IP Library › Granted Patent US 8,080,363
Granted Patent B2
US 8,080,363 · App. 12/207,345 · Granted Dec 20, 2011

Resin for hydrophobitizing resist surface, method for manufacturing the resin, and positive resist composition containing the resin

Assignee: Fujifilm Corporation
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Quick Facts
Patent No.
US 8,080,363
App. No.
12/207,345
Granted
Dec 20, 2011
Kind
B2
Abstract

A resin to be added to a resist composition and locally distributed on a resist film surface to hydrophobitize the resist film surface includes a residual monomer in an amount of 1 mass % or less to the resin as a whole in terms of solid content.

Claims (46)

1. A resin to be added to a resist composition and locally distributed on a resist film surface to hydrophobitize the resist film surface, the resin comprising: a residual monomer in an amount of 1 mass % or less to the resin as a whole in terms of solid content, said resin being manufactured by a method comprising passing a solution containing a resin obtained by polymerization through a filter comprising a porous polyolefin film having a cation exchange group.

2. A method for manufacturing the resin as claimed in claim 1 , the method comprising:

passing a solution containing a resin obtained by polymerization through a filter comprising a porous polyolefin film having a cation exchange group.

3. A method for manufacturing the resin claimed in claim 1 , the method comprising:

passing a solution containing a resin obtained by polymerization through a filter having positive ζ-potential.

4. The method as claimed in claim 2 , wherein

the purity of a monomer for use in the synthesis of the resin is 99% or more.

5. The method as claimed in claim 3 , wherein the purity of a monomer for use in the synthesis of the resin is 99% or more.

6. The method as claimed in claim 2 , further comprising:

removing a radical capturing material, before the polymerization, from at least one of (a) a solution containing a monomer, a radical polymerization initiator, and a solvent, and (b) a solvent in the reaction vessel.

7. The method as claimed in claim 3 , further comprising:

removing a radical capturing material, before the polymerization, from at least one of (a) a solution containing a monomer, a radical polymerization initiator, and a solvent, and (b) a solvent in the reaction vessel.

8. The method as claimed in claim 2 , further comprising:

bringing the resin obtained by polymerization into contact with an aqueous solution.

9. The method as claimed in claim 3 , further comprising:

bringing the resin obtained by polymerization into contact with an aqueous solution.

10. The method as claimed in claim 2 , further comprising:

performing, after precipitation-purifying the resin obtained by polymerization, at least either treatment of (i) a repulping treatment using a poor solvent, or (ii) a rinsing treatment using a poor solvent.

11. The method as claimed in claim 3 , further comprising:

performing, after precipitation-purifying the resin obtained by polymerization, at least either treatment of (i) a repulping treatment using a poor solvent, or (ii) a rinsing treatment using a poor solvent.

12. A positive resist composition comprising:

(A) a resin having a monocyclic or polycyclic alicyclic hydrocarbon structure, and capable of increasing the solubility in an alkali developing solution by the action of an acid,

(B) a compound capable of generating an acid upon irradiation with actinic ray or radiation,

(C) the resin as claimed in claim 1 , and

(D) a solvent.

13. A pattern-forming method comprising:

forming a resist film with the positive resist composition as claimed in claim 12 ,

exposing the resist film, and

developing the resist film.

14. The resin as claimed in claim 1 , wherein the purity of a monomer for use in the synthesis of the resin is 99% or more.

15. The resin as claimed in claim 1 , wherein the method of manufacturing the resin further comprises:

removing a radical capturing material, before the polymerization, from at least one of (a) a solution containing a monomer, a radical polymerization initiator, and a solvent, and (b) a solvent in the reaction vessel.

16. The resin as claimed in claim 1 , wherein the method of manufacturing the resin further comprises:

bringing the resin obtained by polymerization into contact with an aqueous solution.

17. The resin as claimed in claim 1 , wherein the method of manufacturing the resin further comprises:

performing, after precipitation-purifying the resin obtained by polymerization, at least either treatment of (i) a repulping treatment using a poor solvent, or (ii) a rinsing treatment using a poor solvent.

18. A resin to be added to a resist composition and locally distributed on a resist film surface to hydrophobitize the resist film surface, the resin comprising:

a residual monomer in an amount of 1 mass% or less to the resin as a whole in terms of solid content, said resin being manufactured by a method comprising passing a solution containing a resin obtained by polymerization through a filter having positive ζ-potential.

19. The resin as claimed in claim 18 , wherein

the purity of a monomer for use in the synthesis of the resin is 99% or more.

20. The resin as claimed in claim 18 , wherein the method of manufacturing the resin further comprises:

removing a radical capturing material, before the polymerization, from at least one of (a) a solution containing a monomer, a radical polymerization initiator, and a solvent, and (b) a solvent in the reaction vessel.

21. The resin as claimed in claim 18 , wherein the method of manufacturing the resin further comprises:

bringing the resin obtained by polymerization into contact with an aqueous solution.

22. The resin as claimed in claim 18 , wherein the method of manufacturing the resin further comprises:

performing, after precipitation-purifying the resin obtained by polymerization, at least either treatment of (i) a repulping treatment using a poor solvent, or (ii) a rinsing treatment using a poor solvent.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 9, 2008
From: KANDA, HIROMI
To: FUJIFILM CORPORATION
Reel/Frame 021505/0171 →
Priority Claims (1)
JP 2008-071483 · Mar 19, 2008 · national
Continuity (1)
Related Publication 20090239176A1 · Sep 24, 2009