Multilayer ceramic electronic component and method for making the same
A multilayer ceramic electronic component includes external terminal electrodes that are formed by depositing metal plating films on exposed portions of internal conductors embedded in a ceramic body, depositing a copper plating films that cover the metal plating films and make contact with the ceramic body around the metal plating films, and heat-treating the ceramic body to generate a copper liquid phase, an oxygen liquid phase, and a copper solid phase between the copper plating films and the ceramic body. The mixed phase including these phases forms a region at which a copper oxide is present in a discontinuous manner inside the copper plating film at least at the interfaces between the ceramic body and the copper plating films. The copper oxide securely attaches the copper plating films to the ceramic body and enhances the bonding force of the external terminal electrodes.
1. A multilayer ceramic electronic component comprising:
a ceramic body including a plurality of stacked ceramic layers, the ceramic body having a first main surface and a second main surface that faces the first main surface and a plurality of side surfaces that connect the first main surface to the second main surface;
an internal conductor disposed in the ceramic body and having an exposed portion exposed at least one of the plurality of side surfaces of the ceramic body; and
an external terminal electrode disposed on at least one of the plurality of side surfaces of the ceramic body, the external terminal electrode covering the exposed portion of the internal conductor; wherein
the external terminal electrode includes a metal plating film covering the exposed portion of the internal conductor and a copper plating film covering the metal plating film and in contact with the ceramic body; and
a copper oxide is present in a discontinuous manner inside the copper plating film at least at an interface between the copper plating film and the ceramic body.
2. The multilayer ceramic electronic component according to claim 1 , wherein the copper oxide is in contact with the first main surface and the second main surface of the ceramic body.
3. The multilayer ceramic electronic component according to claim 1 , wherein
the external terminal electrode further includes auxiliary conductive layers disposed on the first main surface and the second main surface of the ceramic body;
the copper oxide is present between the metal plating film and the auxiliary conductive layers; and
the copper plating film is arranged to cover the metal plating film, the copper oxide, and the auxiliary conductive layers.
4. The multilayer ceramic electronic component according to claim 1 , wherein the internal conductor includes Ni and the metal plating film includes Ni.
5. The multilayer ceramic electronic component according to claim 1 , wherein the copper oxide is present in bead form.
6. The multilayer ceramic electronic component according to claim 1 , wherein the copper oxide includes Cu 2 O and CuO.
7. The multilayer ceramic electronic component according to claim 6 , wherein the Cu 2 O accounts for at least about 90 percent by weight of the copper oxide.
8. A method for making a multilayer ceramic electronic component, the method comprising:
a step of preparing a ceramic body having a first main surface and a second main surface that faces the first main surface and a plurality of side surfaces that connect the first main surface to the second main surface, the ceramic body including a plurality of stacled ceramic layers and an internal conductor inside the ceramic body, the internal conductor having an exposed portion exposed at least one of the plurality of side surfaces of the ceramic body;
a step of subjecting the ceramic body to a plating treatment to deposit a metal plating film on the exposed portion of the internal conductor;
a step of subjecting the ceramic body to a plating treatment to deposit a copper plating film that covers the metal plating film and makes contact with the plurality of side surfaces of the ceramic body around the metal plating film; and
a step of heat-treating the ceramic body to generate a copper liquid phase, an oxygen liquid phase, and a copper solid phase between the copper plating film and the ceramic body.