Semiconductor device built on plastic substrate
View Patent ↗Disclosed are semiconductor memory devices containing a plastic substrate and at least one active device supported by the plastic substrate, the active device containing an organic semiconductor material. The semiconductor memory devices containing a plastic substrate may further contain a polymer dielectric and/or a conductive polymer.
1. A semiconductor memory device, comprising:
a plastic substrate; and
at least one active device supported by the plastic substrate, the active device comprising a first and a second electrodes with an organic semiconductor material and a passive layer between the first and the second electrodes, the passive layer comprising material selected from a group consisting of copper sulfide, copper rich copper sulfide, copper oxide, copper selenide, copper telluride, manganese oxide, titanium dioxide, indium oxide, silver sulfide, iron oxide, cobalt arsenide, and nickel arsenide.
2. The semiconductor memory device of claim 1 , further comprising a polymer dielectric material over the plastic substrate.
3. The semiconductor memory device of claim 2 , wherein the polymer dielectric material comprises at least one selected from the group consisting of polyimides, fluorinated polyimides, polysilsequioxanes such as methyl polysilsequioxanes, butyl polysilsequioxanes, and phenyl polysilsequioxanes, benzocyclobutenes, fluorinated benzocyclobutene, polyphenylene, polyphenylquinoxaline, copolymers of 2,2-bistrifluoromethyl-4,5-difluoro-1,3-dioxole, perfluoroalkoxy resin, fluorinated ethylene propylene, fluoromethacrylate, poly(arylene ether), fluorinated poly(arylene ether), poly(p-xylxylenes), fluorinated poly(p-xylxylenes), parylene F, parylene N, parylene C, parylene D, amorphous polytetrafluoroethylene, polyphenylquinoxalines, and polymeric photoresist materials.
4. The semiconductor memory device of claim 1 , wherein the plastic substrate comprises at least one selected from the group consisting of polyesters, polyimides, polycarbonates, polyarylates, polyolefins, polysulfones, polyether sulfones, polyacrylates, polymethacrylates, polymethyl methacrylates, polyvinylene chloride, and fluorolated polymers.
5. The semiconductor memory device of claim 1 , wherein the organic semiconductor material comprises at least one selected from the group consisting of polyacetylene; polydiphenylacetylene; poly(t-butyl)diphenylacetylene; poly(trifluoromethyl)diphenylacetylene; polybis(trifluoromethyl)acetylene; polybis(t-butyldiphenyl)acetylene; poly(trimethylsilyl)diphenylacetylene; poly(carbazole)diphenylacetylene; polydiacetylene; polyphenylacetylene; polypyridineacetylene; polymethoxyphenylacetylene; polymethylphenylacetylene; poly(t-butyl)phenylacetylene; polynitro-phenylacetylene; poly(trifluoromethyl)phenylacetylene; poly(trimethylsilyl)pheylacetylene; polydipyrrylmethane; polyindoqiunone; polydihydroxyindole; polytrihydroxyindole; furane-polydihydroxyindole; polyindoqiunone-2-carboxyl; polyindoqiunone; polybenzobisthiazole; poly(p-phenylene sulfide); polyaniline; polythiophene; polypyrrole; polysilane; polystyrene; polyfuran; polyindole; polyazulene; polyphenylene; polypyridine; polybipyridine; polyphthalocyanine; polysexithiofene; poly(siliconoxohemiporphyrazine); poly(germaniumoxohemiporphyrazine); poly(ethylenedioxythiophene); polymetallocene complexes; and polypyridine metal complexes.
6. The semiconductor memory device of claim 1 , wherein the passive layer is adjacent to the first electrode and the organic semiconductor material is adjacent to the second electrode.
7. The semiconductor memory device of claim 1 , wherein the active device comprises at least one selected from the group consisting of a logic transistor and a nonvolatile memory cell.
8. The semiconductor memory device of claim 1 , wherein the plastic substrate has a coefficient of thermal expansion from about 0.1×10 −5 in/in/° F. to about 20×10 −5 in/in/° F.
9. The semiconductor memory device of claim 1 , wherein the plastic substrate has a glass transition temperature or a melting point of about 135° C. or higher and about 425° C. or less.
10. A semiconductor memory device, comprising:
a plastic substrate;
at least one active device supported by the plastic substrate, the active device comprising a first and a second electrodes with an organic semiconductor material and a passive layer between the first and the second electrodes, the passive layer comprising material selected from a group consisting of copper sulfide, copper rich copper sulfide, copper oxide, copper selenide, copper telluride, manganese oxide, titanium dioxide, indium oxide, silver sulfide, iron oxide, cobalt arsenide, and nickel arsenide; and
a polymer dielectric material over the plastic substrate.
