IP Library Granted Patent US 8,148,746
Granted Patent B2
US 8,148,746 · App. 12/443,295 · Granted Apr 3, 2012

Semiconductor light emitting device

Assignee: Rohm Co., Ltd.
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Quick Facts
Patent No.
US 8,148,746
App. No.
12/443,295
Granted
Apr 3, 2012
Kind
B2
Abstract

A semiconductor light emitting device (A 1 ) includes a case ( 1 ) and a plurality of semiconductor light emitting elements ( 3 ) arranged in the case. The case ( 1 ) is formed with a plurality of reflectors ( 11 ) each in the form of a truncated cone surrounding a respective one of the semiconductor light emitting elements ( 3 ). Current is applied to each of the semiconductor light emitting elements ( 3 ) via two wires ( 6 ). Each of the wires ( 6 ) includes a first end, and a second end opposite to the first end. The first end is connected to the semiconductor light emitting element ( 3 ), whereas the second end is located outside the space surrounded by the reflector ( 11 ).

Claims (15)

1. A semiconductor light emitting device comprising:

a plurality of semiconductor light emitting elements arranged on a plane; and

a plurality of reflectors each in form of a truncated cone, each of the reflectors surrounding a respective one of the semiconductor light emitting elements;

wherein each of the reflectors is provided with a shared edge and a non-shared edge,

wherein each of the reflectors is partially in contact with the adjacent reflector at the shared edge,

wherein a height of the shared edge measured using the plane as a reference is lower than that of the non-shared edge, the shared edge being straight as viewed in a direction perpendicular to the plane,

wherein the semiconductor light emitting device further comprises two heat dissipaters spaced from each other so as to sandwich a center of the semiconductor light emitting device, and

wherein each of the heat dissipaters is provided with a first surface on which the semiconductor light emitting elements are mounted and a second surface opposite to the first surface, the second surface being exposed to the outside of the semiconductor light emitting device.

2. The semiconductor light emitting device according to claim 1 , further comprising a resin for wavelength conversion loaded in the spaces surrounded by the reflectors, wherein the resin for wavelength conversion extends over the shared edges of the reflectors.

3. The semiconductor light emitting device according to claim 1 , wherein only a single wire is connected to each of the semiconductor light emitting elements.

4. The semiconductor light emitting device according to claim 1 , further comprising a plurality of wires for applying current to the semiconductor light emitting elements, wherein each of the wires is provided with a first end connected to one of the semiconductor light emitting elements and a second end opposite to the first end, the second end being located outside a space surrounded by the reflector surrounding said one of the semiconductor light emitting elements.

5. The semiconductor light emitting device according to claim 2 , further comprising transparent resin provided on the resin for wavelength conversion.

6. The semiconductor light emitting device according to claim 2 , further comprising transparent lens portions arranged on the resin for wavelength conversion, wherein the transparent lens portions correspond to the semiconductor light emitting elements, respectively.

7. The semiconductor light emitting device according to claim 1 , wherein the semiconductor light emitting elements are arranged on a common circle.

8. The semiconductor light emitting device according to claim 7 , further comprising a common electrode surrounded by the semiconductor light emitting elements.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 27, 2009
From: KOBAYAKAWA, MASAHIKO
To: ROHM CO., LTD.
Reel/Frame 022469/0344 →
Priority Claims (1)
JP 2006-267483 · Sep 29, 2006 · national
Continuity (1)
Related Publication 20100072496A1 · Mar 25, 2010