Fluid ejection device

1. A fluid ejection device, comprising:

a fluid chamber;

a resistor formed within the fluid chamber;

a fluid restriction communicated with the fluid chamber; and

an orifice communicated with the fluid chamber,

wherein the fluid ejection device is adapted to eject drops of a non-aqueous fluid,

wherein a width of the fluid restriction is approximately equal to or greater than a length of the fluid restriction with the width of the fluid restriction being in a range of approximately 10 microns to approximately 16 microns in combination with the length of the fluid restriction being in a range of approximately 5 microns to approximately 10 microns, and

wherein a ratio of a square root of an area of the resistor to a diameter of the orifice is in a range of approximately 1.75 to approximately 2.25.

2. The fluid ejection device of claim 1 , wherein the area of the resistor is in a range of approximately 450 square microns to approximately 675 square microns.

3. The fluid ejection device of claim 1 , wherein the diameter of the orifice is in a range of approximately 10 microns to approximately 15 microns.

4. The fluid ejection device of claim 1 , wherein the area of the resistor is in a range of approximately 450 square microns to approximately 675 square microns, and wherein the diameter of the orifice is in a range of approximately 10 microns to approximately 15 microns.

5. The fluid ejection device of claim 1 , wherein the fluid chamber is defined with a barrier layer and the orifice is formed in an orifice layer, wherein a thickness of the barrier layer is greater than a thickness of the orifice layer with the thickness of the barrier layer being approximately 14 microns in combination with the thickness of the orifice layer being approximately 9 microns.

6. The fluid ejection device of claim 1 , further comprising:

a supply of the non-aqueous fluid communicated with the fluid chamber,

wherein the non-aqueous fluid has a surface tension in a range of approximately 19 dynes/centimeter to approximately 27 dynes/centimeter, and a viscosity in a range of approximately 0.4 centipoise to approximately 2.5 centipoise.

7. A fluid ejection device, comprising:

a substrate;

a barrier layer formed on the substrate and defining a fluid chamber;

an orifice layer extended over the barrier layer and having an orifice communicated with the fluid chamber; and

a resistor formed on the substrate and communicated with the fluid chamber,

wherein the fluid ejection device is adapted to eject drops of a non-aqueous fluid,

wherein a thickness of the barrier layer is greater than a thickness of the orifice layer with the thickness of the barrier layer being approximately 14 microns in combination with the thickness of the orifice layer being approximately 9 microns, and

wherein a ratio of a square root of an area of the resistor to a diameter of the orifice is in a range of approximately 1.75 to approximately 2.25.

8. The fluid ejection device of claim 7 , wherein the area of the resistor is in a range of approximately 450 square microns to approximately 675 square microns.

9. The fluid ejection device of claim 7 , wherein the diameter of the orifice is in a range of approximately 10 microns to approximately 15 microns.

10. The fluid ejection device of claim 7 , wherein the barrier layer further defines a fluid restriction communicated with the fluid chamber and a fluid channel communicated with the fluid restriction,

wherein a width of the fluid restriction is approximately equal to or greater than a length of the fluid restriction with the width of the fluid restriction being in a range of approximately 10 microns to approximately 16 microns in combination with the length of the fluid restriction being in a range of approximately 5 microns to approximately 10 microns.

11. The fluid ejection device of claim 10 , wherein the substrate has a fluid feed slot formed therein, wherein the fluid channel is communicated with the fluid feed slot, and wherein a distance from an edge of the fluid feed slot to a center of the fluid chamber is in a range of approximately 51 microns to approximately 61 microns.

12. The fluid ejection device claim 7 , further comprising:

a supply of the non-aqueous fluid communicated with the fluid chamber,

wherein the non-aqueous fluid has a surface tension in a range of approximately 19 dynes/centimeter to approximately 27 dynes/centimeter, and a viscosity in a range of approximately 0.4 centipoise to approximately 2.5 centipoise.

13. A method of forming a fluid ejection device, comprising: forming a barrier layer on a substrate, including defining a fluid chamber with the barrier layer; extending an orifice layer over the barrier layer, including communicating an orifice of the orifice layer with the fluid chamber; and forming a resistor on the substrate, including communicating the resistor with the fluid chamber, wherein the fluid ejection device is adapted to eject drops of a non-aqueous fluid, and wherein a thickness of the barrier layer is greater than a thickness of the orifice layer with the thickness of the barrier layer being approximately 14 microns in combination with the thickness of the orifice layer being approximately 9 microns, and wherein a ratio of a square root of an area of the resistor to a diameter of the orifice is in a range of approximately 1.75 to approximately 2.25.

14. The method of claim 13 , wherein the area of the resistor is in a range of approximately 450 square microns to approximately 675 square microns.

15. The method of claim 13 , wherein the diameter of the orifice is in a range of approximately 10 microns to approximately 15 microns.

16. The method of claim 13 , wherein forming the barrier layer further includes defining a fluid restriction communicating with the fluid chamber and a fluid channel communicating with the fluid restriction,

wherein the fluid restriction has a width in a range of approximately 10 microns to approximately 16 microns, and a length in a range of approximately 5 microns to approximately 10 microns.

17. The method of claim 16 , further comprising:

forming a fluid feed slot in the substrate,

wherein defining the fluid channel includes communicating the fluid channel with the fluid feed slot, and wherein a distance from an edge of the fluid feed slot to a center of the fluid chamber is in a range of approximately 51 microns to approximately 61 microns.

18. The method of claim 13 , wherein the non-aqueous fluid has a surface tension in a range of approximately 19 dynes/centimeter to approximately 27 dynes/centimeter, and a viscosity in a range of approximately 0.4 centipoise to approximately 2.5 centipoise.

19. The fluid ejection device of claim 1 , wherein, with the width of the fluid restriction being approximately equal to or greater than the length of the fluid restriction and the width of the fluid restriction being in a range of approximately 10 microns to approximately 16 microns in combination with the length of the fluid restriction being in a range of approximately 5 microns to approximately 10 microns, and the ratio of the square root of the area of the resistor to the diameter of the orifice being in the range of approximately 1.75 to approximately 2.25, the fluid ejection device is adapted to eject drops of the non-aqueous fluid with a drop weight in a range of approximately 1.5 nanograms to approximately 4.0 nanograms.

20. The fluid ejection device of claim 7 , wherein, with the thickness of the barrier layer being greater than the thickness of the orifice layer and the thickness of the barrier layer being approximately 14 microns in combination with the thickness of the orifice layer being approximately 9 microns, and the ratio of the square root of the area of the resistor to the diameter of the orifice being in the range of approximately 1.75 to approximately 2.25, the fluid ejection device is adapted to eject drops of the non-aqueous fluid with a drop weight in a range of approximately 1.5 nanograms to approximately 4.0 nanograms.