Circuit board of communication product and manufacturing method thereof
The present invention provides a circuit board of a communication product and a manufacturing method thereof. The circuit board comprises a main body of a circuit board and an isolation cover. A surface of the main body of the circuit board has a power transistor, an insulating layer, a plurality of first openings disposed at intervals on the insulating layer and around the power transistor, and a plurality of soldering portions exposed from the first openings respectively. The isolation cover comprises a cover body and a plurality of second openings equidistantly opened on a lateral side of the cover body. The isolation cover is disposed on the surface of the main body of the circuit board, and is soldered to the soldering portions through a local spot soldering process.
1. A circuit board applied to a communication product, comprising:
a power transistor;
a main body having a surface that the power transistor is embedded within, the surface including
an insulating layer,
a plurality of first openings disposed at intervals in the insulating layer and around the power transistor, and
a plurality of soldering portions each being exposed from a respective one of the first openings; and
an isolation cover covering the main body, a cover body of the isolation cover being soldered to each soldering portion, and a plurality of second openings being equidistantly spaced on a lateral side of the cover body,
a width of each second opening is between 1λ and 2λ, wherein λ=ν/f and
λ is a wavelength of a wave emitted from the communication product,
ν is a speed (m/s) of the wave, and
f is a frequency (Hz) of the wave, a maximum value off being 26.5 GHz.
2. The circuit board according to claim 1 , wherein the insulating layer is a solder mask layer.
3. The circuit board according to claim 1 , wherein each soldering portion corresponds to a respective corner of the cover body.
4. The circuit board according to claim 1 , wherein each soldering portion is a pad.
5. The circuit board according to claim 1 , wherein each soldering portion is provided with a solder material.
6. The circuit board according to claim 1 , wherein each second opening is a rectangular opening.
7. The circuit board according to claim 1 , further comprising a plurality of heat dissipation portions equidistantly spaced on a top surface of the cover body.
8. The circuit board according to claim 7 , wherein each heat dissipation portion is a circular hole.
9. The circuit board according to claim 7 , wherein a pitch of each heat dissipation portion is between the 1λ and the 2λ.
10. A circuit board applied to a communication product, comprising:
a power transistor;
a main body, the power transistor disposed on the main body, the main body including a predetermined covering region where the power transistor is covered;
an insulating layer, disposed on the main body, and having a plurality of first openings disposed at intervals around the predetermined covering region;
a plurality of soldering portions each being exposed from a respective one of the first openings; and
an isolation cover covering the predetermined covering region and the power transistor, a cover body of the isolation cover being soldered to each soldering portion, and a plurality of second openings being equidistantly spaced on a lateral side of the cover body,
a width of each second opening is between 1λ and 2λ, wherein λ=ν/f and
λ is a wavelength of a wave emitted from the communication product,
ν is a speed (m/s) of the wave, and
f is a frequency (Hz) of the wave, a maximum value off being 26.5 GHz.
11. The circuit board according to claim 10 , wherein the insulating layer is a solder mask layer.
12. The circuit board according to claim 10 , wherein each soldering portion is a pad.
13. The circuit board according to claim 10 , wherein each soldering portion is provided with a solder material.