Boundary acoustic wave device
A boundary acoustic wave device includes an IDT electrode between a piezoelectric layer and a dielectric layer. A low thermal expansion medium layer having a linear thermal expansion coefficient less than that of the piezoelectric layer is laminated on the piezoelectric layer opposite to the boundary. Acoustic velocities of transversal waves at the piezoelectric layer, the dielectric layer, and the low thermal expansion medium layer satisfy Expression (1), and (an acoustic velocity of a transverse wave at the dielectric layer)/λ satisfies Expression (2) as follows: (acoustic velocity of transverse wave at dielectric layer)<(acoustic velocity of SH wave at piezoelectric layer)<(acoustic velocity of transverse wave at low thermal expansion medium layer) Expression (1), and (response frequency of boundary acoustic wave)<(acoustic velocity of transverse wave at dielectric layer)/λ<(response frequency of high order mode) Expression (2).
1. A boundary acoustic wave device comprising:
a piezoelectric layer;
a dielectric layer laminated on the piezoelectric layer;
an IDT electrode arranged at an interface between the piezoelectric layer and the dielectric layer; and
a low thermal expansion medium layer laminated on a surface of the piezoelectric layer opposite to the interface and made of a material having a linear thermal expansion coefficient less than that of the piezoelectric layer; wherein
the boundary acoustic wave device has a structure the propagates a SH boundary acoustic wave at the boundary between the piezoelectric layer and the dielectric layer; and
an acoustic velocity of a SH wave at the piezoelectric layer satisfies Expression (1), and when λ represents a wavelength of the IDT electrode, (an acoustic velocity of a transverse wave at the dielectric layer)/λ with respect to a response frequency of the SH boundary acoustic wave and to a response frequency in a high order mode satisfies Expression (2) as follows:
(acoustic velocity of transverse wave at dielectric layer)<(acoustic velocity of SH wave at piezoelectric layer)<(acoustic velocity of transverse wave at low thermal expansion medium layer) Expression (1); and
(response frequency of boundary acoustic wave)<(acoustic velocity of transverse wave at dielectric layer)/λ<(response frequency of high order mode) Expression (2).
2. The boundary acoustic wave device according to claim 1 , wherein the piezoelectric layer has a thickness in a range of about 1═ to about 50λ.
3. The boundary acoustic wave device according to claim 1 , wherein a sound absorbing layer is laminated on a surface of the dielectric layer opposite to the interface.
4. The boundary acoustic wave device according to claim 1 , wherein a structure arranged to scatter an elastic wave propagating to a surface of the dielectric layer opposite to the interface is provided at the surface of the dielectric layer opposite to the interface.
5. The boundary acoustic wave device according to claim 1 , further comprising a sound absorbing layer provided between the piezoelectric layer and the low thermal expansion medium layer.
6. The boundary acoustic wave device according to claim 1 , wherein the piezoelectric layer and the dielectric layer are made of insulating materials.
7. A boundary acoustic wave device comprising:
a piezoelectric layer;
a dielectric layer laminated on the piezoelectric layer;
an IDT electrode arranged at an interface between the piezoelectric layer and the dielectric layer; and
a low thermal expansion medium layer laminated on a surface of the piezoelectric layer opposite to the interface and made of a material having a linear thermal expansion coefficient less than that of the piezoelectric layer; wherein
the boundary acoustic wave device has a structure that propagates a Stoneley boundary acoustic wave at the boundary between the piezoelectric layer and the dielectric layer; and
an acoustic velocity of a SV wave at the piezoelectric layer satisfies Expression (1), and when λ represents a wavelength of the IDT electrode, (an acoustic velocity of a transverse wave at the dielectric layer)/λ with respect to a response frequency of the Stoneley boundary acoustic wave and to a response frequency in a high order mode satisfies Expression (2) as follows:
(acoustic velocity of transverse wave at dielectric layer)<(acoustic velocity of SV wave at piezoelectric layer)<(acoustic velocity of transverse wave at low thermal expansion medium layer) Expression (1), and
(response frequency of boundary acoustic wave)<(acoustic velocity of transverse wave at dielectric layer)/λ<(response frequency of high order mode) Expression (2).
8. The boundary acoustic wave device according to claim 7 , wherein the piezoelectric layer has a thickness in a range of about 1λ to about 50λ.
9. The boundary acoustic wave device according to claim 7 , wherein a sound absorbing layer is laminated on a surface of the dielectric layer opposite to the interface.
10. The boundary acoustic wave device according to claim 7 , wherein a structure arranged to scatter an elastic wave propagating to a surface of the dielectric layer opposite to the interface is provided at the surface of the dielectric layer opposite to the interface.
11. The boundary acoustic wave device according to claim 7 , further comprising a sound absorbing layer provided between the piezoelectric layer and the low thermal expansion medium layer.
12. The boundary acoustic wave device according to claim 7 , wherein the piezoelectric layer and the dielectric layer are made of insulating materials.