Circuit module and radio communications equipment, and method for manufacturing circuit module
An electronic component 3 with a shielding function whose upper surface is held at a reference potential, an electronic component 13 , and a semiconductor component 4 are mounted on a wiring board 2 , and are covered with an insulating resin portion 5 while a conductive layer 6 is formed on an upper surface of the insulating resin portion 5 . The conductive layer 6 is held at the reference potential by being connected to a portion, which is held at the reference potential, of the electronic component 3 with a shielding function exposed from the insulating resin portion 5 . There can be provided a small-sized circuit module superior in an electromagnetic shielding function.
1. A circuit module comprising:
a wiring board;
a plurality of electronic components that are mounted on the wiring board;
a reference potential portion that is provided on an upper surface of at least one of the plurality of electronic components;
an insulating resin portion that covers the plurality of electronic components, excluding the reference potential portion; and
a conductive layer that is connected to the reference potential portion and covers an upper surface of the insulating resin portion,
wherein at least one electronic component having the reference potential portion includes a metal plate fixed to its upper surface, and the conductive layer is connected to the metal plate,
wherein the electronic component having the reference potential portion includes a container, the metal plate fixed to an upper surface of the container, a piezoelectric vibration element contained in the container, and
wherein the metal plate is connected to the ground terminal through wiring of the container.
2. The circuit module according to claim 1 , wherein the height of at least one of the electronic components that is provided with the reference potential portion is more than the respective heights of the other electronic components.
3. The circuit module according to claim 2 , wherein the height of the upper surface of the insulating resin portion and the height of the electronic component having the reference potential portion are equal to each other.
4. The circuit module according to claim 1 , wherein the conductive layer adheres to a side surface of the metal plate, and the height of an upper surface of the conductive layer and the height of the electronic component having the reference potential portion are equal to each other.
5. The circuit module according to claim 1 , wherein the conductive layer is formed of a metal sintered layer formed by heating an organic solvent including metal particles having an average particle diameter of 1 nm to 100 nm.
6. A circuit module comprising:
a wiring board;
a plurality of electronic components that are mounted on the wiring board;
a reference potential portion that is provided on an upper surface of at least one of the plurality of electronic components;
an insulating resin portion that covers the plurality of electronic components, excluding the reference potential portion; and
a conductive layer that is connected to the reference potential portion and covers an upper surface of the insulating resin portion,
wherein at least one of the electronic components that is provided with the reference potential portion is a semiconductor component including a semiconductor board, a through conductor that penetrates the semiconductor board in the thickness direction, and an electrode pad for a reference potential formed on a lower surface of the semiconductor board and electrically connected to the through conductor, and the reference potential portion is a portion, which is led out to an upper surface of the semiconductor board, of the through conductor.
7. The circuit module according to claim 6 , wherein the height of the semiconductor component is more than the respective heights of the other electronic components.
8. The circuit module according to claim 7 , wherein the height of the upper surface of the insulating resin portion and the height of the semiconductor component are equal to each other.
9. The circuit module according to claim 6 , wherein the conductive layer is formed of a metal sintered layer formed by heating an organic solvent including metal particles having an average particle diameter of 1 nm to 100 nm.
10. A circuit module comprising:
a wiring board;
a plurality of electronic components that are mounted on the wiring board;
a reference potential portion that is provided on an upper surface of at least one of the plurality of electronic components;
an insulating resin portion that covers the plurality of electronic components, excluding the reference potential portion; and
a conductive layer that is connected to the reference potential portion and covers an upper surface of the insulating resin portion,
wherein the plurality of electronic components include a first semiconductor component and a second semiconductor component, the insulating resin portion positioned between the first semiconductor component and the second semiconductor component is provided with a groove that separates both the semiconductor components, a shielding member composed of a conductive material is buried in the groove, and the shielding member is electrically connected to the conductive layer.
11. The circuit module according to claim 10 , wherein the first semiconductor component is an RFIC, and the second semiconductor component is a baseband IC.
12. The circuit module according to claim 11 , further comprising an electronic component for RF electrically connected to the RFIC, wherein the electronic component for RF is arranged in one, where the RFIC is disposed, of two regions separated by the shielding member.
13. The circuit module according to claim 11 , wherein a bottom surface of the groove is positioned within the wiring board, and a passive component for RF is contained in the wiring board.
14. The circuit module according to claim 10 , wherein the conductive layer and the shielding member are composed of the same material.