Semiconductor device manufacturing method and semiconductor device manufacturing apparatus
There is provided a semiconductor device manufacturing apparatus and a semiconductor device manufacturing method capable of recovering a damage of a low dielectric insulating film exposed to CO 2 plasma to obtain the low dielectric insulating film in a good state, thus improving performance and reliability of a semiconductor device. The semiconductor device manufacturing method includes: an etching process for etching a low dielectric insulating film formed on a substrate; a CO 2 plasma process for exposing the substrate to CO 2 plasma after the etching process; and a UV process for irradiating UV to the low dielectric insulating film after the CO 2 plasma process.
1. A semiconductor device manufacturing method comprising:
an etching process for etching a low dielectric insulating film formed on a substrate;
a CO 2 plasma process for exposing the substrate to CO 2 plasma after the etching process;
a UV process for irradiating UV to the low dielectric insulating film after the CO 2 plasma process to reduce polarization in the low dielectric insulation film; and
a silylation process for silylating the low dielectric insulating film after the UV process.
2. The manufacturing method of claim 1 , wherein the CO 2 plasma process is a CO 2 plasma ashing process for removing a photoresist layer used as an etching mask in the etching process.
3. The manufacturing method of claim 1 , wherein the CO 2 plasma process is a cleaning process for removing deposits generated in the etching process.
4. A semiconductor device manufacturing method comprising:
a mask forming process for forming an etching mask, which has a preset circuit pattern, on a surface of a low dielectric insulating film formed on a substrate;
an etching process for forming a groove or a hole in the low dielectric insulating film by etching the low dielectric insulating film through the etching mask;
a CO 2 plasma process for removing the etching mask by using CO 2 plasma after the etching process;
a UV process for irradiating UV to the low dielectric insulating film after the CO 2 plasma process to reduce polarization in the low dielectric insulation film; and
a silylation process for silylating the low dielectric insulating film after the UV process.
5. The manufacturing method of claim 4 , further comprising:
a metal burying process for filling the groove or the hole with a conductive metal after the silylation process.