IP Library › Granted Patent US 8,120,089
Granted Patent B2
US 8,120,089 · App. 12/650,076 · Granted Feb 21, 2012

Non-volatile memory device and method for fabricating non-volatile memory device

Assignee: Samsung Electronics Co., Ltd.
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Quick Facts
Patent No.
US 8,120,089
App. No.
12/650,076
Granted
Feb 21, 2012
Kind
B2
Abstract

Provided are nonvolatile memory devices with a three-dimensional structure and methods of fabricating the same. The nonvolatile memory device includes conductive patterns three-dimensionally arranged on a semiconductor substrate, semiconductor patterns that extend from the semiconductor substrate and intersect one-side walls of the conductive patterns, charge storage layers interposed between the semiconductor patterns and one-side walls of the conductive patterns, and seed layer patterns interposed between the charge storage layers and one-side walls of the conductive patterns.

Claims (13)

1. A nonvolatile memory device, comprising:

conductive patterns three-dimensionally arranged on a semiconductor substrate;

semiconductor patterns extending from the semiconductor substrate and intersecting one-side walls of the conductive patterns;

charge storage layers interposed between the semiconductor patterns and one-side walls of the conductive patterns; and

seed layer patterns interposed between the charge storage layers and one-side walls of the conductive patterns.

2. The nonvolatile memory device as set forth in claim 1 , further comprising:

insulating interlayer patterns interposed with the conductive patterns; and

wherein the one-side walls of the conductive patterns and one-side walls of the insulating layer patterns adjacent thereto are disposed on different perpendicular lines.

3. The nonvolatile memory device as set forth in claim 2 , further comprising:

extended portions corresponding to recessed portions of the one-side walls of the conductive patterns disposed between the insulating layer patterns vertically adjacent to each other;

wherein the seed layer patterns are disposed in the extended portions.

4. The nonvolatile memory device as set forth in claim 2 , wherein a distance between the conductive patterns horizontally adjacent to each other is larger than a distance between the insulating layer patterns horizontally adjacent to each other.

5. The nonvolatile memory device as set forth in claim 1 , wherein respective ones of the seed layer patterns adjacent to respective ones of the conductive patterns are isolated from respective ones of the seed layer patterns adjacent to respective other ones of the conductive patterns.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 30, 2009
From: KIM, YOUNG-HOO; KANG, DAEHYUK; KIM, YOUNGOK; BAE, SANG WON; YOON, BOUN; LEE, KUNTACK
To: SAMSUNG ELECTRONICS CO., LTD.
Reel/Frame 023719/0066 →
Priority Claims (1)
KR 10-2009-0004232 · Jan 19, 2009 · national
Continuity (1)
Related Publication 20100181610A1 · Jul 22, 2010