Method and structure, using flexible membrane surfaces, for setting and/or maintaining a uniform micron/sub-micron gap separation between juxtaposed photosensitive and heat-supplying surfaces of photovoltaic chips and the like for the generation of electrical power

1. A near-field energy conversion device, comprising:

a thermal emitter substrate having a relatively hot inner surface and a radiation receiver substrate having a relatively cool inner surface;

the hot inner surface and the cool inner surface being adjacent juxtaposed surfaces defining there between a relatively cool side and a relatively hot side of the device separated by a gap of less than one micron;

an emitter membrane structure of pressure-compliant thermally conductive material covering an outer surface of the thermal emitter substrate opposite the hot inner surface and a receiver membrane structure of pressure-compliant thermally conductive material covering an outer surface of the radiation receiver substrate opposite the cool inner surface;

the emitter membrane structure for setting and maintaining uniformity of the gap, and providing thermal conductivity between impinging radiation and the outer surface of the thermal emitter substrate; and

the receiver membrane structure for setting and maintaining uniformity of the gap, and providing cooling to the radiation receiver substrate.

2. The device of claim 1 , wherein the receiver membrane structure is assembled with the outer surface of the radiation receiver substrate in a frame secured along the periphery of the radiation receiver substrate.

3. The device of claim 2 , wherein the frame includes an internal cavity chamber extending along the receiver membrane structure.

4. The device of claim 3 , wherein a coolant is passed through the internal cavity chamber.

5. The device of claim 1 , further comprising an array of thermally resistant gap spacers positioned in the gap between the relatively hot inner surface of the thermal emitter substrate and the relatively cool inner surface of the radiation receiver substrate.

6. The device of claim 1 , further comprising means for evacuating the gap between the relatively cool side and the relatively hot side of the device.

7. The device of claim 1 , wherein a single emitter compression support layer is positioned on the outer surface of the thermal emitter substrate.

8. The device of claim 7 , wherein the single emitter compression support layer maintains gap uniformity by applying a rigid external pressure to the outer surface of the thermal emitter substrate.

9. The device of claim 1 , wherein a single receiver compression support layer is positioned on the outer surface of the radiation receiver substrate.

10. The device of claim 9 , wherein the single receiver compression support layer maintains gap uniformity by applying a rigid external pressure to the outer surface of the radiation receiver substrate.

11. The device of claim 1 , wherein the emitter membrane structure and the receiver membrane structure comprise a wall enclosing a pressure-exerting fluid.

12. The device of claim 11 , wherein the emitter membrane structure exerts a pressure on the outer surface of the thermal emitter substrate that is a function of a coolant flow rate in the emitter membrane structure resulting in a compressive force through the gap.

13. The device of claim 11 , wherein the receiver membrane structure exerts a pressure on the outer and the radiation receiver surface of the radiation receiver substrate that is a function of a coolant flow rate in the receiver membrane structure resulting in a compressive force through the gap.

14. The device of claim 1 , further comprising a cool side compliant layer positioned between the outer surface of the radiation receiver substrate and the receiver membrane structure to ensure efficient cooling of the radiation receiver substrate,

and a hot side compliant layer positioned between the thermal emitter substrate and the membrane structure to ensure efficient heat transfer to the thermal emitter substance.

15. The device of claim 1 , further comprising a hot side compliant layer positioned between the outer surface of the thermal emitter substrate and the emitter membrane structure to ensure efficient heat transfer to the thermal emitter substrate.

16. The device of claim 7 , further comprising a hot side compliant layer positioned between the emitter compression support layer and the outer surface of the thermal emitter substrate to ensure efficient heat transfer to the thermal emitter substrate.

17. The device of claim 9 , further comprising a cool side compliant layer positioned between the receiver compression support layer and the outer surface of the radiation receiver substrate to ensure efficient cooling of the radiation receiver substrate.

18. The device of claim 1 , further comprising an emitter stress-compensating layer, of substantially the same material as the thermal emitter substrate, within the emitter membrane structure to ensure that a pressure exerted by the emitter membrane structure does not result in deformation of the thermal emitter substrate.

19. The device of claim 1 , further comprising a receiver stress-compensating layer, of substantially the same material as the radiation receiver substrate, within the receiver membrane structure to ensure that a pressure exerted by the receiver membrane structure does not result in deformation of the radiation receiver substrate.

20. The device of claim 1 , wherein a thickness of the emitter membrane structure is adjusted to provide a flexing compliance to compensate for mechanical deformation of the thermal emitter and radiation receiver substrates.

21. The device of claim 1 , wherein a thickness of the receiver membrane structure is adjusted to provide a flexing compliance to compensate for mechanical deformation of the thermal emitter and radiation receiver substrates.

22. The device of claim 1 , wherein the radiation receiver comprises a PV cell.

23. The device of claim 1 , wherein the thermal emitter comprises an array of quantum dots.

24. The device of claim 1 , wherein the radiation receiver and thermal emitter comprise an MTPV system.