IP Library Granted Patent US 8,088,554
Granted Patent B2
US 8,088,554 · App. 12/656,825 · Granted Jan 3, 2012

Bottom resist layer composition and patterning process using the same

Assignee: Shin-Etsu Chemical Co., Ltd
View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 8,088,554
App. No.
12/656,825
Filed
Feb 17, 2010
Granted
Jan 3, 2012
Kind
B2
Art Unit
1722
USPC
430/270.1
Abstract

There is disclosed a bottom resist layer composition for a multilayer-resist film used in lithography which comprises, at least, a polymer having a repeating unit represented by the following general formula (1). Thereby, there can be provided a bottom resist layer composition which shows an antireflection effect against an exposure light by combining with an intermediate resist layer having an antireflection effect if necessary, has a higher etching resistance during etching a substrate than polyhydroxy styrene, cresol novolac resin, etc., has a high poisoning-resistant effect, and is suitable for using in a multilayer-resist process like a bilayer resist process or a trilayer resist process.

Claims (8)

1. A bottom resist layer composition for a multilayer-resist film used in lithography which comprises, at least, a polymer having a repeating unit represented by the following general formula (1),

wherein

R 1 represents any one of a hydrogen atom, a linear or branched alkyl group having 1-10 carbon atoms, an aryl group having 6-10 carbon atoms, a linear or branched alkenyl group having 2-10 carbon atoms, and a halogen atom,

R 2 and R 12 independently represent any one of a hydrogen atom, a linear, branched or cyclic alkyl group having 1-6 carbon atoms, a linear, branched or cyclic alkenyl group having 2-6 carbon atoms, an aryl group having 6-10 carbon atoms, an acyl group or an alkoxy carbonyl group having 1-10 carbon atoms, a group forming an acetal group with an oxygen atom bonded with R 2 or R 12 in the above general formula (I), and a glycidyl group,

R 3 and R 13 independently represent any one of a hydrogen atom, a linear, branched or cyclic alkyl group having 1-10 carbon atoms, and an aryl group having 6-10 carbon atoms,

a and b satisfy 0<a<1, 0<b<1, and 0<a+b≦1, and Z represents any one of indene, benzothiophene, anthracene, acenaphthylene, pyrene, fluorene, phenanthrene, azulene, heptalene, biphenylene, indacene, fluoracene, naphthacene, aceanthrylene, and perylene,

wherein the multilayer-resist film is a trilayer resist film comprising a bottom resist layer formed on a substrate, an intermediate resist layer containing silicon atoms formed on the bottom resist layer, and a top resist layer of a photoresist composition formed on the intermediate resist layer.

2. The bottom resist layer composition according to claim 1 wherein the bottom resist layer composition further contains one or more of any one of a cross-linker, an acid generator and an organic solvent.

Priority Claims (1)
JP 2005-116897 · Apr 14, 2005 · national
Continuity (2)
Division 11373199 · Mar 13, 2006
Related Publication 20100151382A1 · Jun 17, 2010