Process of forming ultra thin wafers having an edge support ring
View Patent ↗A process of forming ultra thin wafers having an edge support ring is disclosed. The process provides an edge support ring having an angled inner wall compatible with spin etch processes.
1. A process of forming an ultra thin wafer having an edge support ring having an angled inner wall comprising the steps of:
positioning a grinding wheel having profiled teeth proximate a wafer backside edge;
grinding the wafer backside; and
ending the grinding of the wafer backside when an ultra thin central portion thickness is achieved, and wherein the angled inner wall is greater than ninety degrees relative to a horizontal axis.
2. The process of claim 1 , wherein the profiled teeth of the grinding wheel correspond to a desired profile of the angled inner wall.
3. The process of forming the ultra thin wafer of claim 1 , wherein the grinding wheel axis of rotation is parallel to the wafer chuck axis of rotation.
4. The process of forming the ultra thin wafer of claim 1 , further comprising adjusting a distance between a grinding wheel axis of rotation and a wafer chuck axis of rotation to account for wear of the profiled teeth following the grinding of a number of wafers.
5. The process of claim 1 , wherein grinding the wafer backside using the grinding wheel having profiled teeth produces an ultra thin central portion and a peripheral edge support ring, the edge support ring having the angled inner wall.
6. The process of claim 1 , wherein the ultra thin central portion has a thickness of less than 4 mils.