Method and device for three-dimensional path planning to avoid obstacles using multiple planes

1. An obstacle-avoidance-processor chip for three-dimensional path planning, the obstacle-avoidance-processor chip comprising:

an analog processing circuit communicatively coupled to receive data from an inertial measurement unit and from at least one obstacle-detection sensor, the analog processing circuit configured to construct a three-dimensional obstacle map of an environment based on the received data; and

at least two analog-resistive-grid networks, configured to map obstacles in at least two respective non-parallel planes in the constructed three-dimensional obstacle map, and form a quasi-three-dimensional representation of the environment;

wherein the obstacle-avoidance-processor chip generates information indicative of a three-dimensional unobstructed path in the environment.

2. The chip of claim 1 , wherein the at least two analog-resistive-grid networks comprise:

a first high-density analog-resistive-grid network configured to map obstacles in a first plane in which the vehicle is moving; and

a second low-density analog-resistive-grid network configured to map obstacles in a second plane that includes a line indicative of a heading of the vehicle.

3. The chip of claim 2 , wherein the second plane is orthogonal to the first plane.

4. The chip of claim 2 , wherein the second plane changes as a direction of propagation of the vehicle changes.

5. The chip of claim 1 , wherein a first selected-potential on the analog-resistive-grid networks indicates an obstacle, a second selected potential having a value less than the first selected potential indicates a destination, and a currently-planned-unobstructed path is generated following a potential gradient from a potential of a current location of the vehicle as represented by a point on the analog-resistive-grid networks.

6. The chip of claim 1 , wherein the analog processing circuit comprises an analog stereo processing circuit configured to construct the environment by fusing information indicative of the currently-planned-unobstructed path with sensor data received from the inertial measurement unit and at least two obstacle-detection sensors that are spatially offset from each other.

7. The chip of claim 1 , wherein the analog processing circuit is communicatively coupled to receive data from a global positioning system.

8. The chip of claim 1 , further comprising:

at least one first input interface configured to receive sensor data indicative of obstacles in the environment from the at least one obstacle-detection sensor; and

a second input interface to receive data indicative of a relative position of a vehicle in the environment from the inertial measurement unit.

9. An integrated module for three-dimensional path planning, the integrated module comprising:

an inertial measurement unit;

at least one obstacle-detection sensor; and

an obstacle-avoidance-processor chip comprising:

an analog processing circuit communicatively coupled to receive data indicative of a relative position of a vehicle in an environment from the inertial measurement unit and to receive sensor data indicative of obstacles in the environment from the at least one obstacle-detection sensor, the analog processing circuit configured to construct a three-dimensional obstacle map based on the received data; and

at least two analog-resistive-grid networks configured to map obstacles in at least two respective non-parallel planes, wherein the at least two analog-resistive-grid networks represent at least two respective cross-sections of a constructed three-dimensional obstacle map, wherein the at least two respective cross-sections of the constructed three-dimensional obstacle map form a quasi-three-dimensional representation of the environment,

wherein the obstacle-avoidance-processor chip generates information indicative of at least one unobstructed path in the environment based on the obstacle maps.

10. The integrated module of claim 9 , wherein the received sensor data is used to update voltage points on the at least two analog-resistive-grid networks.

11. The integrated module of claim 9 , wherein the at least one obstacle-detection sensor comprises at least one optical imaging system or at least one radar imaging system.

12. The integrated module of claim 9 , wherein the inertial measurement unit senses a heading and orientation of a vehicle housing the integrated module.

13. The integrated module of claim 9 , wherein the information indicative of at least one unobstructed path is implemented to determine a velocity of a vehicle housing the integrated module.

14. The integrated module of claim 9 , wherein the obstacle-detection sensor iteratively sends range data and probability-of-collision data to the obstacle-avoidance-processor chip, and wherein the obstacle-avoidance-processor chip generates a pre-selected voltage on at least one obstacle map when a probability-of-collision exceeds a pre-selected threshold.

15. A method of planning an unobstructed three-dimensional path for a vehicle, the method comprising:

receiving information indicative of the environment in which the vehicle is moving;

constructing a three-dimensional obstacle map of the environment based on the information indicative of the environment;

executing software to solve Laplacian equations for a high-density analog-resistive-grid network;

executing software to solve Laplacian equations for at least one lower-density analog-resistive-grid network; and

producing an unobstructed three-dimensional path for the vehicle to follow based on the executions of the software to solve Laplacian equations.

16. The method of claim 15 , further comprising:

extracting at least a first plane and a second plane non-parallel to the first plane from the constructed three-dimensional obstacle map, wherein the first plane is indicative of the plane in which the vehicle is moving, and wherein the second plane is indicative of a plane containing a line indicative of a heading of the vehicle;

mapping obstacles in a first plane based on the executing software to solve Laplacian equations for the high-density analog-resistive-grid network; and

mapping obstacles in a second plane based on executing software to solve Laplacian equations for the at least one lower-density analog-resistive-grid network, wherein the mapped obstacles are represented as a selected voltage within the high-density analog-resistive-grid network and the at least one lower-density analog-resistive-grid network.

17. The method of claim 16 , further comprising:

reconstructing the three-dimensional obstacle map based on receiving updated information indicative of the environment;

updating voltage points on at least one of the lower-density analog-resistive-grid network and the high-density analog-resistive-grid network responsive to reconstructing the three-dimensional obstacle map; and

producing an updated unobstructed three-dimensional path for the vehicle to follow based on the executions of the software to solve Laplacian equations.

18. The method of claim 16 , further comprising:

updating the map to reflect a motion of the vehicle.