Integrated circuit package having integrated faraday shield
A packaged integrated circuit (IC) ( 100 ) includes a first substrate ( 110 ) comprising a first plurality of layers and a first circuit coupling features ( 112 ) at an upper surface of the first substrate ( 110 ), the first plurality of layers including a first electromagnetic interference shielding layer ( 132 ). The packaged IC also includes a second substrate ( 106 ) having an upper surface attached to a lower surface of the first substrate ( 110 ) by an electrically conductive adhesive material ( 136 ). The second substrate ( 106 ) includes a second plurality of layers and a second circuit coupling feature ( 108 ) at a lower surface of the second substrate ( 106 ). The first plurality of layer includes a second EMI shielding layer ( 134 ). The packaged IC further includes a functional die ( 124 ) disposed between the first ( 110 ) and the second ( 106 ) substrates and functionally coupled to the first ( 112 ) and/or the second ( 108 ) circuit coupling features. In the packaged IC, the adhesive material ( 136 ) electrically couples the first ( 132 ) and the second ( 134 ) shielding layers.
1. An integrated circuit package, comprising:
a Faraday cage comprising a first electromagnetic interference (EMI) shielding layer in a first substrate, a parallel second EMI shielding layer on a bottom surface of a second substrate, and a conductive member connecting the EMI shielding layers;
a cavity enclosed by the first substrate, the second substrate, and the conductive member;
the first substrate further comprising a metal layer;
the second substrate further comprising a metal layer on a top surface;
a first semiconductor die disposed inside the cavity, affixed on a first surface of the first substrate;
a second semiconductor die disposed outside the cavity, affixed on the metal layer on the top surface of the second substrate; and
bonding wires connecting the metal layer on the top surface of the second substrate to terminals, which are on the first surface of the first substrate and are outside the Faraday cage.
2. The integrated circuit package of claim 1 , in which the conductive member comprises segments of conductive material.
3. The integrated circuit package of claim 1 , in which the conductive member is not segmented.
4. An integrated circuit package, comprising:
a Faraday cage, which includes a solid metal sheet on a bottom surface of a first substrate and a metal layer in a second substrate;
a conductive adhesive member having a shape of a ring connecting the solid metal sheet and the metal layer;
a plurality of terminals on a top surface of the second substrate outside the ring of the conductive adhesive member, connected to the top surface of the first substrate with bonding wires; and
a integrated circuit chip affixed to the top surface of the second substrate.
5. The integrated circuit package of claim 4 , in which the ring of conductive adhesive member is segmented with gaps between segments.
6. The integrated circuit package of claim 4 , in which the integrated circuit chip is designed to operate at radio frequencies.
7. The integrated circuit package of claim 6 , in which the gaps are shorter than the wavelength of a signal at the radio frequencies at the gaps.
8. The integrated circuit package of claim 6 , further comprising a second semiconductor chip affixed to a top surface of the first substrate.
9. The integrated circuit package of claim 4 , in which the first substrate is free of vias.
10. The integrated circuit package of claim 9 , in which the conductive adhesive member is connected to the metal layer in the second substrate through vias in the second substrate.
11. The integrated circuit package of claim 4 , in which the metal layer in the second substrate is a ground plane.