Flexible printed circuit board and electronic apparatus
A flexible printed circuit board includes: a base film that has electrical insulation property; a conductive pattern that is formed on the base film and including a pair of differential signal lines and a ground line; an insulating layer that is formed on the conductive pattern; a conductive layer that is formed on the insulating layer; and a connecting portion that electrically connects the ground line and the conductive layer through a penetration hole formed on the insulating layer.
1. An electronic device comprising:
a case; and
a flexible printed circuit board disposed in the case, the flexible printed circuit board comprising:
a base film comprising an electrical insulating property;
a conductive pattern made of a first metal material including a copper component, the conductive pattern being disposed on the base film wherein the conductive pattern comprises a pair of differential signal lines and a ground line;
an insulating layer formed on the conductive pattern;
a conductive layer formed on the insulating layer, wherein the conductive layer is made of a second metal material that includes a silver paste; and
an electrical connector between the ground line and the conductive layer through a penetration hole formed in the insulating layer, wherein the electrical connector is made of the second metal material.
2. The electronic device of claim 1 , wherein the conductive layer and the electrical connector are made of conductive silver paste.
3. The electronic device of claim 1 , wherein the conductive pattern is formed by etching a copper film.
4. The electronic device of claim 1 , wherein the second metal material comprises a binder resin and conductive particles dispersed in the binder resin, and
wherein the conductive layer and the electrical connector are configured to shield against electromagnetic noises.
5. An electronic device comprising:
a case; and
a flexible printed circuit board disposed in the case, the flexible printed circuit board comprising:
a base film comprising an electrical insulating property;
a conductive pattern disposed on the base film, wherein the conductive pattern comprises a pair of differential signal lines and a ground line, and wherein the conductive pattern is made of a first metal material;
an insulating layer disposed on the conductive pattern;
a conductive layer formed on the insulating layer, wherein the conductive layer is made of a second metal material; and
an electrical connector between the ground line and the conductive layer through a penetration hole formed in the insulating layer, wherein the electrical connector is made of the second metal material.
6. The electronic device of claim 5 , wherein the conductive layer and the electrical connector are formed of conductive silver paste.
7. The electronic device of claim 5 , wherein the conductive pattern is formed by etching a copper film.
8. The electronic device of claim 5 , wherein the second metal material comprises a binder resin and conductive particles dispersed in the binder resin, and
wherein the conductive layer and the electrical connector are configured to shield against electromagnetic noises.