Engineered wood fiber product substrates and their formation by laser processing

1. A method of engraving an engineered wood fiber substrate, comprising:

obtaining a pattern or graphic having different portions to be etched with different amounts of applied energy to produce an effect where at least a first portion of the pattern or graphic is more deeply etched into an engineered wood fiber substrate than at least a second portion;

producing an output to control a laser, the output includes information to etch the first portion of the pattern or graphic more deeply than the second portion; and

etching the pattern or graphic having the first portion more deeply etched than other portions on an engineered wood fiber substrate, wherein at least a section of the first portion or the second portion is etched by the laser at an EDPUT value between 2 watts-sec/mm 3 and 159.24 watts-sec/mm 3 .

2. A method as in claim 1 , wherein the engineered wood fiber substrate is MDF, and the pattern or graphic is a wood grain pattern formed on the MDF.

3. A method as in claim 1 , wherein the engineered wood fiber substrate is particleboard, and the pattern or graphic is a wood grain pattern formed on the particleboard.

4. A method as in claim 1 , wherein the output controls etching of the engineered wood fiber substrate over at least one dimension which is greater than 24 inches.

5. A method as in claim 1 , wherein the output controls etching of the engineered wood fiber substrate over at least one dimension which is greater than 48 inches.

6. A method as in claim 1 , wherein the output controls etching of the pattern or graphic over a distance greater than the native capability size of a single laser.

7. A method as in claim 6 , further comprising maintaining the laser stationary and moving a scan head to a first position with a linear motor and etching a first section of the engineered wood fiber substrate and subsequently moving the scan head to a second position with the linear motor and etching second section of the engineered wood fiber substrate.

8. A method as in claim 1 wherein said etching of the pattern or comprises etching a first section then moving either the engineered wood fiber substrate or the laser beam and etching a separate second section.

9. A method as in claim 8 , wherein said etching of the first and second sections is performed at different times by the same laser.

10. A method as in claim 8 , further comprising producing outputs for a first laser to etch the first section and for a second laser to etch the second section.

11. A method as in claim 6 wherein the output controls movement of controlled mirrors which change a position of the laser beam with respect to the engineered wood fiber substrate.

12. A method as in claim 6 , further comprising using a beam splitter to split a beam from the laser beam into multiple output beams.

13. A method as in claim 6 , further comprising controlling the movement of the engineered wood fiber substrate and changing an output position of the laser beam in synchronization with the movement of the engineered wood fiber substrate.

14. A method as in claim 8 , further comprising maintaining a consistent pattern at a seam portion between the first and second sections.

15. A method of applying a pattern or graphic to an engineered wood fiber substrates, comprising the steps of:

defining a wood grain pattern to be formed on a surface of a material which comprises wood fiber, the wood grain pattern having different portions which are intended to be etched at different EDPUT values to produce an effect where the different portions of the wood grain pattern are etched at different depths measured from the surface of the material;

defining EDPUT values between 2 watts-sec/mm 3 and 159.24 watts-sec/mm 3 for etching the different portions of the wood grain pattern;

producing a controlling output for a laser which is based on the wood grain pattern and the defined EDPUT values which causes the different portions of the wood grain pattern to be formed in the material at different depths; and

laser etching the wood grain pattern in the material in one continuous operation.

16. A method as in claim 15 , wherein the material is MDF.

17. A method as in claim 15 , wherein the material is particleboard.

18. A method as in claim 15 , wherein the controlling output produces the wood grain pattern over at least one dimension which is greater than 24 inches.

19. A method as in claim 15 , wherein the controlling output produces the pattern over a distance which is greater than the size of an area that can be natively etched by a single laser.

20. A method as in claim 1 , wherein said etching of the pattern or graphic is performed at a laser power between 1,000 and 5,000 W.

21. A method as in claim 1 , wherein said etching of the pattern or graphic is performed at a laser speed between 5 and 60 m/s.

22. A method as in claim 1 , wherein the EDPUT value at which at least a section of the pattern or graphic is etched by the laser is between 50 watts-sec/mm 3 and 159.24 watts-sec/mm 3 .

23. A method according to claim 15 , wherein said laser etching is performed with a laser power between 1,000 and 5,000 W.

24. A method according to claim 15 , wherein said laser etching is performed with a laser speed between 5 and 60 m/s.

25. A method as in claim 15 , wherein the wood grain pattern is a raster graphic and the output further comprises raster graphic information related to the wood grain pattern.

26. A method as in claim 15 , wherein the controlling output comprises data for operating the laser at an EDPUT value between 50 watts-sec/mm 3 and 159.24 watts-sec/mm 3 .

27. A method as in claim 1 , wherein the EDPUT value at which at least a section of the pattern or graphic is etched by the laser is between 2 watts-sec/mm 3 and 19.9 watts-sec/mm 3 .

28. A method as in claim 15 , wherein the controlling output comprises data for operating the laser at an EDPUT value between 2 watts-sec/mm 3 and 3.98 watts-sec/mm 3 to laser etch at least a section of the wood grain pattern.