Semiconductor device having trenches extending through channel regions
A semiconductor device includes an n-type semiconductor substrate, an alternating conductivity type layer on semiconductor substrate, the alternating conductivity type layer including n-type drift regions and p-type partition regions arranged alternately, p-type channel regions on the alternating conductivity type layer, and trenches formed from the surfaces of the p-type channel regions down to respective n-type drift regions or both the n-type drift regions and the p-type partition regions. The bottom of each trench is near or over the pn-junction between the p-type partition region and the n-type drift region. The semiconductor device facilitates preventing the on-resistance from increasing, obtaining a higher breakdown voltage, and reducing the variations caused in the characteristics thereof.
1. A semiconductor device comprising:
a semiconductor substrate of a first conductivity type;
an alternating conductivity type layer on the semiconductor substrate, the alternating conductivity type layer comprising first semiconductor regions of the first conductivity type and second semiconductor regions of a second conductivity type arranged alternately;
channel regions of the second conductivity type on the alternating conductivity type layer; and
trenches extending through the channel regions with each of the trenches extending to both the first and second semiconductor regions,
wherein the bottom of the trench is formed over a boundary between the first semiconductor region and the second semiconductor region, and
wherein a widest opening width of the trench is narrower than the width of a pair of first and second semiconductor regions.
2. The semiconductor device according to claim 1 , wherein the opening width of the trench is narrower than one-half the width of the first semiconductor region and the second semiconductor region.
3. The semiconductor according to claim 2 , wherein each of the trenches contacts both the first and second semiconductor regions at the boundary of one pair of adjacent first and second semiconductor regions so that the trenches contact all of the plurality of pairs of adjacent first and second semiconductor regions at the boundary.
4. The semiconductor device according to claim 1 , wherein the deepest part in the bottom of the trench is positioned on the first boundary.