IP Library Granted Patent US 8,094,924
Granted Patent B2
US 8,094,924 · App. 12/335,458 · Granted Jan 10, 2012

E-beam defect review system

Assignee: Hermes-Microvision, Inc.
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Quick Facts
Patent No.
US 8,094,924
App. No.
12/335,458
Granted
Jan 10, 2012
Kind
B2
Abstract

An apparatus comprises an imaging unit to image a wafer to be reviewed, wherein imaging unit is the modified SORIL column. The modified SORIL column includes a focusing sub-system to do micro-focusing due to a wafer surface topology, wherein the focusing sub-system verifies the position of a grating image reflecting from the wafer surface to adjust the focus; and a surface charge control to regulate the charge accumulation due to electron irradiation during the review process, wherein the gaseous molecules are injected under a flood gun beam rather than under a primary beam. The modified SORIL column further includes a storage unit for storing wafer design database; and a host computer to manage defect locating, defect sampling, and defect classifying, wherein the host computer and storage unit are linked by high speed network.

Claims (15)

1. An apparatus comprises:

an imaging unit to image a wafer to be reviewed, wherein imaging unit is the modified SORIL column;

a focusing sub-system to do micro-focusing due to a wafer surface topology, wherein the focusing sub-system verifies the position of a grating image reflecting from the wafer surface to adjust the focus;

a surface charge control to regulate the charge accumulation due to electron irradiation during the review process, wherein the gaseous molecules are injected under a flood gun beam rather than under a primary beam;

a storage unit for storing wafer design database; and

a host computer to manage defect locating, defect sampling, and defect classifying, wherein the host computer and storage unit are linked by high speed network.

2. The apparatus of claim 1 , wherein the host computer and storage database is a clustering computer system based on high speed network.

3. A system for automatic defects review on semiconductor integrated circles wafer comprising:

an imaging unit to image a wafer to be reviewed, wherein imaging unit is the modified SORIL column;

a focusing sub-system to do micro-focusing due to a wafer surface topology, wherein the focusing sub-system verifies the position of a grating image reflecting from the wafer surface to adjust the focus;

a surface charge control to regulate the charge accumulation due to electron irradiation during the review process, wherein the gaseous molecules are injected under a flood gun beam rather than under a primary beam;

a storage unit for storing wafer design database; and

a host computer to manage defect locating, defect sampling, and defect classifying, wherein the host computer and storage unit are linked by high speed network.

4. The system of claim 3 , wherein the defect locating, and defect sampling, includes a Smart Review Sampling Filter.

5. The system of claim 3 , wherein the defect classifying is can be based on the Universal Defect Locating Unit.

Assignments (3)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 29, 2020
From: HERMES MICROVISION, INC.
To: HERMES MICROVISION INCORPORATED B.V.
Reel/Frame 054866/0742 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 29, 2020
From: HERMES MICROVISION INCORPORATED B.V.
To: ASML NETHERLANDS B.V.
Reel/Frame 054870/0156 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 16, 2008
From: JAU, JACK; CHEN, ZHONGWEI; WANG, YI XIANG; PAN, CHUNG-SHIH; WANG, JOE; LIU, XUEDONG; REN, WEIMING; FANG, WEI
To: HERMES-MICROVISION, INC.
Reel/Frame 021989/0876 →
Continuity (1)
Related Publication 20100150429A1 · Jun 17, 2010