
said circuit path defines at least one hole positioned over said opening; and
said conductive bump fills said hole to thereby join said pad to said path.
12. The system of claim 11 , wherein said bump comprises solder so that the application of heat joins said bonding pad to said circuit path.
13. The system of claim 11 , wherein said bump comprises conductive epoxy so that the application of at least one of heat and radiated energy joins said pad to said circuit path.
14. The system of claim 11 , wherein a second circuit element has at least one second bonding pad and further including:
a second conductive circuit path carried on said first side and having a near side facing said substrate and a far side facing away from said substrate; and
a conductive bump positioned to join said second bonding pad to the far side of said second path.
15. The system of claim 11 , wherein said circuit element includes a light-emitting diode and further including a lens positioned over said diode and configured to transform light emitted from said diode.
16. The system of claim 11 , wherein said circuit element includes passive components.
17. The system of claim 11 , further including a non-conductive polymer arranged to secure said circuit element in said opening.
18. The system of claim 1 , wherein:
said opening includes a recess in said substrate to receive said circuit element and further includes at least one via that communicates between said recess and said circuit path; and
said bump is received in said via to thereby join said pad to said near side.
19. The system of claim 18 , wherein said bump comprises solder so that the application of heat joins said bonding pad to said near side.
20. The system of claim 18 , wherein said bump comprises conductive epoxy so that the application of at least one of heat and radiated energy joins said pad to said near side.