Laminated electronic component and method for manufacturing the same
A laminated electronic component is configured to include substrate plating films disposed on outer surfaces of an electronic component main body through direct plating such that external terminal electrodes are connected to exposed portions of internal conductors (internal electrodes), and the average particle diameter of metal particles defining the substrate plating film is at least about 1.0 μm. The external terminal electrode includes at least one layer of an upper plating film disposed on the substrate plating film. The metal particles defining the substrate plating film are Cu particles.
1. A laminated electronic component comprising:
an electronic component main body including a plurality of laminated functional layers;
internal conductors disposed inside the electronic component main body and including exposed portions exposed at outer surfaces of the electronic component main body; and
external terminal electrodes disposed on the outer surfaces of the electronic component main body so as to connect to the internal conductors and to cover the exposed portions of the internal conductors; wherein
the external terminal electrodes include a substrate plating film disposed directly on the outer surfaces of the electronic component main body so as to cover the exposed portions of the internal conductors;
an average particle diameter of metal particles defining the substrate plating film is at least about 1.0 μm; and
the metal particles defining the substrate plating film are Cu particles.
2. The laminated electronic component according to claim 1 , wherein the external terminal electrodes further comprise at least one layer of an upper plating film disposed on the substrate plating film.