IP Library Granted Patent US 8,072,045
Granted Patent B2
US 8,072,045 · App. 12/938,960 · Granted Dec 6, 2011

Extendable connector and network

Assignee: The Board of Trustees of the Leland Stanford Junior University
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Quick Facts
Patent No.
US 8,072,045
App. No.
12/938,960
Granted
Dec 6, 2011
Kind
B2
Abstract

Extendable connectors are facilitated. According to an example embodiment, an integrated electrical circuit uses a connector that has first and second connected ends. The connector is unbundled from an initial state in which the first and second connected ends are separated by a first proximate distance and applied in an extended state in which the first and second connected ends are separated by a second distance that is greater than the first proximate distance.

Claims (29)

1. A method of manufacturing an integrated electrical circuit that uses a connector that has first and second connected ends, the method comprising:

providing the connector from a material layer on a substrate; and

causing the connector to change from an initial state in which the first and second connected ends are separated by a first proximate distance, to an extended state in which the first and second connected ends are separated by a second distance that is at least an order of magnitude greater than the first proximate distance.

2. The method of claim 1 , further including removing the connector from the substrate.

3. The method of claim 1 , wherein the step of causing includes unbundling the connector, and prior to unbundling the connector, further includes

forming a circuit layer on the substrate; and

patterning the circuit layer to form the connector and circuit nodes coupled by the connector.

4. The method of claim 1 , further including

forming a layer of semiconductor material on the substrate;

forming at least one interconnect layer on a semiconductor material layer;

forming circuit devices at different locations in the semiconductor material, the circuit devices being electrically coupled to one another via at least one interconnect layer; and

using the interconnect layer to form the connector.

5. The method of claim 1 , further including the step of bonding the integrated electrical circuit to the substrate in the extended state.

6. The method of claim 1 , wherein, in each of at least one of the initial and extended states, the connector is not stretched.

7. The method of claim 1 , wherein the length of the connector in the initial and extended states is the same.

8. The method of claim 1 , further including the steps of unbundling and applying a multitude of connectors that form an interconnected network coupled via nodes at respective ends of each of the connectors.

9. The method of claim 1 , further including, applying the connector in an extended state, and providing the connector in a re-coiled state in which the first and second ends are separated by a proximate distance that is less than the second distance.

10. The method of claim 1 ,

wherein the connector is a conductor, and

further including applying the connector by using the connector to electrically couple circuit nodes.

11. The method of claim 1 , further including coupling the connector to sensors, and using the connector to set the sensors relative to a structure for sensing characteristics of the structure.

12. The method of claim 1 , wherein the connector is coiled in the initial state.

13. The method of claim 1 , further including applying the connector in an extended state in which the first and second connected ends are separated by a second distance that is greater than a threshold distance beyond which the connector cannot be stretched.

14. An integrated electrical circuit arrangement comprising:

an electrical connector to extend, from an initial state in which first and second connected ends of the connector are separated by a first proximate distance, to an extended state in which the first and second connected ends are separated by a second distance that is at least an order of magnitude greater than the first proximate distance;

a plurality of said electrical connectors; and

a plurality of circuit nodes, each electrical connector extending between and coupling a pair of the circuit nodes.

15. The arrangement of claim 14 , further including an electrical device at each circuit node.

16. The arrangement of claim 14 , further including a sensor at each circuit node to respond to conditions of a structure to which the integrated electrical circuit arrangement is applied.

Continuity (3)
Continuation 11854429 · Sep 12, 2007
Provisional Application 60844126 · Sep 12, 2006
Related Publication 20110042832A1 · Feb 24, 2011