Polishing pad having micro-grooves on the pad surface
A polishing pad is provided herein, which may include a plurality of soluble fibers having a diameter in the range of about 5 to 80 micrometers, and an insoluble component. The pad may also pad include a first surface having a plurality of micro-grooves, wherein the soluble fibers form the micro-grooves in the pad. The micro-grooves may have a width and/or depth up to about 150 micrometers. In addition, a method of forming the polishing pad and a method of polishing a surface with the polishing pad is disclosed.
1. A polishing pad for use with polishing slurry comprising:
a nonwoven fabric including a plurality of soluble fibers having a diameter in the range of 5 to 80 micrometers, wherein said soluble fibers comprise one or more of nonwoven fibrous and fabric structures, woven and knitted fibrous and fabric structures, and
an insoluble component,
wherein said pad has a thickness and includes a first surface having a plurality of interconnected self-generating micro-grooves, wherein said soluble fibers are positioned through at least a portion of the thickness of the pad to continuously dissolve and form said micro-grooves in a newly exposed surface of said pad by exposure to said slurry, said micro-grooves having a width and/or depth in the range up to 150 micrometers, and
wherein said micro-grooves are arranged in an array of longitudinal indentations in said first surface of said pad and retain and distribute said polishing slurry and said self-generating microgrooves are arranged in one of a crisscross, circular, spiral, radial, or centripetal arrays.
2. The polishing pad of claim 1 , further comprising an average distance present between said grooves, wherein said average distance is in the range of 10 to 2000 micrometers.
3. The polishing pad of claim 1 , wherein said insoluble component comprises a polymer component.
4. The polishing pad of claim 1 , wherein the weight percent of said soluble fibers is about 10-90% and the weight percent of said insoluble component is about 90-10%.
5. The polishing pad of claim 1 , wherein said insoluble component includes an insoluble fiber.
6. The polishing pad of claim 5 , wherein said soluble fiber has a first melting temperature Tm 1 and said insoluble fiber has a second melting temperature Tm 2 , wherein Tm 2 <Tm 1 .
7. The polishing pad of claim 5 , wherein said insoluble fiber is a binder fiber.
8. The polishing pad of claim 5 , wherein said insoluble fiber is a bi-component fiber consisting of a first component having a first melting temperature Tc 1 and a second component having a second melting temperature Tc 2 , wherein Tc 1 <Tc 2 .
9. The polishing pad of claim 1 , wherein said pad further comprises a second surface and an adhesive present on said second surface.
10. The polishing pad of claim 1 , further comprising a chemical substance incorporated into said soluble fibers, wherein the chemical substance is selected from the group consisting of surface-active agents, catalysts and pH buffers.
11. The polishing pad of claim 1 wherein the insoluble component comprises an insoluble polymer resin and an insoluble fiber.
12. The polishing pad of claim 1 , wherein said micro-grooves in said pad having a width and/or depth in the range of 5-150 micrometers.
13. A polishing pad for use with polishing slurry comprising:
a nonwoven fabric including a plurality of soluble fibers having a diameter in the range of 5 to 80 micrometers, wherein said soluble fibers comprise one or more of nonwoven fibrous and fabric structures, woven and knitted fibrous and fabric structures, and
an insoluble component comprising an insoluble fiber,
wherein said pad has a thickness and includes a first surface having a plurality of interconnected micro-grooves, wherein said soluble fibers are positioned through at least a portion of the thickness of the pad to continuously dissolve and form said micro-grooves in a newly exposed surface of said pad by exposure to said slurry, said micro-grooves having a width and/or depth in the range up to 150 micrometers wherein said micro-grooves are arranged in an array of longitudinal indentations in said first surface of said pad and retain and distribute said polishing slurry and said self-generating microgrooves are arranged in one of a crisscross, circular, spiral, radial, or centripetal arrays.
14. The polishing pad of claim 13 , wherein said soluble fiber has a first melting temperature Tm 1 and said insoluble fiber has a second melting temperature Tm 2 , wherein Tm 2 <Tm 1 .
15. The polishing pad of claim 13 , wherein said insoluble fiber is a binder fiber.
16. The polishing pad of claim 13 , wherein said insoluble fiber is a bi-component fiber consisting of a first component having a first melting temperature Tc 1 and a second component having a second melting temperature Tc 2 , wherein Tc 1 <Tc 2 .
17. The polishing pad of claim 13 , wherein said soluble fibers are positioned through the entire thickness of the pad.
18. A polishing pad which provides a relatively high surface density of microgrooves upon exposure to aqueous media comprising:
a nonwoven fabric including a plurality of soluble fibers having a diameter in the range of 5 to 80 micrometers, wherein said soluble fibers comprise one or more of nonwoven fibrous and fabric structures, woven and knitted fibrous and fabric structures, and
an insoluble component,
wherein said pad has a thickness and includes a first surface having a plurality of interconnected self-generating micro-grooves, wherein said soluble fibers are positioned through at least a portion of the thickness of the pad to dissolve and form said micro-grooves in a newly exposed surface of said pad by exposure to said aqueous media, said micro-grooves having a width and/or depth in the range up to 150 micrometers, and
wherein said micro-grooves are arranged in an array of longitudinal indentations in said first surface of said pad to retain and distribute a polishing slurry and said self-generating microgrooves are arranged in one of a crisscross, circular, spiral, radial, or centripetal arrays.