11. The semiconductor memory device of claim 10 , wherein the plastic substrate comprises at least one selected from the group consisting of polyesters, polyimides, polycarbonates, polyarylates, polyolefins, polysulfones, polyether sulfones, polyacrylates, polymethacrylates, polymethyl methacrylates, polyvinylene chloride, and fluorolated polymers.
12. The semiconductor memory device of claim 10 , wherein the plastic substrate has a coefficient of thermal expansion from about 1×10 −5 in/in/° F. to about 10×10 −5 in/in/° F.
13. The semiconductor memory device of claim 10 , wherein the plastic substrate has a glass transition temperature or a melting point of about 140° C. or higher and about 400° C. or less.
14. The semiconductor memory device of claim 10 , wherein the polymer dielectric material comprises at least one selected from the group consisting of polyimides, fluorinated polyimides, polysilsequioxanes such as methyl polysilsequioxanes, butyl polysilsequioxanes, and phenyl polysilsequioxanes, benzocyclobutenes, fluorinated benzocyclobutene, polyphenylene, polyphenylquinoxaline, copolymers of 2,2-bistrifluoromethyl-4,5-difluoro-1,3-dioxole, perfluoroalkoxy resin, fluorinated ethylene propylene, fluoromethacrylate, poly(arylene ether), fluorinated poly(arylene ether), poly(p-xylxylenes), fluorinated poly(p-xylxylenes), parylene F, parylene N, parylene C, parylene D, amorphous polytetrafluoroethylene, polyphenylquinoxalines, and polymeric photoresist materials.
15. The semiconductor memory device of claim 10 , wherein the organic semiconductor material comprises at least one selected from the group consisting of polyacetylene; polydiphenylacetylene; poly(t-butyl)diphenylacetylene; poly(trifluoromethyl)diphenylacetylene; polybis(trifluoromethyl)acetylene; polybis(t-butyldiphenyl)acetylene; poly(trimethylsilyl) diphenylacetylene; poly(carbazole)diphenylacetylene; polydiacetylene; polyphenylacetylene; polypyridineacetylene; polymethoxyphenylacetylene; polymethylphenylacetylene; poly(t-butyl)phenylacetylene; polynitro-phenylacetylene; poly(trifluoromethyl)phenylacetylene; poly(trimethylsilyl)pheylacetylene; polydipyrrylmethane; polyindoqiunone; polydihydroxyindole; polytrihydroxyindole; furane-polydihydroxyindole; polyindoqiunone-2-carboxyl; polyindoqiunone; polybenzobisthiazole; poly(p-phenylene sulfide); polyaniline; polythiophene; polypyrrole; polysilane; polystyrene; polyfuran; polyindole; polyazulene; polyphenylene; polypyridine; polybipyridine; polyphthalocyanine; polysexithiofene; poly(siliconoxohemiporphyrazine); poly(germaniumoxohemiporphyrazine); poly(ethylenedioxythiophene); polymetallocene complexes; and polypyridine metal complexes.
16. The semiconductor memory device of claim 10 , wherein the passive layer comprises at least one selected from the group consisting of copper sulfide, copper rich copper sulfide, copper oxide, copper selenide, copper telluride, manganese oxide, titanium dioxide, indium oxide, silver sulfide, gold sulfide, iron oxide, cobalt arsenide, and nickel arsenide.
17. A semiconductor memory device, comprising:
a plastic substrate;
at least one active device supported by the plastic substrate, the active device comprising a first and a second electrodes with an organic semiconductor material and a passive layer between the first and the second electrodes, the passive layer comprising material selected from a group consisting of copper sulfide, copper rich copper sulfide, copper oxide, copper selenide, copper telluride, manganese oxide, titanium dioxide, indium oxide, silver sulfide, iron oxide, cobalt arsenide, and nickel arsenide;
a polymer dielectric material over the plastic substrate; and
a conductive polymer adjacent at least one active device.
18. The semiconductor memory device of claim 17 , wherein the plastic substrate comprises at least one selected from the group consisting of polyesters, polyimides, polycarbonates, polyarylates, polyolefins, polysulfones, polyether sulfones, polyacrylates, polymethacrylates, polymethyl methacrylates, polyvinylene chloride, and fluorolated polymers.
19. The semiconductor memory device of claim 17 , wherein the plastic substrate has a coefficient of thermal expansion from about 0.1×10 −5 in/in/° F. to about 20×10 −5 in/in/° F.
20. The semiconductor memory device of claim 17 , wherein the plastic substrate has a glass transition temperature or a melting point of about 145° C. or higher and about 300° C. or less.