IP Library Granted Patent US 8,092,644
Granted Patent B2
US 8,092,644 · App. 11/421,983 · Granted Jan 10, 2012

Method and apparatus for cleaning and surface conditioning objects using plasma

Assignee: IonField Systems, LLC
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Quick Facts
Patent No.
US 8,092,644
App. No.
11/421,983
Granted
Jan 10, 2012
Kind
B2
Abstract

An apparatus and method for cleaning objects using plasma are disclosed. The apparatus provides a plurality of elongated dielectric barrier members arranged adjacent each other, a plurality of electrodes each contained within, and extending substantially along the length of, the plurality of elongated dielectric barrier members, and at least one buss bar for electrically coupling the plurality of electrodes to a voltage source. The method provides providing a plurality of elongated dielectric barrier members arranged adjacent each other, providing a plurality of electrodes each contained within, and extending substantially along the length of the plurality of elongated dielectric barrier members, providing at least one buss bar connected to the plurality of electrodes, electrically coupling the plurality of electrodes to a voltage source through the at least one buss bar, introducing the objects proximate the plurality of elongated dielectric barrier members, generating a dielectric barrier discharge between the plurality of dielectric barrier members and the objects; and forming plasma to clean at least a portion of the objects.

Claims (30)

1. An apparatus for cleaning objects a plurality of grounded conductive probes using plasma, comprising:

a microplate provided with

a plurality of elongated dielectric barrier members arranged adjacent each other;

a plurality of electrodes, each electrode contained within and extending substantially along the length of the plurality of elongated dielectric barrier members; wherein said plurality of electrodes are spaced and positioned for receipt of the plurality of grounded conductive probes to be cleaned between adjacent electrodes; and

at least one buss bar for electrically coupling the plurality of electrodes to a voltage source.

2. The apparatus of claim 1 , further comprising conductive tabs, each coupled between respective ones of the plurality of electrodes and the at least one buss bar.

3. The apparatus of claim 1 , further comprising conductive pieces of wire, each coupled between respective ones of the plurality of electrodes and the at least one buss bar.

4. The apparatus of claim 1 , further comprising a conductive epoxy coating for electrically coupling each of the plurality of electrodes to the at least one buss bar.

5. The apparatus of claim 1 , further comprising an epoxy coating applied to the at least one buss bar, wherein the epoxy coating prevents arcing of a dielectric barrier discharge.

6. The apparatus of claim 1 , wherein the at least one buss bar comprises a conductive member and a flexible support member connected to a base support;

wherein the flexible support member is positioned proximate the conductive member and proximate the plurality of dielectric barrier members;

wherein the flexible support member substantially decouples movement of the plurality of dielectric barrier members and respective electrodes from the conductive member of the at least one buss bar.

7. The apparatus of claim 6 , further comprising a gap between the flexible support member and the conductive member.

8. The apparatus of claim 6 , wherein the flexible support member substantially comprises a fluoropolymeric material.

9. The apparatus of claim 6 , wherein the flexible support member further comprises an elastomeric component to connect the flexible support member to the base support, wherein the elastomeric component absorbs shock generated during cleaning.

10. The apparatus of claim 6 , wherein the at least one flexible support comprises a fluoropolymer resin.

11. The apparatus of claim 10 , wherein the fluoropolymer resin comprises polytetrafluoroethylene.

12. The apparatus of claim 1 , wherein the said plurality of electrodes are spaced and positioned for receipt of said plurality of grounded conductive probes which are arranged in a microtiter plate matrix format.

13. The apparatus of claim 1 , wherein the at least one buss bar comprises recessed portions for receiving and supporting at least a portion of each of the plurality of elongated dielectric barrier members.

14. An apparatus for cleaning objects using plasma, comprising:

a microplate provided with

a plurality of elongated dielectric barrier members arranged adjacent each other;

a plurality of electrodes each contained within, and extending substantially along the length of the plurality of elongated dielectric barrier members;

wherein said plurality of electrodes are spaced and positions for receipt of one or more object to be cleaned between adjacent electrodes; and

at least one buss bar for electrically coupling the plurality of electrodes to a voltage source, wherein the object to be cleaned is coupled to ground relative to said voltage source;

wherein the at least one buss bar comprises a conductive member and a flexible support member proximate the conductive member and proximate the plurality of dielectric barrier members, wherein the flexible support member substantially decouples movement of the plurality of dielectric barrier members and respective electrodes from the conductive member of the at least one buss bar.

15. The apparatus of claim 14 , further comprising conductive tabs, each coupled between respective ones of the plurality of electrodes and the conductive member.

16. The apparatus of claim 14 , further comprising conductive pieces of wire, each coupled between respective ones of the plurality of electrodes and the conductive member.

17. The apparatus of claim 14 , wherein the apparatus is arranged in a microtiter plate matrix format.

18. The apparatus of claim 14 , wherein the at least one flexible support member is arranged to support and isolate at least a portion of each of the plurality of elongated dielectric barrier members.

Assignments (8)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 20, 2012
From: IONFIELD SYSTEMS, LLC
To: IONFIELD HOLDINGS, LLC
Reel/Frame 028600/0766 →
CHANGE OF NAME Recorded Jan 28, 2010
From: IONFIELD SYSTEMS, INC.
To: IONFIELD SYSTEMS, LLC
Reel/Frame 023866/0267 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 27, 2010
From: CERIONX, INC.
To: IONFIELD SYSTEMS, INC.
Reel/Frame 023859/0484 →
RELEASE OF SECURITY INTEREST Recorded Jul 19, 2007
From: COMERICA BANK
To: CERIONX, INC.
Reel/Frame 019573/0893 →
RELEASE OF SECURITY INTEREST Recorded Jul 19, 2007
From: COMERICA BANK
To: CERIONX, INC.
Reel/Frame 019573/0888 →
SECURITY AGREEMENT Recorded Oct 6, 2006
From: CERIONX, INC.
To: COMERICA BANK
Reel/Frame 018362/0326 →
SECURITY AGREEMENT Recorded Oct 6, 2006
From: CERIONX, INC.
To: COMERICA BANK
Reel/Frame 018363/0579 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jun 2, 2006
From: KURUNCZI, PETER FRANK
To: CERIONX, INC.
Reel/Frame 017714/0952 →
Continuity (9)
Continuation In Part 11142988 · Jun 2, 2005
Continuation In Part 11143083 · Jun 2, 2005
Continuation In Part 11143552 · Jun 2, 2005
Continuation In Part 11043787 · Jan 26, 2005
Continuation In Part 11040222 · Jan 21, 2005
Continuation In Part 11036628 · Jan 20, 2005
Division 10858272 · Jun 1, 2004
Provisional Application 60478418 · Jun 16, 2003
Related Publication 20060201534A1 · Sep 14, 2006