Sound-permeable film, electronic component with sound-permeable film, and method of producing circuit board having electronic component mounted thereon
A sound-permeable film ( 11 ) includes: a porous membrane ( 13 ) that contains polytetrafluoroethylene as its main component, allows sound to pass therethrough, and prevents an foreign object such as a water drop from passing therethrough; and a heat-resistant double-sided adhesive sheet ( 15 ) that is disposed on a part of at least one of main surfaces of the porous membrane ( 13 ).
1. A sound-permeable film comprising:
a porous membrane that contains polytetrafluoroethylene as its main component, allows sound to pass therethrough, and prevents a water drop from passing therethrough; and
a heat-resistant double-sided adhesive sheet that is disposed on a part of at least one of main surfaces of the porous membrane in order to fix the porous membrane to another component,
wherein the heat-resistant double-sided adhesive sheet is a resin sheet including a base layer and two adhesive layers that sandwich the base layer therebetween, and
the base layer has a heat shrinkage ratio of less than 4% after being left for 10 minutes at 200° C.
2. The sound-permeable film according to claim 1 ,
wherein the base layer contains a polyimide resin or an aramid resin as its main component.
3. A sound-permeable film comprising:
a porous membrane that contains polytetrafluoroethylene as its main component, allows sound to pass therethrough, and prevents a water drop from passing therethrough;
a heat-resistant double-sided adhesive sheet that is disposed on a part of a first main surface of the porous membrane in order to fix the porous membrane to another component; and
a heat-resistant and sound-permeable support that is disposed on a second main surface of the porous membrane,
wherein the heat-resistant double-sided adhesive sheet is a resin sheet including a base layer and two adhesive layers that sandwich the base layer therebetween, and
the base layer has a heat shrinkage ratio of less than 4% after being left for 10 minutes at 200° C.
4. The sound-permeable film according to claim 3 ,
wherein the base layer contains a polyimide resin or an aramid resin as its main component.
5. An electronic component with a sound-permeable film, comprising:
an electronic component including a sound receiving portion that converts sound into an electrical signal or a sound emitting portion that converts an electrical signal into sound; and
a sound-permeable film that is attached to the electronic component, allows sound to be transmitted from outside to the sound receiving portion or sound emitted from the sound emitting portion to be transmitted outside, and prevents water drop from reaching the sound receiving portion or the sound emitting portion from outside,
wherein the electronic component is a component that is mounted on a circuit board to be operated,
the sound-permeable film includes: a porous membrane that contains polytetrafluoroethylene as its main component; and a heat-resistant double-sided adhesive sheet that is located between the porous membrane and the electronic component so as to fix the porous membrane and the electronic component to each other,
the heat-resistant double-sided adhesive sheet is a resin sheet including a base layer and two adhesive layers that sandwich the base layer therebetween, and
the base layer has a heat shrinkage ratio of less than 4% after being left for 10 minutes at 200° C.
6. A method of producing a circuit board on which an electronic component including a sound receiving portion that converts sound into an electrical signal or a sound emitting portion that converts an electrical signal into sound is mounted, the method comprising:
a first step of fixing or temporarily fixing a porous membrane that contains polytetrafluoroethylene as its main component to the electronic component using a heat-resistant double-sided adhesive sheet so that sound is allowed to be transmitted from outside to the sound receiving portion or sound emitted from the sound emitting portion is allowed to be transmitted outside and that a water drop is prevented from reaching the sound receiving portion or the sound emitting portion from outside; and
a second step of positioning the electronic component to which the porous membrane is fixed or temporarily fixed and the circuit board relatively to each other, and putting the positioned circuit board and electronic component into a reflow furnace so as to connect them by soldering,
wherein the first step and the second step are performed in this order,
the heat-resistant double-sided adhesive sheet is a resin sheet including a base layer and two adhesive layers that sandwich the base layer therebetween, and
the base layer has a heat shrinkage ratio of less than 4% after being left for 10 minutes at 200° C.
7. The method of producing the circuit board on which the electronic component is mounted according to claim 6 ,
wherein the base layer is composed of a polyimide resin or an aramid resin, the adhesive layers are composed of an acrylic or silicone adhesive.
8. The method of producing the circuit board on which the electronic component is mounted according to claim 6 ,
wherein in the second step,
a solder having a lower melting point than a maximum adhesive temperature up to which the adhesive strength of the heat-resistant double-sided adhesive sheet can be maintained is selected as a solder for connecting the circuit board and the electronic component, and
the temperature in the reflow furnace is controlled within a range between the maximum adhesive temperature and the melting point of the solder.